• Proceedings of the KAIS Fall Conference
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• 2000.04a
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• pp.84-84
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• 2000

• Korean Journal of Materials Research
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• v.18 no.9
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• pp.486-491
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• 2008

The effect of annealing treatment conditions on the interfacial adhesion energy between electrolessplated Ni film and polyimide substrate was evaluated using a $180^{\circ}$ peel test. Measured peel strength values are $26.9{\pm}0.8,\;22.4{\pm}0.8,\;21.9{\pm}1.5,\;23.1{\pm}1.3,\;16.1{\pm}2.0\;and\;14.3{\pm}1.3g/mm$ for annealing treatment times during 0, 1, 3, 5, 10, and 20 hours, respectively, at $200^{\circ}C$ in ambient environment. XPS and AES analysis results on peeled surfaces clearly reveal that the peeling occurs cohesively inside polyimide. This implies a degradation of polyimide structure due to oxygen diffusion through interface between Ni and polyimide, which is also closely related to the decrease in the interfacial adhesion energy due to thermal treatment in ambient conditions.

• KIEE International Transactions on Electrophysics and Applications
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• v.4C no.4
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• pp.165-169
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• 2004

This paper reports a miniaturized conductor-backed CPW (CBCPW) bandpass filter based on a thin film polyimide layer coated on CMOS-grade silicon. With a 20 ${\mu}{\textrm}{m}$-thick polyimide interface layer and back metallization on the CMOS-grade silicon, the interaction of electromagnetic fields with the lossy silicon substrate has been isolated, and as a result a low-loss and low-dispersive CBCPW line has been obtained. Measured attenuation constant at 20 GHz is below 1.2 ㏈/cm, which is compatible with the CPW on GaAs. In addition, by using the proposed CBCPW geometry, miniaturized BPF for Ku band application is designed and its measured frequency response shows excellent agreement with the predicted value with validating the performances of the proposed CBCPW geometry for RFIC interconnects and filter applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.105-106
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• 2006

현재 투명 전도성 산화물로 널리 사용되고 있는 ITO등의 물질들이 갖는 문제점을 해결하기 위하여 ZnO 에 Ga이나 Al등의 불순물을 첨가하여 투명 전도성 재료로써 이에 대한 연구가 진행중에 있다. 본 연구에서는 RF 마그네트론 스퍼터법으로 Al이 첨가된 ZnO:Al Ceramic 타겟으로 Coring 1737 유리기판과 파손의 우려가 적고 유연성을 갖는 $25{\mu}m$ 두께의 polyimide(PI) 기판위에 박막을 증착하여 특성을 비교 조사하였다.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.633-636
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• 2008

A series novel films of polyimide (PI) and co-polyimide (Co-PI) containing fluorine with colorless, flexible properties was prepared by a two-step process from various commercial aromatic monomers such as 4,4'-(Hexafluoro iso propylidene) diphthalic anhydride (6FDA), 2,2'-Bis(Trifluoromethyl) benzidine (TFDB), 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (AH6FP) and Bis(4-(3-aminophenoxy)phenyl)sulfone (BAS). Furthermore, these obtained transparent and flexible Co-PI films exhibited excellent thermal stability with the decomposition temperature (at 5% weight loss) around of $500^{\circ}C$ and the glass transition temperature ($T_g$) in the range of $275-350^{\circ}C$.

• Korean Journal of Optics and Photonics
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• v.20 no.5
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• pp.281-287
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• 2009

The optical anisotropy of rubbed PI(polyimide) film on patterned LCD glass substrate is analyzed using polarimetry. The direction of the optic axis and the magnitude of the very small retardation ($\sim$ 0.4 nm or less) is precisely measured by using a transmission ellipsometer. The variation of the optical anisotropy is presented as the curve of the optic axis versus the magnitude of the phase retardation and it is explained by using a simple optical model.

• Polymer(Korea)
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• v.29 no.2
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• pp.204-210
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• 2005

We describe a colorless, transparent polyimide films for plastic display substrate which should have heat resistance, roll-to-roll processability and low CTE (coefficient of thermal expansion) property. Colorless polyimides were synthesized from 3,3',4,4'-oxydiphthalic anhydride (ODPA) 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) and diamines such as sulfonyldianiline, aminophenoxybenzene (TPE-p, TPE-q, TPE-r) and bis[4-(3-aminophen oxy)phenyl] sulfone (m-BAPS). Their optical properties were measured by UV spectrophotometer, colormeter and hazemeter. We prepared polyimide/organophilic layered silicate nanocomposite to improve dimension stability. These colorless polyimide films showed UV transmittance by the level upper $89\%$, at 440 nm and excellent optical property having the value under yellow index (YI)=7. In addition, polyimide nanocomposite films also showed an improvement of CTE value as decreased according to the amount of layered silicate contents.

• Korean Journal of Metals and Materials
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• v.47 no.11
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• pp.740-747
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• 2009

The purpose of this study is to identify the effect of electrolyte compositions on electrodeposited copper foil. First of all, the polyimide substrate was pretreated with plasma. Finally, copper foil was deposited on a Cu/Ni/Polyimide substrate using the electroplating technique. As the quantity of Cu increased, preferred orientations changed into (111). Increasing sulfuric acid, on the other hand, brought down the preferred orientation of (111). The lowest sheet resistance, surface roughness, and fine adhesion were detected when the ratio of $Cu^{2+}$ and $H_2SO_4$ is 50:50(g/l).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.199-202
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• 2003

We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with rubbing alignment method on two kinds of polyimide (PI) surfaces using thin plastic substrates. The generated NLC pretilt angles on the pre-imidized type PI are about $3.8^{\circ}$ by the rubbing alignment method with thin plastic substrates, However, the pretilt angle measured at about $2.8^{\circ}$ lower on the polyamic acid type PI than by pre-imidized type PI surface with thin polymer film. The tilt angle increases as increasing curring temperature for making polyimide layer using polyamic acid type PI. It was concluded that pretilt angle in the polyimide surface is attributable to the increasing of imide rato.

• Journal of the Korean Society of Industry Convergence
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• v.20 no.4
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• pp.307-311
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• 2017

Ultra short pulse laser processing with the PI (polyimide) substrate is conducted to increase flexibility and radius of curvatures. A femtosecond laser is used to perform micro machining by minimizing the heat effect in PI substrate. The laser processing according to the parameters, such as fabricated line width, depth, laser power, distance between lines, is carried out to understand the characteristics of fabricated lines. A bending test is carried out to evaluate bending shapes and the radius of curvature after bending and spreading it 1000 times. The results demonstrates that the radius of curvature decreases in deepen lines and increases with the augment of the number of the fabricated lines, and distance between lines.