• Title/Summary/Keyword: polyimide processing

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Electrical Properties of Organic Thin Films by Electric Field Stimulus (전계자격에 따른 유기박막의 전기 특성)

  • Chon, D.K.;Choi, Y.I.;Kim, J.M.;Cha, I.S.;Lee, K.S.
    • Proceedings of the KIEE Conference
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    • 1998.11c
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    • pp.807-809
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    • 1998
  • We give pressure stimulation into organic thin films and detect the induced displacement current, In processing of a device manufacture, we can see the process is good from the change of a surface pressure for organic thin films and transfer ratio of area per molecule. The structure of manufactured device is Au/organic thin films(Kapton-Polyimide)/Au and I-V properties of the device is measured from 0(V) to +5(V). The maximum value of measured current is increased as the number of accumulated layers are decreased. The resistance for the number of accumulated layers, the energy density for an input voltage show desired results.

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Electrical Effects of the Adhesion Layer Using the VDP Process on Dielectric

  • Lee, Dong-Hyun;Pyo, Sang-Woo;Hyung, Gun Woo;Kim, Young-Kwan
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07b
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    • pp.1313-1316
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    • 2005
  • In the present paper, it was investigated that adhesion layer on gate insulator could affect the electrical characteristics for the organic thin film transistors (OTFTs). The polyimide (PI) as organic adhesion layer was fabricated by using the vapor deposition polymerization (VDP) processing . It was found that electrical characteristics improved comparing OTFTs using adhesion layer to another. We researched adhesion layer as a function of thickness. For inverted-staggered top contact structure, field effect mobility, threshold voltage, and on-off current ratio of OTFTs using adhesion layer of PI 15 nm thickness on the gate insulator with a thickness of 0.2 ${\mu}m$ were about 0.5 $cm^2/Vs$, -0.8 V, and $10^6$, respectively.

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Generation of hydrophobicity on the surfaces of nano and other materials using atmospheric plasmas

  • Kim, Jeong-Won;Cho, Soon-Gook;Ko, Kwang-Cheol;Woo, Hyun-Jong;Chung, Kyu-Sun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.256-256
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    • 2011
  • Using plasmas, hydrophobic surfaces are made on various substances such as polyimide films, filter paper, cotton clothes and multi-walled carbon nanotube (MWCNT) with hexamethyldisiloxane (HMDSO), trimethylchlorosilane (TMCS) and toluene reagents. Plasmas are easily and rapidly to change surface of hydrophilic materials into hydrophobic. We have also optimized processing time and maximized contact angle for super-hydrophobicity of MWCNT. Contact angles have been calculated by measuring between substance and probe liquid, and total surface free energies are determined by the Owens-Wendt equation. Figure 1 shows the measured contact angles with time and ratio of reagents on MWCNT.

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Fabrication of Organic-Inorganic Nanocomposite Blade for Dicing Semiconductor Wafer (반도체 웨이퍼 다이싱용 나노 복합재료 블레이드의 제작)

  • Jang, Kyung-Soon;Kim, Tae-Woo;Min, Kyung-Yeol;Lee, Jeong-Ick;Lee, Kee-Sung
    • Composites Research
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    • v.20 no.5
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    • pp.49-55
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    • 2007
  • Nanocomposite blade for dicing semiconductor wafer is investigated for micro/nano-device and micro/nano-fabrication. While metal blade has been used for dicing of silicon wafer, polymer composite blades are used for machining of quartz wafer in semiconductor and cellular phone industry in these days. Organic-inorganic material selection is important to provide the blade with machinability, electrical conductivity, strength, ductility and wear resistance. Maintaining constant thickness with micro-dimension during shaping is one of the important technologies fer machining micro/nano fabrication. In this study the fabrication of blade by wet processing of mixing conducting nano ceramic powder, abrasive powder phenol resin and polyimide has been investigated using an experimental approach in which the thickness differential as the primary design criterion. The effect of drying conduction and post pressure are investigated. As a result wet processing techniques reveal that reliable results are achievable with improved dimension tolerance.

