Analyses of Fracture Parameters and Prediction of Crack Propagation Path on Delamination in the LSI Package (반도체 패키지의 층간박리 파괴역학인자 해석 및 균열진전경로 예측)
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- Journal of the Korean Society of Manufacturing Technology Engineers
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- v.18 no.4
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- pp.401-409
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- 2009