• 한국전자통신학회논문지
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• 제8권1호
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• pp.41-47
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• 2013

본 논문에서는 두개의 브랜치 라인을 갖는 와이파이 이동통신용 이중 대역 모노폴 안테나를 설계 및 제작하였다. 제안된 안테나는 평면형 모노폴 설계를 기본으로 두 개의 브랜치 방사 선로를 구성함으로서 이중대역 특성을 갖도록 설계하였다. 제안된 안테나의 접지면 크기는 전형적인 셀룰라 ㅋ폰의 접지면에 적합하게 설계하여 이동통신용 단말기의 PCB와 호환될 수 있도록 하였다. 제안된 안테나는 최적화된 파라메타을 얻기 위해 상용 툴(CST)을 사용하여 시뮬레이션 하였으며 얻어진 최적화된 수치를 이용하여 제안된 안테나를 제작하였다. 제작된 안테나는 와이파이 이동통신의 동작하는 상위 주파수 대역과 하위 주파수 대역에서 반사손실, 이득, 방사패턴의 특성을 측정하였다.

• ETRI Journal
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• 제35권5호
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• pp.827-837
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• 2013

In this paper, we present wideband common-mode (CM) noise suppression using a vertical stepped impedance electromagnetic bandgap (VSI-EBG) structure for high-speed differential signals in multilayer printed circuit boards. This technique is an original design that enables us to apply the VSI-EBG structure to differential signals without sacrificing the differential characteristics. In addition, the analytical dispersion equations for the bandgap prediction of the CM propagation in the VSIEBG structure are extracted, and the closed-form expressions for the bandgap cutoff frequencies are derived. Based on the dispersion equations, the effects of the impedance ratio, the EBG patch length, and via inductances on the bandgap of the VSI-EBG structure for differential signals are thoroughly examined. The proposed dispersion equations are verified through agreement with the full-wave simulation results. It is experimentally demonstrated that the proposed VSI-EBG structure for differential signaling suppresses the CM noise in the wideband frequency range without degrading the differential characteristics.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1997년도 한국자동제어학술회의논문집; 한국전력공사 서울연수원; 17-18 Oct. 1997
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• pp.1742-1745
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• 1997

We have developed a highly responsible probing system for inspection of electrical properties of assemble PCB$_{s}$ (printed circuit boards). However, as the duration of the impact occurring between a probe and a solder joint on PCB is very short, it is very difficult to control the harmful peak impact force and the slip motion of the probe to sufficient level only by its vorce feedback control with high gains. To overcome these disadvantages of the prototype, it needs ot obtain some information of the solder joint in advance before the contact. In addition, to guarantee the reliability of the probing task, the probing system is required to measure several points around the probale target point at high speed. There fore, to meet such requirements, we propose a new noncontaet sensor capable of detecting simultaneously position and normal vectors of the multiple points around the probable target point in real time. By using this information, we can prepare a control strategy for stable contact motion on impact. In this paper, we described measuring priniciple, design, and development of the sensor. The effectiveness of the proposed sensor is verified through a series of experiments.s.

• 전력전자학회논문지
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• 제22권1호
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• pp.36-43
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• 2017

This paper describes a hybrid multi-output three-level DC/DC converter suitable for a wide, high-input voltage range of an auxiliary power supply for a high-power photovoltaic generating system. In a high-power photovoltaic generating system, the solar panel output voltage depends on solar radiation quantity and varies from 450Vdc to 1100Vdc. The proposed hybrid multi-output three-level DC/DC converter, which is an auxiliary power supply, would be used as power source for control printed circuit boards and relay and cooling fans in a high-power photovoltaic generating system. The proposed multi-output ($24V_{DC}/30A$, $230V_{DC}/5A$) hybrid three-level boost converter, which uses an energy recovery snubber, is controlled by variable-frequency and phase-shifted modulations and can achieve zero-voltage switching with all operating conditions of input voltage and load range. Experimental results of a 2kW prototype are evaluated and implemented to verify the performance of the proposed converter.

• 문화기술의 융합
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• 제4권3호
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• pp.209-212
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• 2018

이방성 도전필름(ACF)을 사용한 본딩은 납땜이 용이하지 않은 이질적인 소재 간 미세 접합을 형성하는데 널리 사용되어진다. 성공적인 ACF 본딩 구현을 위한 3가지 제한조건이 존재한다. 본딩 접촉점은 설정된 작업 시간동안 적절한 압력과 온도를 유지한 헤드에 의해서 압착되어야 한다. 본 논문에서는 머신 비전을 기반으로 한 ACF 본딩기법을 제안하고 실험을 통해 검증한다. 시스템은 본딩 작업대 상의 PCB 위치 및 방향을 계산하고 헤드가 압착되어야 하는 최적의 접촉점을 결정한다. 제안한 시스템이 접촉면 상의 헤드 평탄도를 보장함으로써 접착력을 향상시킬 수 있음을 실험결과를 통해 보여준다.

