• Title/Summary/Keyword: process control techniques

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Application of Pulsed Plasmas for Nanoscale Etching of Semiconductor Devices : A Review (나노 반도체 소자를 위한 펄스 플라즈마 식각 기술)

  • Yang, Kyung Chae;Park, Sung Woo;Shin, Tae Ho;Yeom, Geun Young
    • Journal of Surface Science and Engineering
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    • v.48 no.6
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    • pp.360-370
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    • 2015
  • As the size of the semiconductor devices shrinks to nanometer scale, the importance of plasma etching process to the fabrication of nanometer scale semiconductor devices is increasing further and further. But for the nanoscale devices, conventional plasma etching technique is extremely difficult to meet the requirement of the device fabrication, therefore, other etching techniques such as use of multi frequency plasma, source/bias/gas pulsing, etc. are investigated to meet the etching target. Until today, various pulsing techniques including pulsed plasma source and/or pulse-biased plasma etching have been tested on various materials. In this review, the experimental/theoretical studies of pulsed plasmas during the nanoscale plasma etching on etch profile, etch selectivity, uniformity, etc. have been summarized. Especially, the researches of pulsed plasma on the etching of silicon, $SiO_2$, and magnetic materials in the semiconductor industry for further device scaling have been discussed. Those results demonstrated the importance of pulse plasma on the pattern control for achieving the best performance. Although some of the pulsing mechanism is not well established, it is believed that this review will give a certain understanding on the pulsed plasma techniques.

Machine Learning-based landslide susceptibility mapping - Inje area, South Korea

  • Chanul Choi;Le Xuan Hien;Seongcheon Kwon;Giha Lee
    • Proceedings of the Korea Water Resources Association Conference
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    • 2023.05a
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    • pp.248-248
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    • 2023
  • In recent years, the number of landslides in Korea has been increasing due to extreme weather events such as localized heavy rainfall and typhoons. Landslides often occur with debris flows, land subsidence, and earthquakes. They cause significant damage to life and property. 64% of Korea's land area is made up of mountains, the government wanted to predict landslides to reduce damage. In response, the Korea Forest Service has established a 'Landslide Information System' to predict the likelihood of landslides. This system selects a total of 13 landslide factors based on past landslide events. Using the LR technique (Logistic Regression) to predict the possibility of a landslide occurrence and the accuracy is known to be 0.75. However, most of the data used for learning in the current system is on landslides that occurred from 2005 to 2011, and it does not reflect recent typhoons or heavy rain. Therefore, in this study, we will apply a total of six machine learning techniques (KNN, LR, SVM, XGB, RF, GNB) to predict the occurrence of landslides based on the data of Inje, Gangwon-do, which was recently produced by the National Institute of Forest. To predict the occurrence of landslides, it is necessary to process converting landslide events and factors data into a suitable form for machine learning techniques through ArcGIS and Python. In addition, there is a large difference in the number of data between areas where landslides occurred or not. Therefore, the prediction was performed after correcting the unbalanced data using Tomek Links and Near Miss techniques. Moreover, to control unbalanced data, a model that reflects soil properties will use to remove absolute safe areas.

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Interface Control to get Higher Efficiency in a-Si:H Solar Cell

  • Han, Seung-Hee;Kim, En-Kyeom;Park, Won-Woong;Moon, Sun-Woo;Kim, Kyung-Hun;Kim, Sung-Min
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.193-193
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    • 2012
  • In thin film silicon solar cells, p-i-n structure is adopted instead of p/n junction structure as in wafer-based Si solar cells. PECVD is the most widely used thin film deposition process for a-Si:H or ${\mu}c$-Si:H solar cells. Single-chamber PECVD system for a-Si:H solar cell manufacturing has the advantage of lower initial investment and maintenance cost for the equipment. However, in single-chamber PECVD system, doped and intrinsic layers are deposited in one plasma chamber, which inevitably impedes sharp dopant profiles at the interfaces due to the contamination from previous deposition process. The cross-contamination between layers is a serious drawback of single-chamber PECVD system. In this study, a new plasma process to solve the cross-contamination problem in a single-chamber PECVD system was suggested. In order to remove the deposited B inside of the plasma chamber during p-layer deposition, a high RF power was applied right after p-layer deposition with SiH4 gas off, which is then followed by i-layer, n-layer, and Ag top-electrode deposition without vacuum break. In addition to the p-i interface control, various interface control techniques such as FTO-glass pre-annealing in O2 environment to further reduce sheet resistance of FTO-glass, thin layer of TiO2 deposition to prevent H2 plasma reduction of FTO layer, and hydrogen plasma treatment prior to n-layer deposition, etc. were developed. The best initial solar cell efficiency using single-chamber PECVD system of 10.5% for test cell area of 0.2 $cm^2$ could be achieved by adopting various interface control methods.

