• Title/Summary/Keyword: process monitoring

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The Cutting Process Monitoring of Micro Machine using Multi Sensor (멀티센서를 이용한 마이크로 절삭 공정 모니터링)

  • Shin, B.C.;Ha, S.J.;Kang, M.H.;Heo, Y.M.;Yoon, G.S.;Cho, M.W.
    • Transactions of Materials Processing
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    • v.18 no.2
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    • pp.144-149
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    • 2009
  • Recently, the monitoring technology of machining process is very important to improve productivity and quality in manufacturing filed. Such monitoring technology has been performed to measurement using vibration signal, acoustic emission signal and tool dynamometer. However, micro machining is limited small-scale parts machining because micro tool is very small and weakness to generate signal in micro machining process. Therefore, this study has efficient sensing technology for real monitoring system in micro machine that is proposed to supplement a disadvantage of single-sensor by multi sensor. From experimental result, it was evaluated tool wear and cutting situation according to repetitive slot cutting condition and changing cutting condition, and it was performed monitoring spindle rpm and condition according to compare acceleration signal with current signal.

Multipoint Process Monitoring System Based on a Near Infrared Ray(NIR) Acousto-Optic Tunable Filter(AOTF)

  • You, Jang-Woo;Kim, Daesuk;Kim, Soohyun;Kong, Hong-Jin;Lee, Yunwoo;Kwak, Yoon-Keun
    • 제어로봇시스템학회:학술대회논문집
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    • 2001.10a
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    • pp.105.4-105
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    • 2001
  • This paper describes a newly designed multipoint process monitoring system based on a NIR acousto-optic tunable filter. The NIR multipoint process monitoring system consists of a NIR AOTF device for wavelength selection, an InGaAs array sensor, and a specially designed iin-line type of optical fiber probe. Unlike a FTS(Fourier Transform Spectrometry) or grating based monitoring system, an AOTF has no moving parts, and it can be rapidly tuned to any wavelength in its operating range within microseconds. Thus, the AOTF is advantageous in terms of faster spectral imaging capability and rigidity required for industrial monitoring environment. In the current feasibility evaluation, an enhanced optical fiber probe with 3 monitoring points was used. However, ...

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IEC61850 Process Bus Based Distributed Power Quality Monitoring (IEC61850 프로세서 버스 기반 분산형 전력품질감시)

  • Park, Jong-Chan;Kim, Byung-Jin
    • The Transactions of the Korean Institute of Electrical Engineers P
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    • v.56 no.1
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    • pp.13-18
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    • 2007
  • In this paper, authors deal with an application of power quality monitoring using the Sampled Value which is described in the IEC61850 International Standard for substation communication. Firstly, while Merging Unit is designed as a process level device transmitting sensor data, the practical problems such as time delay compensation and optical fiber communication are issued. Secondly, the Sampled Value message which is proper to a power quality monitoring system is presented. Because the power quality monitoring system requests non time critical service comparing to protection and control applications, the Sampled Value service message structure is introduced to improve efficiency. At last, the power quality monitoring server having various power quality analysis functions is suggested to verify the performance of Merging Unit. With the diverse experiments, it is proved that the process bus distributed solution is flexible and economic for the power quality monitoring.

Development of Web-based Monitoring System for Monitoring Mold Manufacturing Process (금형 가공 공정 모니터링을 위한 웹 기반 모니터링 시스템 개발)

  • Shin B. C.;Choi J. H.;Shin K. H.;Yoon G. S.;Cho M. W.;Kim G. H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2005.09a
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    • pp.121-125
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    • 2005
  • In this paper, the web-based monitoring system is developed for the process monitoring of mold manufacturing. The cutting force is measured by hall-sensors which is low cost and useful to be installed in machine tool indirectly. Specially, the current of main spindle in machine tool is converted into cutting force by various experiments. For effective emote monitoring, the interface that is able to offer the information of current process and cutting signal to client is establish.

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A Study on the Monitoring System of the Grinding Troubles Utilizing Neural Networks(l) (신경회로망을 이용한 연삭가공의 트러블 인식에 관한 연구(I))

  • Ha, M.K.;Kwak, J.S.;Song, J.B.;Kim, G.H.;Kim, H.S.
    • Journal of the Korean Society for Precision Engineering
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    • v.13 no.9
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    • pp.149-155
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    • 1996
  • Recent researches in the trouble monitoring system of grinding process have emphasized the use of deep knowledge. Such works include the monitoring and diagnostic systems for cylindrical grinding using sensors on chatter vibration and grinding burn during the process. But, since grinding operations are especially related with a lalrge amount of ambique parameters, it is effectively difficult to detect the grinding troubles occuring during the grinding process. In this paper, monitoring system for grinding utilizes the neural networks based on grinding power signatures. The monitoring system of grinding operations, which makes use of PDP neural networks, is presented. Then, the implementation results by computer simulations and experimental data with respect to chatter vibration and grinding burn are compared.

