• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.11-18
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• 2011

The quantitative interfacial adhesion energy of the Cu-Cu direct bonding layers was evaluated in terms of the bonding temperature and Ar+$H_2$ plasma treatment on Cu surface by using a 4-point bending test. The interfacial adhesion energy and bonding quality depend on increased bonding temperature and post-annealing temperature. With increasing bonding temperature from $250^{\circ}C$ to $350^{\circ}C$, the interfacial adhesion energy increase from $1.38{\pm}1.06$ $J/m^2$ to $10.36{\pm}1.01$ $J/m^2$. The Ar+$H_2$ plasma treatment on Cu surface drastically increase the interfacial adhesion energy form $1.38{\pm}1.06$ $J/m^2$ to $6.59{\pm}0.03$ $J/m^2$. The plasma pre-treatment successfully reduces processing temperature of Cu to Cu direct bonding.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.43 no.5
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• pp.17-26
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• 2011

Drying behavior and physical properties of HwBKP, SwBKP, and OCC handsheets depending on kneading, refining and wet pressing were analyzed. The maximum drying shrinkage velocity was newly adopted to verify the effect of mechanical treatment of pulps by evaluating drying behavior according to varying the kneading, refining and wet pressing treatments. Those various treatments were changed to evaluate the relationship between the maximum drying shrinkage velocity and handsheets properties. When the drying shrinkage and the maximum drying velocity increased by refining and wet-pressing, handsheets strength was increased. The maximum drying shrinkage velocity showed higher correlation with physical properties of paper than WRV at different refining loads at SwBKP and mixed pulp. At high wet-web dryness, drying shrinkage, the maximum drying shrinkage velocity and strength properties of handsheet were increased. It meant that drying shrinkage behavior was highly affected by not only fibers' shrinkage but also fiber bonding. Kneading pre-treatment for KOCC and SwBKP effectively modified fiber properties and increasing paper strength and drying shrinkage. The effect of kneading pre-treatment was also confirmed by the maximum drying shrinkage velocity. Strength properties of mixed pulp handsheets were not increased by the kneading pre-treatment, although the maximum drying shrinkage velocity and WRV was increased. It meant that fibers network bonding of HwBKP was limited because of ves sels and ray cells' interference for bonding. Therefore in order to improve paper strengths containing HwBKP by mechanical treatments, interference of vessels and ray cells for fiber bondings should be carefully controlled.

• Journal of Powder Materials
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• v.13 no.1 s.54
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• pp.62-67
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• 2006

Friction welding of $Al_2O_3$ particulate reinforced aluminum composites was performed and the following conclusions were drawn from the study of interfacial bonding characteristics and the relationship between experimental parameters of friction welding and interfacial bond strength. Highest bonded joint efficiency (HBJE) approaching $100\%$ was obtained from the post-brake timing, indicating that the bonding strength of the joint is close to that of the base material. For the pre-brake timing, HBJE was $65\%$. Most region of the bonded interface obtained from post-brake timing exhibited similar microstructure with the matrix or with very thin, fine-grained $Al_2O_3$ layer. This was attributed to the fact that the fine-grained $Al_2O_3$ layer forming at the bonding interface was drawn out circumferentially in this process. Joint efficiency of post-brake timing was always higher than that of pre-brake timing regardless of rotation speed employed. In order to guarantee the performance of friction welded joint similar to the efficiency of matrix, it is necessary to push out the fine-grained $Al_2O_3$ layer forming at the bonding interface circumferentially. As a result, microstructure of the bonded joint similar to that of the matrix with very thin, fine-grained $Al_2O_3$ layer can be obtained.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.109-114
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• 2021

We investigated the effects of atmospheric hydrogen plasma treatment on Cu-Cu direct bonding. Hydrogen plasma was effective in reducing the surface oxide layer of Cu thin film, which was confirmed by GIXRD analysis. It was observed that larger plasma input power and longer treatment time were effective in terms of reduction and surface roughness. The interfacial adhesion energy was measured by DCB test and it was observed to decrease as the bonding temperature decreased, resulting in bonding failure at bonding temperature of 200℃. In case of wet treatment, strong Cu-Cu bonding was observed above bonding temperature of 250℃.

