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Effect of Adhesion Layer on Gate Insulator

게이트 절연막에 사용된 점착층에 대한 영향

  • 이동현 (홍익대학교 정보디스플레이공학과, 홍익대학교 유기정보소재 및 소자연구센터) ;
  • 형건우 (홍익대학교 정보디스플레이공학과, 홍익대학교 유기정보소재 및 소자연구센터) ;
  • 표상우 (홍익대학교 전기정보제어공학과, 홍익대학교 유기정보소재 및 소자연구센터) ;
  • 김영관 (홍익대학교 정보디스플레이공학과, 홍익대학교 유기정보소재 및 소자연구센터)
  • Published : 2006.04.01

Abstract

The electrical performances of organic thin-film transistors (OTFTs) have been improved for the last decade. In this paper, it was demonstrated that the electrical characteristics of the organic thin film transistors (OTFTs) were improved by using polymeric material as adhesion layer on gate insulator. We have investigated OTFTs with polyimide adhesion layer which was fabricated by vapor deposition polymerization (VDP) processing and formed by co-deposition of 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride and 4,4'-oxydianiline. It was found that the OTFTs with adhesion layer showed better electrical characteristics than with bare layer because of good matching between semiconductor and gate insulator. Our devices of performance are field effect mobility of $0.4cm^2/Vs$, threshold voltage of -0.8 V and on-off current ratio of $10^6$. In addition, to improve the electrical characteristics of OTFT, we have reduced the thickness of adhesion layer up to a few nanometrs.

Keywords

References

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