Effect of Adhesion Layer on Gate Insulator (게이트 절연막에 사용된 점착층에 대한 영향)

  • Lee, Dong-Hyun;Hyung, Gun-Woo;Pyo, Sang-Woo;Kim, Young-Kwan
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.19 no.4
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    • pp.357-361
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    • 2006
  • The electrical performances of organic thin-film transistors (OTFTs) have been improved for the last decade. In this paper, it was demonstrated that the electrical characteristics of the organic thin film transistors (OTFTs) were improved by using polymeric material as adhesion layer on gate insulator. We have investigated OTFTs with polyimide adhesion layer which was fabricated by vapor deposition polymerization (VDP) processing and formed by co-deposition of 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride and 4,4'-oxydianiline. It was found that the OTFTs with adhesion layer showed better electrical characteristics than with bare layer because of good matching between semiconductor and gate insulator. Our devices of performance are field effect mobility of $0.4cm^2/Vs$, threshold voltage of -0.8 V and on-off current ratio of $10^6$. In addition, to improve the electrical characteristics of OTFT, we have reduced the thickness of adhesion layer up to a few nanometrs.

The Effect of Adhesion layer on Gate Insulator for OTFTs (OTFT의 게이트 절연막에 사용된 점착층에 대한 영향)

  • Lee, Dong-Hyun;Hyung, Gun-Woo;Pyo, Sang-Woo;Kim, Jung-Soo;Kim, Young-Kwan
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.07a
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    • pp.70-71
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    • 2005
  • The electrical performances of organic thin-film transistors (OTFTs) have been improved for the last decade. In this paper, it was demonstrated that the electrical characteristics of the organic thin film transistors (OTFTs) were improved by using polymeric material as adhesion layer on gate insulator. We have investigated OTFTs with polyimide adhesion layer which was fabricated by vapor deposition polymerization (VDP) processing and formed by co-deposition of 6FDA and ODA. It was found that the OTFTs with adhesion layer showed better electrical characteristics than with bare layer because of good matching between semiconductor and gate insulator. Our devices of performance are field effect mobility of $0.4cm^2$/Vs, threshold voltage of -0.8 V and on-of current ratio of $10^6$. In addition, to improve the electrical characteristics of OTFT, we have reduced the thickness of adhesion layer up to a few nanometrs.

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A Study on the Design of Smart Farm Heating Performance using a Film Heater (필름 히터를 이용한 스마트 팜 난방 성능 설계에 관한 연구)

  • W. Kim
    • Transactions of Materials Processing
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    • v.32 no.3
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    • pp.153-159
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    • 2023
  • This paper presents the optimal design of a heating system using radiant heating elements for application in smart farms. Smart farming, an advanced agricultural technology, is based on artificial intelligence and the internet of things and promotes crop production. Temperature and humidity regulation is critical in smart farms, and thus, a heating system is essential. Radiant heating elements are devices that generate heat using electrical energy. Among other applications, radiant heating elements are used for environmental control and heating in smart farm greenhouses. The performance of these elements is directly related to their electrical energy consumption. Therefore, achieving a balance between efficient electrical energy consumption and maximum heating performance in smart farms is crucial for the optimal design of radiant heating elements. In this study, the size, electrical energy supply, heat generation efficiency, and heating performance of radiant heating elements used in these heating systems were investigated. The effects of the size and electrical energy supply of radiant heating elements on the heating performance were experimentally analyzed. As the radiant heating element size increased, the heat generation efficiency improved, but the electrical energy consumption also increased. In addition, increasing the electrical energy supply improved both the heat generation efficiency and heating performance of the radiant heating elements. Based on these results, a method for determining the optimal size and electrical energy supply of radiant heating elements was proposed, and it reduced the electrical energy consumption while maintaining an appropriate heating performance in smart farms. These research findings are expected to contribute to energy conservation and performance improvement in smart farming.

Residual Stress Behavior of PMDA/6FDA-PDA Copolyimide Thin Films (PMDA/6FDA-PDA 공중합 폴리이미드의 잔류응력 거동)