• Restorative Dentistry and Endodontics
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• v.32 no.5
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• pp.426-436
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• 2007

The objective of this study is to evaluate the effect of an additional application of bonding resin on the bond strength of resin luting cements in both the light-cure (LC) and self-cure (SC) modes by means of the ${\mu}TBS$ tests. Three combinations of One-Step Plus with Choice, Single Bond with Rely X ARC, and One-Up Bond F with Bistite II were used. D/E resin and Pre-Bond resin were used for the additional application. Twelve experimental groups were made. Three mandibular $3^{rd}$ molars were used in each group. Indirect composite blocks were cemented on the tooth surface. $1\;{\times}\;1\;mm^2$ dentin-composite beam for ${\mu}TBS$ testing were made and tested. When total-etching dentin adhesives were used, an additional application of the bonding resin increased the bond strength (P < 0.05). However, this additional application didn't influence the bond strength of self-etching dentin adhesives (P > 0.05). In conclusion, the results suggest that an additional application of the bonding resin increases bond strength and enhances quality of bonding when using total-etching dentin adhesives.

• Journal of Sensor Science and Technology
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• v.13 no.4
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• pp.264-269
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• 2004

This paper describes on an advanced technology of 3C-SiC/Si(100) wafer direct bonding using PECVD oxide to intermediate layer for SiCOI(SiC-on-Insulator) structure because it has an attractive characteristics such as a lower thermal stress, deposition temperature, more quick deposition rate and higher bonding strength than common used poly-Si and thermal oxide. The PECVD oxide was characterized by ATR-FTIR. The bonding strength with variation of HF pre treatment condition was measured by tensile strength measurement system. After etch-back using TMAH solution, roughness of 3CSiC surface crystallinity and bonded interface was measured and analyzed by AFM, XRD, and SEM respectively.

• Journal of Welding and Joining
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• v.19 no.1
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• pp.40-48
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• 2001

An ultrasonic test method, as a nondestructive test is applied to ensure the clad interface quality assessment. According to the reference codes and standards, not only korea Industrial Standard(KS) but also American Society for Testing and Materials (ASTM) Standard, ultrasonic examination procedures use the pulse-echo, A-scan, back reflection signal drop method and/or side drilled reference hole used to establish the acceptance criteria of clad material test. But the variety of bonding materials and sizes makes it difficult to produce the reference blocks, or thus the criteria. In order to overcome these practical difficulties, new ultrasonic testing criterion is suggested. In this new method, the theoretical interface reflection signal amplitude level is calculated and suggested as an acceptance criteria with the back reflection signal set to 100% FSH(Full Screen Height) which is based on acoustic impedance mismatch at the clad interface for the explosive clad ultrasonic inspection. Applicability of suggested criterion, for the explosive clad Fe-Naval Brass with different bonding quality is confirmed to the pre-existed KS and ASTM specifications and verified by using SEM (Seanning Electron Microscope) micrograph. The results obtained by the suggested method is more conservative than the results according to the KS B 0234 and ASTM A 578 specifications The suggested method could be applicable to any other combination of explosive clad ultrasonic inspection.

• Journal of Advanced Marine Engineering and Technology
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• v.38 no.6
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• pp.688-697
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• 2014

In this study, electrode bonding technology needed for high density of rechargeable battery is studied, which is recently researched for electric vehicle, the small leisure vessel. For the alternative overcoming the limit of stacking amount able to be stacked by conventional ultrasonic welding, the low temperature bonding method, eligible for minimum of degeneration of chemical activator on the electrode surface which is generated by thermal effect as well as the increase of conductivity and tension strength caused by electrode bonding using filler metal, not using conventional direct heating on the electrode material method, is studied. Specifically to say, recently used more generally the ultrasonic welding and spot welding method are not usable for satisfying stable electric conductivity and bonding strength when much electrode is stacking bonded. If the electrical power is unreasonably increased for the welding, due to the effect of welding temperature, deformation of electrode and activating material degeneration are caused, and after the last packaging, decline of electrical output and generating heat cause to reduce stability of battery. Therefore, in this study, induction heating system bonding method using high frequency heating and differentiated electrode method using filler metal pre-treatment of hot dipping are introduced.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.31-37
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• 2009

Cu-Cu thermo-compression bonding process was successfully developed as functions of the $N_2+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the quantitative interfacial adhesion energy was measured by 4-point bending test. While the pre-annealing with $N_2+H_2$ gas below $200^{\circ}C$ is not effective to improve the interfacial adhesion energy at bonding temperature of $300^{\circ}C$, the interfacial adhesion energy increased over 3 times due to post-annealing over $250^{\circ}C$ after bonding at $300^{\circ}C$, which is ascribed to the effective removal of native surface oxide after post-annealing treatment.

• Proceedings of the Materials Research Society of Korea Conference
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• 1996.11a
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• pp.100-101
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• 1996