• 마이크로전자및패키징학회지
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• 제16권3호
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• pp.45-51
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• 2009

본 연구에서는 습식 방법으로 진행 되는 BGA 현상 공정에 있어 기존의 수평 장비를 대체하여 수직 장비를 개발하였다. 지그를 이용하여 기판을 수직 방향으로 고정한 후 습식 공정을 진행함으로써 기존 수평 장비의 단점인 롤러와 기판 표면 회로 패턴의 충돌로 인한 회로 패턴 손상 문제를 원천적으로 제거하고자 하였다. 개발된 수직 장비의 공정 특성을 수평 장비와 비교 평가 하기 위하여 유니포미터 측정, 회로 패턴 손상 평가 및 불량 평가의 실험을 수행하였다. 평가 결과 수직 장비의 유니포미티 특성은 수평 장비와 동일한 수준이며 중력 방향의 액흐름에 대한 공정 특성 영향은 미미한 것으로 확인 되었다. 또한, 수평 장비 대비 $3{\sim}4{\mu}m$ 더 미세한 회로 패턴에 대해여 손상 없이 공정을 진행 할 수 있음을 확인 할 수 있었다.

• Journal of Information Processing Systems
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• 제16권6호
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• pp.1271-1280
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• 2020

The yield and quality of a micromanufacturing process are important management factors. In real-world situations, it is difficult to achieve a high yield from a manufacturing process because the products are produced through multiple nanoscale manufacturing processes. Therefore, it is necessary to identify the processes and equipment that lead to low yields. This paper proposes an analytical method to identify the processes and equipment that cause a defect in the plastic ball grid array (PBGA) during the manufacturing process using logistic regression and stepwise variable selection. The proposed method was tested with the lot trace records of a real work site. The records included the sequence of equipment that the lot had passed through and the number of faults of each type in the lot. We demonstrated that the test results reflect the real situation in a PBGA manufacturing process, and the major equipment parameters were then controlled to confirm the improvement in yield; the yield improved by approximately 20%.

• 디지털산업정보학회논문지
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• 제9권1호
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• pp.79-86
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• 2013

In this paper which it is relating to the DSRC system based road side equipment, we propose the protocol stack architecture of road side equipment and the process structure of the main RM, L7 and LLC layers which is road side equipment device as well. And also we design the signal flow and data-transfer process as well between road side equipment and on board equipment to describe the installation process between road side equipment and von board equipment based on DSRC system. Thus, it is possible to provide various application services between intelligent transportation systems of road side equipment and local server, as well as it enables the local server managing the memorys of on board equipment which entry in service area thru the road side equipment.

• 한국도로학회논문집
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• 제14권5호
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• pp.157-164
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• 2012

PURPOSES: Regional offices of the Ministry of Land, Transport and Maritime Affairs use a computerized system called KAMIS so as to manage road equipment systematically. Road agencies can record number of operating days by equipment, actual working hours, accumulated operating hours (or distance) by equipment, and operating cost. However, KAMIS does not provide critical information, although it is strongly related to efficient road management equipment operation. In other words, road agencies do not know whether they have sufficient equipment to handle their actual work. METHODS: Therefore, this study suggests a methodology to evaluate for operational efficiency of road management equipment using analytical hierarchy process(AHP). First of all, estimated weights related criteria can be produced by AHP, and then use operational history by pieces of equipment. RESULTS: Results show that importance of management work can differ from weather conditions through five areas. CONCLUSIONS: Commonly, this results can imply to help save money for the purchase and maintenance of road management equipment, and they would improve the functional performance of KAMIS.

• 반도체디스플레이기술학회지
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• 제7권2호
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• pp.39-43
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• 2008

Productivity is one of the performance indices of the semiconductor equipment in manufacturing viewpoint. Among many ways tried and adopted for improvement of the productivity of the FAB equipment, variation of equipment configuration was considered and its effect on the throughput was analyzed. Parallel machine cycle charts that were generated based on the equipment log were used in the analysis. Efficiency of the equipment due to change of the structure and the probability of the usage in the manufacturing process were examined. The results showed that the modification of the control algorithm in the equipment and the redistribution of the process time for each process and transfer module along to the change in the structure enhance the throughput of the equipment.