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Pulse TIG welding: Process, Automation and Control

  • Baghel, P.K.;Nagesh, D.S.
    • Journal of Welding and Joining
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    • v.35 no.1
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    • pp.43-48
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    • 2017
  • Pulse TIG (Tungsten Inert Gas) welding is often considered the most difficult of all the welding processes commonly used in industry. Because the welder must maintain a short arc length, great care and skill are required to prevent contact between the electrode and the workpiece. Pulse TIG welding is most commonly used to weld thin sections of stainless steel, non-ferrous metals such as aluminum, magnesium and copper alloys. It is significantly slower than most other welding techniques and comparatively more complex and difficult to master as it requires greater welder dexterity than MIG or stick welding. The problems associated with manual TIG welding includes undercutting, tungsten inclusions, porosity, Heat affected zone cracks and also the adverse effect on health of welding gun operator due to amount of tungsten fumes produced during the welding process. This brings the necessity of automation. Hence, In this paper an attempt has been made to build a customerized setup of Pulse TIG welding based on through review of Pulse TIG welding parameters. The cost associated for making automated TIG is found to be low as compared to SPM (Special Purpose machines) available in the market.

Fabrication of a Magnetostrictive Transpositioner using Thin Film Deposition and MEMS Techniques (박막성형 기술 및 MEMS 공정을 이용한 자기변형 위치변환기)

  • Lee, Heung-Shik;Cho, Chong-Du;Lee, Sang-Kyo
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1617-1620
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    • 2007
  • This paper presents a magnetostrictive transpositioner and its fabrication process. To get a transposition movement without shifting or twisting, it is designed as an array type. To fabricate the suggested design, micromachining and selective DC magnetron sputtering processes are combined. TbDyFe film is sputter-deposited on the back side of the bulk micromachined transpositioner, with the condition as: Ar gas pressure below $1.2{\times}10^{-9}$ torr, DC input power of 180W and heating temperature of up to $250^{\circ}C$ for the wireless control of each array component. After the sputter process, magnetization and magnetostriction of each sample are measured. X-ray diffraction studies are also carried out to determine the film structure and thickness of the sputtered film. For the operation, each component of the actuator has same length and out-of-plane motion. Each component is actuated by externally applied magnetic fields up to 0.5T and motion of the device made upward movement. As a result, deflections of the device due to the movement for the external magnetic fields are observed.

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A Study on Method to Renovate Information Service Based on 6 Sigma Technique (6시그마 기법을 활용한 도서관 정보서비스 개선방향에 관한 연구 - 해외 학술 및 전략 정보 구입 프로세스를 중심으로 -)

  • Kim, Yong;Kim, Eun-Jung
    • Journal of the Korean Society for information Management
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    • v.24 no.1 s.63
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    • pp.5-29
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    • 2007
  • With the environmental changes around libraries and information centers, they need to develop various management techniques and apply them to library works and services. In this research a case study was conducted in a special library of If company. This study was aimed for reducing ineffective components and unnecessary processes in library works and services. This study applied the Six sigma technique to improve the process of purchasing overseas academic and strategic Information and users' a degree of satisfaction on information service. Specifically, this study used the live-step DMAIC(Define, Measure, Analyze, Improve, Control) method, mainly used in the manufacturing sector. As a result of this study, we could get epoch-making improvement.

The Assessment Method for the Strategic Potential of Personnel with the Example of JTI Kazakhstan

  • Tazhiyeva, Samal;Otarbayeva, Aigul
    • The Journal of Industrial Distribution & Business
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    • v.7 no.2
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    • pp.5-12
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    • 2016
  • Purpose - The purpose of this article is to review the key features and benefits with different methods which is suitable for a particular organization (in this article JTI Kazakhstan) as well as for assessing the capacity of a staff and identification. Research design, data and methodology - Current approaches were used to assess a staff capacity and classify groups. By comparing each other and marked different application methods, this article developed the method for the employment of personal potential and control management process. Results - Through this analysis, assessing labor capacity functioned as an evaluation and assessment for employee competence. Examples suggested practical recommendations for assessing employees' labor potential. Conclusions - It is important not just to bring together several techniques but adapt the conditions with existing organization with the professionalism and experience of specialists in managing the evaluation process. In terms of the implementation of this task, it is necessary to have knowledge in the field of psychology as well as business processes, objectives, and specificities of companies including the relevant personal qualities.

