• Title/Summary/Keyword: pure aluminum

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Analysis of the Solidification Process at a Vertical Wall With Thermal Contact Resistance (접촉열저항이 있는 수직벽에서의 응고과정 해석)

  • 이진호;모정하;황기영
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.19 no.1
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    • pp.193-201
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    • 1995
  • The role of thermal contact resistance between a casting and a metal mold as well as natural convection in the melt during solidification of a pure metal is numerically studied. Numerical simulation is performed for a rectangular cavity using the coordinate transformation by boundary-fitted coordinate and pure aluminum is used as the phase- change material. The influences of thermal contact resistance on the interface shape and position, solidified volume fraction, temperature field and local heat transfer are investigated.

A Study on the Effect of Process Parameters to Mechanical Property in Forward Extrusion of Milli-size Cylindrical Pin (밀리 단위의 원형핀 전방압출에 있어서 공정인자가 기계적 성질에 미치는 영향 연구)

  • 심경섭;김용일;이용신;김종호
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.797-801
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    • 2003
  • The mechanical properties such as shear strength and the hardness of milli-size products that manufactured for various process parameters by forward extrusion using square dies are investigated. Shear strength test is implemented for the observation of relation between vickers hardness and shear strength in the interface of head and shaft part of a stepped pin. When the extrusion ratios of pure aluminum and pure copper billets increase, the hardness on both the surface and the center line of a pin also increase, especially the hardness on the surface is shown to be a little higher than on the center. The existence of knock-out pad in extrusion die caused hardness increase in the interface of a extruded pin. As compared shear strength with hardness of a pin, the approximated linear relations are suggested in this study.

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Measuring Thermal Conductivity of Nanofluids by Steady State Method (정상상태 방법을 이용한 나노유체의 열전도율 측정)

  • Lee, Shin-Pyo
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.30 no.9 s.252
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    • pp.898-904
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    • 2006
  • A new method measuring thermal conductivity of fluids is proposed in this research. It is based on the steady state heat transfer from a hot central cylinder to a cold outer cylinder located concentrically. This method guarantees more stable measurement than conventional THM(transient hot-wire method) due to its simplicity of theoretical principle. Measurements was made for the three nanofluid samples with different particle concentration of pure, 2% and 4%. Nanofluids are made by mixing the pure transformer oil with AlN nano particles. Design of the sensor module and experimental procedures are explained and comparison of the measuring data between present method and THM was made in detail.

Major Factors that Affect Friction and Wear of Metals in Boundary Lubrication (경계윤활 상태에서의 금속재료 마찰 및 마멸에 영향을 미치는 주요인자)

  • 류종관;이홍철;김대은
    • Tribology and Lubricants
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    • v.15 no.2
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    • pp.171-177
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    • 1999
  • Many lubricated systems experience boundary lubrication condition during operation. However, the friction and wear characteristics of boundary lubrication are not clearly understood. In this work the factors which affect the friction and wear between boundary lubricated metallic surfaces are investigated. Experiments were performed using a pin-on-disk type tester with pure aluminum, pure copper, and SM45C steel as the disk material and steel, stainless steel and bearing ball as the ball. The experimental conditions were determined according to the Taguchi experimental method. From the experimental results, the major factors that influence the friction and wear characteristics of boundary lubrication could be identified.

Effects of knock-out Pad and Extrusion Ratio on Mechanical Property Changes in Milli-Forward Extrusion of Cylindrical Pin (원형핀의 밀리 전방압출에서 녹아웃패드와 압출비가 기계적 성질 변화에 미치는 영향)

  • 심경섭;김용일;이용신;김종호
    • Transactions of Materials Processing
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    • v.12 no.6
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    • pp.582-587
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    • 2003
  • This paper is concerned with the mechanical property changes of the milli-size products manufactured by forward extrusion processes with square dies. Experiments are carried out with pure aluminum and pure copper billets. Extrusion ratio and knock-out pad are chosen as the important process parameters affecting the changes of mechanical properties such as shear strength and hardness. Shear strength tests with the extruded milli-size pin have shown the strong relation between victors hardness and shear strength in the neck of a stepped pin. As the extrusion ratio increases, the hardness on both the surface and the center line of a pin also increase. It is also noted that the hardness on the surface is a little higher than that on the center. The existence of knock-out pad in extrusion die causes the hardness in the neck of a extruded pin to increase. Finally, the approximated linear relations between shear strength and hardness of a pin are suggested.

