Formation of high uniformity solder bump for wafer level package by tilted electrode ring (경사진 전극링에 의한 웨이퍼레벨패키지용 고균일도의 솔더범프 형성)
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- Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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- 2003.07a
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- pp.366-369
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- 2003