The Removal Of Voids In The Grooved Interfacial Region Of Silicon Structures Obtained With Direct Bonding Technique (홈구조 실리콘 접합 경계면에서의 Void 제거를 위한 실리콘 직접접합 방법)

  • Kim, Sang-Cheol;Kim, Eun-Dong;Kim, Nam-Kyun;Bahna, Wook;Soo, Gil-Soo;Kim, Hyung-Woo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07a
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    • pp.310-313
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    • 2002
  • Structures obtained with a direct boning of two FZ silicon wafers joined in such a way that a smooth surface of one wafer was attached to the grooved surface of the other were studied. A square net of grooves was made with a conventional photo lithography process. After high temperature annealing the appearance of voids and the rearrangement of structural defects were observed with X-ray diffraction topography techniques. It was shown that the formation of void free grooved boundaries was feasible. In the cases when particulate contamination was prevented, the voids appeared in the grooved structures could be eliminated with annealing. Since it was found that the flattening was accompanied with plastic deformation, this deformation was suggested to be intensively involved in the process of void removal. A model was proposed explaining the interaction between the structural defects resulted in "a dissolution" of cavities. The described processes may occur in grooved as well as in smooth structures, but there are the former that allow to manage air traps and undesirable excess of dislocation density. Grooves can be paths for air leave. According to the established mechanisms, if not outdone, the dislocations form local defect arrangements at the grooves permitting the substantial reduction in defect density over the remainder of the interfacial area.

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Formative Application using Stitch Transfer Knitting Structure - Focused on Making Process of Women's Knitwear - (스티치 트랜스퍼 니트 조직의 조형적 적용 - 여성 니트웨어 제작과정을 중심으로 -)

  • Kim, Seong-Dal
    • Fashion & Textile Research Journal
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    • v.8 no.5
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    • pp.562-570
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    • 2006
  • Knit industry requires versatile knit designers who have to control whole process such as material select, color, type of machine, technique, structure and shape. In other words, knit designers urgently need to interplay between technology and design aesthetics. It becomes essential to learn and master basic principles of knitting in order to design and develop effectively for innovative knitwear design. The main purpose of this study is to show fresh methodology through examining the various applications of 'Stitch transfer knitting structure' used in women's knitwear design development. Stitch transfer knitting structure is one of the most popular techniques among various basic knitting methods. Eight knitwears were designed and produced with various types of formative applications which differ from existent stitch transfer knitwears of flat and simple style in the market. These are produced by computer knitting machine 'Shima Seiki 122S' and programmed by 'Knit CAD' software. Among various basic stitch transfer pattern, 'Leaf' pattern is selected as a most effective example for this study. This fabric applied to collar, sleeves, body pattern and accessories as formative decoration. It is expected that this study of methodology helps to get open mind and to indicate possibility to develop and show creative and innovative knitwear and knitted textile design.

Study on ISA's assessment to software process for EN50128 SIL4 (EN50128 SIL4 소프트웨어 프로세스 ISA 인증 사례 연구)

  • Cho, Chi-Hwan;Kang, Chan-Yong;Hwang, Jin-Ho
    • Proceedings of the KSR Conference
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    • 2010.06a
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    • pp.838-849
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    • 2010
  • It is inevitable to control the systematic failure to obtain the software safety integrity of embedded software installed in rolling stock. Because it is not possible to assess systematic failure integrity by quantitative methods, SILs are used to group documentation, methods, tools and techniques throughout software development lifecycle which, when used effectively, are considered to provide an appropriate level of confidence in the realization of a system to a stated integrity level. Normally, safety approval process is through generic product, generic application and specification application for. For safety approval on generic application of software based system, it is required to apply the certified software processes from the planning stage for the assigned SIL. As such, we will develop project specific application with high safety integrity within time limit of contractual delivery schedule through software assessment to the modified area with the re-use of certified software module and documentation. At this point, Hyundai Rotem has developed software processes applicable to support SIL 4 based on EN50128 which was assessed and certified by TUV SUD. This paper introduces the Hyundai Rotem's detailed approach and prospective action to achieve software safety integrity level.

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