Analysis of Interfacial Layer between Alumina and Silica/Silicon Substrate (알루미나와 실리카/실리콘 기판의 계면 분석)

  • 최일상;김영철;장영철
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2002.05a
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    • pp.252-254
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    • 2002
  • Metal oxides with high dielectric constants have the potential to expend scaling of transistor gate capacitance beyond that of ultrathin silicon dioxide. However, during deposition of most metal oxides on silicon, an interfacial region of SiOx is formed and limits the specific capacitance of the gate structure. We deposisted aluminum oxide and examined the composition of the interfacial layer by employing high-resolution X-ray photoelectron spectroscopy and X-ray reflectivity. We find that the interfacial region is not pure SiO$_2$, but is composed of a complex depth-dependent ternary oxide of $AlSi_xO_y$ and the pure SiO$_2$.

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Deposition properties of $Al_{2}O_{3}$ thin films by LP-MOCVD (LP-MOCVD로 제조한 알루미나 박막의 증착 특성)

  • 김종국;박병옥;조상희
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.6 no.3
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    • pp.309-317
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    • 1996
  • Al2O3 thin films were deposited on Si-wafer (100) using organo-aluminum compounds at low pressure by chemical vapor deposition (CVD) method. The vapor of the organo-metallic precursor was carried by pure N2 gas. The deposition rate increased and then saturated as Tsub increased with increasing the AIP flow rate. The main contamination didn't found in deposited films except carbon. The H-O(H2O) IR absorption band decreased in intensity as the deposition temperature increased, and completely disappeared through annealing.

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Finite element analysis of the structural material by the theory of continuum damage mechanics (연속체 손상역학에 따른 구조재료의 유한요소해석)

  • 김승조;김위대
    • Journal of the korean Society of Automotive Engineers
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    • v.13 no.3
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    • pp.58-67
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    • 1991
  • A theory of continuum damage mechanics based on the theory of materials of type N was developed and its nonlinear finite element approximation and numerical simulation was carried out. To solve the finite elastoplasticity problems, reasonable kinematics of large deformed solids was introduced and constitutive relations based on the theory of materials of type-N were derived. These highly nonlinear equations were reduced to the incremental weak formulation and approximated by the theory of nonlinear finite element method. Two types of problems, compression moulding problem and pure bending problem, were solved for aluminum 2024.

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A Study on the Adhesion Property of Al-Cr Alloy Films by Evaporation (진공증착법으로 제조된 Al-Cr 박막의 밀착성에 관한 연구)

  • 주봉환;이규환;권식칠;백운승;임수근
    • Journal of Surface Science and Engineering
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    • v.27 no.1
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    • pp.19-28
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    • 1994
  • A study on adhesion property of evaporated Al-Cr films was conducted on steel sheet by using two-source evaporator. Adhesion of Al-Cr coated steel was evaluated by tape test after $180^{\circ}$bending. Adhesion was decreased with increasing the Cr content in Al-Cr films. It was thought that the decrease in adhesion with increasing Cr content be related to insufficient wetting and diffusion of Cr atoms in the film. Best adhesion was achieved in the case of pure aluminum film..

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Synthesis and luminescence characteristics of nano-sized YAG : Ce phosphors by homogeneous precipitation method (Homogeneous precipitation method를 통한 나노 YAG : Ce 형광체 합성과 광학 특성)

  • Lee, Chul Woo;Kwon, Seok Bin;Ji, Eun Kyung;Song, Young Hyun;Jeong, Byung Woo;Kim, Eun Young;Jung, Mong Kwon;Yoon, Dae-Ho
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.27 no.1
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    • pp.18-21
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    • 2017
  • In this study, spherical monodispersed cerium-doped yttrium aluminum garnet (YAG : $Ce^{3+}$) phosphor particles were synthesized via homogeneous precipitation method using the mixed solution of yttrium nitrate, cerium nitrate, aluminum nitrate, ammonium aluminum sulfate, and urea as a precipitant. During the process of precursors of monodispersed YAG : $Ce^{3+}$, aluminum ions which form spherical aluminum compounds precipitated first and yttrium compounds precipitated onto the surface of the existing spherical aluminum compounds. Drying process using lyophilization could obtain monodispered spherical YAG : $Ce^{3+}$ particles compare to using oven. The thermal calcination process of YAG : $Ce^{3+}$ precursors under the temperature of $1200^{\circ}C$ for 6 h was enough to obtain 400~500 nm sized YAG particles with pure YAG phase.