• 반도체디스플레이기술학회지
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• 제21권4호
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• pp.168-173
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• 2022

As the function of a product is advanced and the process is refined, the yield in the fine manufacturing process becomes an important variable that determines the cost and quality of the product. Since a fine manufacturing process generally produces a product through many steps, it is difficult to find which process or equipment has a defect, and thus it is practically difficult to ensure a high yield. This paper presents the system architecture of how to build a smart manufacturing system to analyze the big data of the manufacturing plant, and the equipment factor analysis methodology to increase the yield of products in the smart manufacturing system. In order to improve the yield of the product, it is necessary to analyze the defect factor that causes the low yield among the numerous factors of the equipment, and find and manage the equipment factor that affects the defect factor. This study analyzed the key factors of abnormal equipment that affect the yield of products in the manufacturing process using the data mining technique. Eventually, a methodology for finding key factors of abnormal equipment that directly affect the yield of products in smart manufacturing systems is presented. The methodology presented in this study was applied to the actual manufacturing plant to confirm the effect of key factors of important facilities on yield.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2004년도 ICCAS
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• pp.363-366
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• 2004

KAERI is developing the Advanced Spent Fuel Conditioning Process (ACP) as a pre-disposal treatment process for spent fuel. In this process, the management process must operate in intense radiation fields as well as in a high temperature. Therefore, remote maintenance has played a significant role in this process. Hence suitable remote handling and maintenance technology needs to be developed along with the design of the process concepts. To do this, we developed the digital mockup for the ACP. The digital mockup provides the capability of verifying the remote operability of the process without fabrication of the process equipment. In other words, by applying virtual reality to the remote maintenance operation, a remote operation task can be simulated in the digital mockup. Through utilizing this graphic simulation in this digital mockup, general guidelines can be established for designing equipment intended for remote handling and maintenance. Also, the designer of the equipment that must be remotely maintained should ensure that there is adequate access to the process equipment. The graphic simulator will substantially reduce the cost of the develo363pment of the remote handling and maintenance procedure as well as the process equipment.

• 한국기계가공학회지
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• 제11권3호
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• pp.182-186
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• 2012

This paper aims to analyze the vibration characteristics of the test equipment that inspects any defects in manufactured semiconductor chips and classifies defective chips. This type of equipment should be robust against any vibrations because such vibrations can cause disruption in the process that requires higher precision. 3D model of the structure of the equipment has been used to configure vibration simulation model. Model analysis have been carried out to analyze which part of the equipment is weak against vibration. To minimize the vibration effect of the equipment, the thickness of the plate consist of the equipment and weights are modified. The results show that thicker plate and higher weight in the equipment can decrease vibration effect.

• 반도체디스플레이기술학회지
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• 제8권2호
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• pp.15-21
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• 2009

Atmospheric pressure plasma equipment was successfully applied to the flip chip BGA manufacturing process to improve the uniformity of flux printing process. The problem was characterized as shrinkage of the printed flux layer due to insufficient surface energy of the flip chip BGA substrate. To improve the hydrophilic characteristics of the flip chip BGA substrate, remote DBD type atmospheric pressure plasma equipment was developed and adapted to the flux print process. The equipment enhanced the surface energy of the substrate to reasonable level and made the flux be distributed over the entire flip chip BGA substrate uniformly. This research was the first adaptation of the atmospheric pressure plasma equipment to the flip chip BGA manufacturing process and a lot of possible applications are supposed to be extended to other PCB manufacturing processes such as organic cleaning, etc.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 추계학술대회논문집
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• pp.103-106
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• 2004

The new rheology fabrication process has been developed to rheo die casting and rheo forming process. Thixoforming process has disadvantages in terms of induction reheating process, scrap recycling, loss of raw material and cycle time. Therefore, to reduce the number of process, new rheology fabrication process with specially designed the rotational barrel type equipment has been proposed to apply in various part productions. The barrel type equipment, which could continuously fabricate the rheology materil, was specially designed to have a function to control cooling rate, shear rate and temperature. During the continuous rotation of barrel with a constant temperature, the shear rate is controlled with the rotation speed. The barrel surface has both the induction heating system and the cooling system to control the temperature of molten metal. By using this system, the effect of the rotation speed and the rotation time on the microstructure was widely examined. The possibility for the rheoforming process was investigated with microstructural characteristic.