  • Jang, Won Bong;Chung, Hyun Soo;Joe, Yungil;Han, Haksoo
    • Applied Chemistry for Engineering
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    • v.10 no.7
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    • pp.1014-1019
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    • 1999
  • Copolyamic acid PMDA/6FDA-PDA(PAA) and homopolyamic acids PMDA-PDA(PAA) and 6FDA-PDA(PAA) were synthesized from 1,2,4,5-benzenetetracarboxylic dianhydride(PMDA) and 2,2'-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride(6FDA) as the dianhydride and 1,4-phenylenediamine (PDA) as the diamine. Residual stresses were detected in-situ during thermal imidization of the co- and homopolyimide precursors as a function of processing temperature over the range of $25{\sim}400^{\circ}C$ using thin film stress analyzer(TFSA), and morphological structures were investigated by WAXD. In comparison, the resultant residual stress of polyimide films composed of different compositions decreased with the increasing content of PMDA unit in the chain and was about 5 Mpa in compression mode for PMDA-PDA. In this study, the synthesis of random PMDA/6FDA-PDA copolyimide could be completed and compensate for the difficulty of process due to high $T_g$ of PMDA-PDA and relatively higher stress of 6FDA-PDA. It showed that we can make a low level stress copolyimied having excellent mechanical properties by incorporating appropriate rod-like rigid structure PMDA-PDA unit into 6FDA-PDA polyimide backbone which generally shows higher stress due to rotational hinges such as bulky di(trifluoromethyl). Specially, PMDA/6FDA-PDA(0.9:0.1:1.0) satisfied excellent mechanical property and low level stress as an inter layer showing low dielectric constant.

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Effects of Polyimide Passivation Layers and polyvinylalcohol Passivation Layers for Organic Thin-Film Transistors(OTFTs) (폴리이미드 패시베이션과 폴리비닐알콜 패시베이션 레이어 성막이 고성능 유기박막 트렌지스터에 주는 영향)

  • Park, Il-Houng;Hyung, Gun-Woo;Choi, Hak-Bum;Hwang, Sun-Wook;Kim, Young-Kwan
    • Journal of the Korean Vacuum Society
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    • v.17 no.3
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    • pp.195-198
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    • 2008
  • In this paper, it was demonstrated that organic thin-film transistors (OTFTs) were fabricated with the organic passivation layer by vapor deposition polymerization (VDP) processing. In order to form polymeric film as a passivation layer, VDP process was also introduced instead of spin-coating process, where polymeric film was co-deposited by high-vacuum thermal evaporation from 6FDA and ODA followed by curing. In order to investigate by compared with different passivation layer, the other OTFTs is fabricated to passivation by Polyvinylalcohol using spincoating. We can see that two different ways of passivation layer affect electric characteristic of OTFTs. The initial electric characteristic of OTFTs before passivation such as field effect mobility, threshold voltage, and on-off current ratio are $0.24cm^2/Vs$, -3V, and $10^6$, respectively. Then after polyimide passivation layer, field effect mobility change from $0.24cm^2/Vs$ to $0.26cm^2/Vs$, threshold voltage from -3V to 1V and on-off current ratio from $10^6$ to $10^6$, respectively. In the case of polyvinylalcohol passivation, the initial electric characteristic of OTFTs before passivation such as field effect mobility, threshold voltage, and on-off current ratio are $0.13cm^2/Vs$, 0V, and $10^6$, respectively. Then after polyvinylalcohol passivation layer, field effect mobility changes from $0.13cm^2/Vs$ to $0.13cm^2/Vs$, threshold voltage from 0V to 2V, and on-off current ratio from $10^6$ to $10^5$, respectively.

Development of Three-Dimensional Deformable Flexible Printed Circuit Boards Using Ag Flake-Based Conductors and Thermoplastic Polyamide Substrates

  • Aram Lee;Minji Kang;Do Young Kim;Hee Yoon Jang;Ji-Won Park;Tae-Wook Kim;Jae-Min Hong;Seoung-Ki Lee
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.37 no.4
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    • pp.420-426
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    • 2024
  • This study proposes an innovative methodology for developing flexible printed circuit boards (FPCBs) capable of conforming to three-dimensional shapes, meeting the increasing demand for electronic circuits in diverse and complex product designs. By integrating a traditional flat plate-based fabrication process with a subsequent three-dimensional thermal deformation technique, we have successfully demonstrated an FPCB that maintains stable electrical characteristics despite significant shape deformations. Using a modified polyimide substrate along with Ag flake-based conductive ink, we identified optimized process variables that enable substrate thermal deformation at lower temperatures (~130℃) and enhance the stretchability of the conductive ink (ε ~30%). The application of this novel FPCB in a prototype 3D-shaped sensor device, incorporating photosensors and temperature sensors, illustrates its potential for creating multifunctional, shape-adaptable electronic devices. The sensor can detect external light sources and measure ambient temperature, demonstrating stable operation even after transitioning from a planar to a three-dimensional configuration. This research lays the foundation for next-generation FPCBs that can be seamlessly integrated into various products, ushering in a new era of electronic device design and functionality.