Oxide Thickness Measurement of CMP Test Wafer by Dispersive White-light Interferometry
(분산형 백색광 간섭계를 이용한 CMP 테스트 웨이퍼의 $SiO_2$ 두께 측정)
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- Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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- 2007.06a
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- pp.86-87
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- 2007