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Monitoring of Machining State in Turning by Means of Information and Feed Motor Current (NC 정보와 이송축 모터 전류를 이용한 선삭 가공 상태 감시)

  • 안중환;김화영
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.16 no.1
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    • pp.156-161
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    • 1992
  • In this research a monitoring system for turning using NC information and the current of feed motor as a monitoring signal was developed. The overall system consists of modules such as learning process, NC data transmission, generation of forecast information, signal acquisition, monitoring and post process. In the learning process, the reference data and the cutting force equation necessary for monitoring are obtained from the accumulated monitoring results. In the generation of forecast information, the information of forecasted cutting forces is acquired from the cutting force equation and NC program and appended to each NC block as a monitor code. Reliability of monitoring is improved by using the monitor code in the real-time monitoring. Monitoring module is divided into two parts : the off-line monitoring where errors of NC program are checked and the on-line monitoring where the level of motor current is monitored during cutting operations. If the actual current level exceeds the limit value provided by the monitor code in the level monitoring, it is recognized as abnormal. In the event of abnormal status, the post processor sends the emergency stop signal to NC controller to stop the operation. Actual experiments have shown that the developed monitoring system works well.

Development of Multiple CMP Monitoring System for Consumable Designs

  • Park, Sun-Joon;Park, Boum-Young;Kim, Sung-Ryul;Jeong, Hae-Do;Kim, Hyoung-Jae
    • Transactions on Electrical and Electronic Materials
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    • v.8 no.1
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    • pp.11-14
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    • 2007
  • Consumables used in Chemical Mechanical Polishing (CMP) have been played important role to improve quality and productivity. Since the properties of consumables constantly change with various reasons, such as shelf time, manufactured time, lot to lot variation from supplier and so on, CMP results are not constant during the process. Also, CMP process results are affected by multiple sources from wafer, conditioner, pad and slurry. Therefore, multiple sensing systems are required to monitor CMP process variation. In this paper, the authors focus on development of monitoring system for CMP process which consist of force, temperature and displacement sensor to measure the signal from CMP process. With monitoring systems mentioned above, complex CMP phenomena can be investigated more clearly.

A Study on the Monitoring of the Micro Grooving using the AE Technology (AE 기술을 이용한 미세 홈 가공의 모니터링에 관한 연구)

  • Kim, Nam-Hun;Lee, Eun-Sang;Lee, Deug-Woo;Kim, Nam-Kyung;Kwak, Choi-Hun
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.2 no.3
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    • pp.34-40
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    • 2003
  • This paper describes evaluation and monitoring methods of machining characteristics for developed micro grooving machine. Experiments were conducted under various process conditions such as spindle revolution speed, feed rates and depth of groove V and U shape of blade and STD11 were used in this experiment. The status of grooving was evaluated through analysis of the Acoustic emission (AE) signal resulted in each process condition. Based on the analysis, this paper examined the possibility of monitoring adapting fuzzy logic. In conclusion, this paper presented the possibility of monitoring in process adapting AE technology and appropriate micro grooving condition.

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Investigation of acoustic monitoring on laser shock cleaning process (레이저 충격파 클리닝 공정에서 음향 모니터링에 관한 연구)

  • 김태훈;이종명;조성호;김도훈
    • Laser Solutions
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    • v.6 no.2
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    • pp.27-33
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    • 2003
  • A laser shock cleaning technology is a new dry cleaning methodology for the effective removal of small particles from the surface. This technique uses a plasma shock wave produced by a breakdown of air due to an intense laser pulse. In order to optimize the laser shock cleaning process, it needs to evaluate the cleaning performance quantitatively by using a monitoring technique. In this paper, an acoustic monitoring technique was attempted to investigate the laser shock cleaning process with an aim to optimize the cleaning process. A wide-band microphone with high sensitivity was utilized to detect acoustic signals during the cleaning process. It was found that the intensity of the shock wave was strongly dependent on the power density of laser beam and the gas species at the laser beam focus. As a power density was larger, the shock wave became stronger. It was also seen that the shock wave became stronger in the case of Ar gas compared with air and N$_2$ gas.

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A Study of Strategy for Planning of Rework in Semiconductor Monitoring Burn-in Test Process (반도체 MBT 공정의 Rework 제품 투입결정에 관한 연구)

  • Lee, Do-Hoon;Ko, Hyo-Heon;Kim, Sung-Shick
    • IE interfaces
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    • v.18 no.3
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    • pp.350-360
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    • 2005
  • This paper considers a strategy for planning of rework in semiconductor monitoring burn-in test process. The equipment error in monitoring burn-in test process generates many defects. These defects are transformed into good products by rework process, i.e. retest. Rework has the advantage of saving production costs. But rework increases holding costs and incurs rework costs. In monitoring burn-in test process, rework depends on operator's experience with no pre-defined specification. In practice, a number of rework activities are performed with respect to the product importance and inventory quantity. Moreover, disregard for order jobs schedule have caused due date penalties. So a strategy for planning of rework by which order jobs schedule are not affected is suggested. Futhermore, production costs, rework costs and inventory costs for planning of rework are considered.