• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.5 no.2
• /
• pp.128-131
• /
• 2004

In this study Bosch etching process repeating etch and deposition by STS-ICP ASEHR was evaluated. Fundamentally etch depth changes were affected by thickness of deposited PR, $SiO_2$ and depth, and pattern size on the substrate. However etch rates were observed to be changed by variable parameters such as platen power, coil power, and process pressure. Etch rate showed $1.2\mu{m}/min$ and sidewall profile showed $90\pm0.2^\circ$ with platen power 12W, coil power 500W, and etch/passivation cycle 6/7sec. It was confirmed that this result was very typical to Bosch process utilizing ICP.

• Journal of the Semiconductor & Display Technology
• /
• v.23 no.2
• /
• pp.87-91
• /
• 2024

SiO₂, renowned for its excellent insulating properties, has been used in the semiconductor industry as a valuable dielectric material. High-quality SiO₂ films find applications in gate spacers and interlayer insulation gap-fill oxides, among other uses. One of the prevalent methods for depositing these SiO₂ films is plasma enhanced chemical vapor deposition (PECVD) favored for its relatively low processing costs and ability to operate at low temperatures. However, compared to the increasingly utilized atomic layer deposition (ALD) method, PECVD exhibits inferior film characteristics such as uniformity. This study aims to produce SiO₂ films with uniformity as close as possible to those achieved by ALD through the adjustment of PECVD process parameters. we conducted a total of nine PECVD processes, varying the process time and gas flow rates, which were identified as the most influential factors on the PECVD process. Furthermore, ellipsometry analysis was employed to examine the uniformity variations of each process. The experimental results enabled us to elucidate the relationship between uniformity and deposition rate, as well as the impact of gas flow rate and deposition time on the process outcomes. Additionally, thickness measurements obtained through ellipsometer facilitate the identification of optimal process parameters for PECVD.

• 전기의세계
• /
• v.17 no.1
• /
• pp.48-50
• /
• 1968

The convergence rate of Bayes' learning process is investigated for a binomial random variable. A measure of the rate of convergence is proposed and it is found that such a measure can be approximated by an exponential function of the number of observations.

• Journal of Environmental Science International
• /
• v.25 no.2
• /
• pp.231-238
• /
• 2016

In this study, we have investigated to find optimal pre-treatment flocculation condition by analyzing the floc growth rate with mixing conditions and the membrane permeation flux for pre-treatment step of the membrane process. The higher mixing intensity showed a constant floc size index (FSI) values, and lower mixing intensity increased the degree of dispersion of the FSI values. Results of comparing the distribution characteristics of the FSI value and the permeation flux were more effective in increasing flux when the FSI values were 0.2 or higher. The degree of dispersion of FSI was relatively large in 40 rpm mixing condition compared to 120 rpm. In 40 rpm mixing condition, it decreased the permeation flux compared to 120 rpm because various sizes of flocs were distributed. Coagulation-UF membrane process enhanced 30%~40% of the flux rate compare to UF alone process, and the coagulation-MF process increased up to 5% of the flux rate compare to MF alone process. Pre-treatment, that is, coagulation process, has been found to be less effects on relatively larger pore size for MF membrane. For UF membrane, the flux was a little bit same when applying only the rapid mixing process or rapid mixing with slow mixing processes together. In case of MF membrane, the flux was improved when rapid mixing process applied with slow mixing process together.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.04b
• /
• pp.34-37
• /
• 2004

Recently advancing mobile communication tools and I.T industry, semiconductor device is requested more integrated, faster operation time and more scaled-down. Because of these reasons semiconductor device is requested multilayer interconnection. For the multilayer interconnection chemical mechanical polishing (CMP) becomes one of the most useful process in semiconductor manufacturing process. In this experiment, we focus on understand the characterize and improve the CMP technology by control of slurry flow rate. Consequently, we obtain that optimal flow rate of slurry is 170ml/min, since optimal conditions are less chemical flow and performance high with good selectivity to Ta. If we apply this results to copper CMP process. it is thought that we will be able to obtain better yield.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
• /
• v.14 no.6
• /
• pp.503-511
• /
• 2002

Heat flow characteristics during hot water extraction process was studied experimentally. Data were taken at various outlet port type for the fixed inlet port type, inlet-outlet temperature differences and mass flow rates. In this study, the temperature distribution in a storage tank and an outlet temperature were measured to predict a degree of stratification in the storage tank, and a useful rate of hot water was analysed with respect to the variables dominating a extraction process. Experimental results show that the degree of stratification and useful rate of hot water are all high in a low flow rate in case of using modified distributor I (MDI) as the outlet port type.

• Journal of Korean Institute of Industrial Engineers
• /
• v.26 no.4
• /
• pp.376-383
• /
• 2000

A flexible disk grinding process model has been implemented with varying disk orientation with respect to workpiece surface along with variable feed rate. Before implementing arbitrary disk orientation and translation, disk angle and feed rate variation have been implemented. The disk angle was changed with constant angular velocity only in the entrance stage. The effect of the variable feed rate was added to the geometric schematic. The feed rate was changed either from the entrance stage or from the between edges stage and process performance was evaluated. Effect of changing both angle end feed rate has been also analyzed. Disk trend showing actual disk deflection has also been visualized.

• Journal of Korean Society of Water and Wastewater
• /
• v.33 no.1
• /
• pp.55-62
• /
• 2019

The respirometric technique has been used to analyze the nitrification process in a sequencing batch reactor(SBR) treating municipal wastewater. Especially the profile of the respiration rate very well expressed the reaction characteristics of nitrification. As the nitrification process required a significant amount of oxygen for nitrogen oxidation, the respiration rate due to nitrification was high. The maximum nitrification respiration rate, which was about $50mg\;O_2/L{\cdot}h$ under the period of sufficient nitrification, was related directly to the nitrification reaction rate and showed the nitrifiers activity. The growth rate of nitrifiers is the most critical parameter in the design of the biological nutrient removal systems. On the basis of nitrification kinetics, the maximum specific growth rate of nitrifiers in the SBR was estimated as $0.91d^{-1}$ at $20^{\circ}C$, and the active biomass of nitrifiers was calculated as 23 mg VSS/L and it was about 2% of total biomass.

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.11 no.4
• /
• pp.44-53
• /
• 2002

Injection molding process factors such as molding temperature, injection pressure, flow rate and flow velocity, must be controlled properly in filling and packing phases in the injection molding process. In this study, effects of these factors on the injection molding were investigated through the flow analysis for the filling and packing phases. Molding troubles like flow mark weld line, sink ma가 short shot and warpage car be caused by these injection molding process factors. Among them the short shot was caused by the fact that the packing pressure could not reach properly to the filling end part in the packing phase and hence the flow rate could not be supplied to the full. In addition as the flow rate for the volumetric shrinkage during the f개zen phase could not be supplied Properly by the packing pressure, the short shot appeared. Here, the volumetric shrinkage reduced with increasing the packing pressure and also the warpage of molded part increased with increasing the packing Pressure.

• Proceedings of the KSME Conference
• /
• 2001.11a
• /
• pp.853-858
• /
• 2001

Generally, mixed materials of LDPE, EVA and foaming agent are manufactured by crosslinking foaming or chemical foaming process. Above materials were used in a microcellular foaming injection molding process. Influence of each factor such as injection type, temperature of barrel, rate of mixed materials and contents of foaming agent was estimated by DOE(Design of Experiments). As a result of experiments, injection type and rate of LDPE, EVA have an influence on foaming rate. This data can be used in field of application of LDPE and EVA.