• 설비공학논문집
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• 제18권1호
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• pp.73-80
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• 2006

Present study is concerned with an experimental study on the cooling characteristics of heat-generating components arranged in channels which are made by printed circuit boards. To assess the thermal performance of the heat-generating components arranged by $5\times11$ in flow channel, three variables are used: the velocity of the fluid at the entrance, the height of channel, and row number of the component. The cooling characteristics of the heat-generating components such as the surface temperature rise, the adiabatic temperature rise, the adiabatic heat transfer coefficient, and the effect of thermal wake are compared with the result of the experiment and the numerical analysis. Based on the experiment analysis, some conclusions can be drawn: First of all, the experiment and numerical analysis are identical comparatively; the heat transfer coefficient increases as H/B decreases. Howeve., when H/B is over 7.2, the effect of H/B is rather trivial. The effect is the biggest at the first component from the entrance, and it decreases until the fully developed flow, where it becomes very consistent. The thermal wake function calculated for each row decreases as H/B increases.

• 한국정밀공학회지
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• 제21권8호
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• pp.120-128
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• 2004

The impulse between launch vehicle and atmosphere can generate a lot of noise and vibration during the process of launching a satellite. Structurally, the electronic equipment of a satellite consists of an aluminum case containing PCB. Each PCB has resistors and IC. Noise and vibration of the wide frequency band are transferred to the inside of fairing, subsequently creating vibration of the electronic equipment of the satellite. In this situation, random vibration can cause malfunctioning of the electronic equipment of the device. Furthermore, when the frequency of random vibration meets with natural frequency of PCB, fatigue fracture may occur in the part of solder joint. The launching environment, thus, needs to be carefully considered when designing the electronic equipment of a satellite. In general, the safety of the electronic equipment is supposed to be related to the natural frequency, shapes of mode and dynamic deflection of PCB in the electronic equipment. Structural vibration analysis of PCB and its electronic components can be performed using either FEM or vibration test. In this study, the natural frequency and dynamic deflection of PCB are measured by FEM, and the safety of the electronic components of PCB is evaluated according to the results. This study presents a unique method for finite element modeling and analysis of PCB and its electronic components. The results of FEA are verified by vibration test. The method proposed herein may be applicable to various designs ranging from the electronic equipments of a satellite to home electronics.

• 제어로봇시스템학회논문지
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• 제6권8호
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• pp.710-718
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• 2000

In this paper we described an approach to automation of visual inspection of solder joint defects of SMC(Surface Mounted Components) on PCBs(Printed Circuit Board) by using neural network and fuzzy rule-based classification method. Inherently the surface of the solder joints is curved tiny and specular reflective it induces difficulty of taking good image of the solder joints. And the shape of the solder joints tends to greatly vary with the soldering condition and the shapes are not identical to each other even though the solder joints belong to a set of the same soldering quality. This problem makes it difficult to classify the solder joints according to their qualities. Neural network and fuzzy rule-based classification method is proposed to effi-ciently make human-like classification criteria of the solder joint shapes. The performance of the proposed approach is tested on numerous samples of commercial computer PCB boards and compared with the results of the human inspector performance and the conventional Kohonen network.

• 전기학회논문지
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• 제66권10호
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• pp.1508-1515
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• 2017

This paper proposes the defect detection method for automatic inspection machines in printed circuit boards (PCBs) manufacturing system. The defects of PCB such as open, short, pin hole and scratch can be detected by comparing the standard image and the target image. The standard image is obtained from CAD file such as ODB++ format, and the target image is obtained by arranging, filtering and binarization of captured PCB image. Since the PCB size is too large and image resolution is too high, the image processing requires a lot of memory and computational time. The wavelet transform is applied to compress the standard and target images, which results in reducing the memory and computational time. To increase the inspection accuracy, we utilize the he HH-domain as well as LL-domain of the transformed images. Experimental results are finally presented to show the performance improvement of the proposed method.

• ETRI Journal
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• 제32권5호
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• pp.713-721
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• 2010

E-textile technology has earned a great deal of interest in many fields; however, existing wearable network protocols are not optimized for use with conductive yarn. In this paper, some of the basic properties of conductive textiles and requirements on wearable personal area networks (PANs) are reviewed. Then, we present a wearable personal network (WPN), which is a four-layered wearable PAN using bus topology. We have designed the WPN to be a lightweight protocol to work with a variety of microcontrollers. The profile layer is provided to make the application development process easy. The data link layer exchanges frames in a master-slave manner in either the reliable or best-effort mode. The lower part of the data link layer and the physical layer of WPN are made of a fabric serial-bus interface which is capable of measuring bus signal properties and adapting to medium variation. After a formal verification of operation and performances of WPN, we implemented WPN communication modules (WCMs) on small flexible printed circuit boards. In order to demonstrate the behavior of our WPN on a textile, we designed a WPN tutorial shirt prototype using implemented WCMs and conductive yarn.