• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.103-108
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• 2000

The texture of Al/Ti thin films deposited on low-dielectric polymer substrates has been investigated. Fifty-nm-thick Ti films and 500-nm-thick Al-1%Si-0.5%Cu (wt%) films were deposited sequentially onto low-k polymers and SiO$_2$ by using a DC magnetron sputtering system. The texture of Al thin film was determined using X-ray diffraction (XRD) theta-2theta ($\theta$-2$\theta$) and rocking curve and the microstructure of Al/Ti films on low-k polymer and SiO$_2$ substrates was characterized by Transmission electron microscopy (TEM). hall thin films deposited on SiO$_2$ had stronger texture than those deposited on low-k polymer. The texture of Al thin films strongly depended on that of Ti films. Cross-sectional TEM resealed that Brains of Ti films on SiO$_2$ substrates had grown perpendicular to the substrate, while the grains of Ti films on SiLK substrates were farmed randomly. The lower degree of 111 texture of Al thin films on low-k polymer was due to Ti underlayer.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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• pp.71-71
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• 2003

Hot embossing has been widely accepted as an alternative to photolithography in generating patterns on polymeric substrates. The optimization of embossing process should be accomplished based on polymer substrate materials. In this paper, the effect of polymer substrates on nano scale hot embossing process was studied. Silicon molds with nano size patterns were fabricated by e-beam direct writing. Molds were coated with self-assembled monolayer (SAM) of (1, 1, 2.2H -perfluorooctyl)-trichlorosilane to reduce the stiction between mold and substrates. For an embossing, pressure of 55, 75 bur, embossing time of 5 min and temperature of above transition temperature were peformed. Polymethylmethacrylates (PMMA) with different molecular weights of 450,000 and 950,000, MR-I 8010 polymer (Micro Resist Technology) and polyaliphatic imide copolymer were applied for hot embossing process development in nano size. These polymers were spun coated on the Si wafer with the thickness between 150 and 200 nm. The nano size patterns obtained after hot embossing were observed and compared based on the polymer properties by scanning electron microscopy (SEM). The imprinting uniformity dependent on the Pattern density and size was investigated. Four polymers have been evaluated for the nanoimprint By optimizing the process parameters, the four polymers lead to uniform imprint and good pattern profiles. A reduction in the friction for smooth surfaces during demoulding is possible by polymer selection.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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• pp.753-753
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• 2004

• Journal of Industrial and Engineering Chemistry
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• 제68권
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• pp.42-47
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• 2018

This work reports a facile and effective antibacterial coating for oxide substrates. As a coating material, a random copolymer, abbreviated as poly(TMSMA-r-PEGMA), was synthesized by radical polymerization of 3-(trimethoxysilyl)propyl methacrylate (TMSMA) and poly(ethylene glycol) methyl ether methacrylate (PEGMA). Polymeric self-assembled monolayers of poly(TMSMA-r-PEGMA) were formed on various inorganic oxide substrates, including silicon oxide, titanium dioxide, aluminum oxide, and glass, via the simple dip-coating process. The polymer-coated substrates were characterized by ellipsometry, contact angle measurements, and X-ray photoelectron spectroscopy. The bacterial adhesion on the polymer-coated substrates was completely suppressed compared to that on the uncoated substrates.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.305-308
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• 2003

We fabricated a flexible ferroelectric liquid crystal (FLC) device containing polymer walls and networks which fix plastic film substrates. The device using 100-${\mu}m$-thick substrates could be bent in a radius of 7mm without disordering the FLC alignment. When sandwiched between polarizers a roll-up display with high-speed grayscale capability for moving-image displays was created.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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• pp.814-816
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• 2005

In this paper, we describe how specially developed polymer capped, nano-particle silver inks can be used to print circuitry for applications like displays, RFID antennas and "disposable electronics". The requirements of printing on temperature sensitive flexible substrates (such as polymer films and papers) that require low temperature curing is also discussed.

• 마이크로전자및패키징학회지
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• 제7권2호
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• pp.37-42
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• 2000

저유전상수 폴리머와 $SiO_2$위에 형성된 Al/Ti박막의 우선방위에 대해 비교하였다. DC 마그네트론 스퍼터를 이용하여 50 nm 두께의 Ti과 500 nm의 Al-1%Si-0.5%Cu(wt%) 합금 박막을 저유전상수 폴리머와 $SiO_2$기판위에 증착하였다. Al의 우선방위는 XRD $\theta$-2$\theta$와 rocking curve로 측정하였고, Al/Ti박막의 미세조직은 투과전자현미경 (TEM)으로 관찰하였다. 저 유전상수 폴리머 위에 증착된 Al/Ti박막은 $SiO_2$위에 증착된 것보다 낮은 우선방위를 가졌다. 단면 TEM으로 Ti을 관찰한 결과, $SiO_2$위의 Ti의 결정립은 기판에 수직하게 성장하였으나 저유전상수 폴리머 위의 Ti 결정립은 등축정으로 성장하였으며, 저유전상수 폴리머위의 Al/Ti박막이 낮은 우선방위를 갖는 이유는 Ti 미세조직 때문이었다.

• 한국전기전자재료학회논문지
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• 제17권4호
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• pp.443-447
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• 2004

In this study, we investigated the necessity of encapsulation layer to maximize flexibility of brittle indium-tin-oxide (ITO) on polymer substrates. And, Young's modulus (E) of encapsulation layer han a significant effect on external bending stress and the coefficient of thermal expansion (CTE) of that han a significant effect on internal thermal stress. To compare the magnitude of total mechanical stress including both bending stress and thermal stress, the mechanical stress of triple-layer structure (substrate / ITO / encapsulation layer or substrate / buffer layer / ITO) can be quantified and numerically analyzed through the farthest cracked island position. As a result, it should be noted that multi-layer structures with more elastic encapsulation material have small mechanical stress compared to that of buffer and encapsulation structure of large Young's modulus material when they were externally bent.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.1568-1570
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• 2008

In this paper, fabrication of a $60{\times}48$ polymer TFT array with a top-gate structure on plastic substrates using a low temperature printing process will be presented and the device structure and manufacturing processes will be discussed. The polymer TFT array showed excellent air stability and uniform electrical characteristics over a large area. Finally, a 1.5 inch EPD display with 50 dpi resolution using the polymer TFT array will be demonstrated for e-film device applications.

• 한국인터넷방송통신학회논문지
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• 제20권5호
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• pp.63-70
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• 2020

본 논문에서는 35 GHz 대역의 군 탐색기용 송수신 모듈을 설계 및 제작하였다. 밀리미터파 대역의 기판 성능과 집적도를 높이기 위해, 4층 액정 폴리머 기판을 개발하였다. 4층 액정 폴리머 기판은 3장의 FCCL 기판과 2장의 접착층으로 구현되었으며, 적층을 위해 기판간의 녹는 점 차이를 이용한 공정을 이용하였다. 스트립선로와 마이크로스트립 선로를 이용하여 기판의 길이에 따른 전송손실을 확인하였고, 35 GHz 대역의 전력분배기를 통해 액정폴리머 기판의 성능을 검증하였다. 이러한 기판을 이용하여 전력증폭기와 저잡음증폭기와 같은 송수신모듈을 구성하는 개별 블록에 대한 성능을 확인한 후, 단일 채널 Ka대역 송수신모듈을 4층 액정 폴리머 기판을 이용하여 개발하였다. 제작한 송수신모듈의 송신출력은 펄스 Duty 10%에서 1.1W 이상, 수신 잡음지수는 8.5 dB 이하, 수신 이득은 17.6 dB 이상의 수신 특성을 갖는다.