• 한국진공학회지
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• 제1권3호
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• pp.376-381
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• 1992

Tungsten silicide films were deposited on the highly phosphorus-doped poly Si/SiO2/Si substrates by Low Pressure Chemical Vapor Deposition. They were heat treated in different conditions. XTEM, SIMS and high frequency C-V analysis were conducted for characterization. It can be concluded that outdiffusion of phosphours impurity throught the silicide films lead to its depletion in the poly-Si gate region near the gate oxide, resulting in loss of capacitance and increase of effective gate oxide thickness.

• 한국세라믹학회지
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• 제49권6호
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• pp.625-630
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• 2012

Highly porous silicon carbide (SiC) ceramics were fabricated from polysiloxane, SiC and carbon black fillers, AlN-$Y_2O_3$ additives, and poly (ether-co-octene) (PEOc) and expandable microsphere templates. Powder mixtures with a fixed PEOc content (30 wt%) and varying SiC filler contents from 0-21 wt% were compression-molded. During the pyrolysis process, the polysiloxane was converted to SiOC, the PEOc generated a considerable degree of interconnected porosity, and the expandable microspheres generated fine cells. The polysiloxane-derived SiOC and carbon black reacted and synthesized nano-sized SiC with a carbothermal reduction during a heat-treatment. Subsequent sintering of the compacts in a nitrogen atmosphere produced highly porous SiC ceramics with porosities ranging from 78 % to 82 % and a flexura lstrength of up to ~7 MPa.

• 전기화학회지
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• 제3권1호
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• pp.19-24
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• 2000

poly-Si TR는 LCD의 고해상도화, 고집적화에 따라 그 요구가 점점 필요해지고 있다. 그러나 poly-Si의 제조를 위해 주로 사용하는 레이저 결정화 방법은 박막 내에 함유된 수소 때문에 별도의 탈수소 공정을 행하는 실정이다. 막내의 수소는 결정화 시 eruption과 void등의 생성으로 poly Si의 막 특성뿐 아니라 소자 특성에도 나쁜 영향을 미치게 된다. 본 연구에서는 전술한 문제점을 제어하기 위해 mesh-type PECVD를 제안하고 저수소화 박막 증착에 관한 연구를 수행하였다. 증착된 비정질 Si 박막은 $300^{\circ}C$ 이하의 온도에서도 $1 at\%$ 이하의 낮은 수소 함유량을 가진 것으로 조사되었다. mesh에 의한 이런 결과는 막내에 함유되는 수소를 효과적으로 제어하고 별도의 탈수소 공정을 배제하여 공정 감소의 효과를 갖는 장점이 있다. 또한 제조된 비정질 Si을 이용하여 XeCl 레이저 결정화하여 그 거동을 조사하였는데 일반적인 거동과 달리 매우 넓은 공정 영역을 갖고 있는 것을 확인할 수 있었다 또한, 수소에 의한 표면 거칠기 문제는 발견되지 않았으며 비교적 조대하고 균일한 결정립 분포를 하는 것으로 조사되었다 본 결과는 레이저 결정화 공정의 안정성에 기여하고 소자 특성 향상에도 기여할 것으로 기대된다

• 한국산학기술학회논문지
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• 제8권2호
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• pp.195-200
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• 2007

최소선폭 $0.1{\mu}m$ 이하의 살리사이드 공정을 상정하여 $10nm-Ni_{0.5}Co_{0.5}/70\;nm-Poly-Si/200\;nm-SiO_2$ 구조로부터 쾌속 열처리를 이용해서 실리사이드 온도를 $600{\sim}1100^{\circ}C$까지 변화시키면서 복합실리사이드를 제조하고 이들의 면저항의 변화와 미세구조의 변화를 면저항 측정기와 TEM 수직단면, 오제이 두께 분석으로 확인하였다. 기존의 동일한 공정으로 제조된 니켈실리사이드에 비해 제안된 니켈 코발트 복합실리사이드는 $900^{\circ}C$까지 저저항을 유지시킬 수 있는 장점이 있었고 20nm 두께의 균일한 실리사이드 층을 폴리실리콘 상부에 형성시킬 수 있었다. 고온 처리시에는 복합실리사이드와 실리콘의 전기적으로 상분리되는 혼합현상으로 고저항 특성이 나타나는 문제를 확인하였다. 제안된 NiCo 합금 박막을 70nm 높이의 폴리실리콘 게이트를 가진 디바이스에 $900^{\circ}C$이하의 실리사이드화 온도에서 효과적으로 산리사이드 공정의 적용이 기대되었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.116-116
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• 2011

오늘날 표시장치는 경량, 고밀도, 고해상도 대면적화의 요구에 의해 TFT-LCD의 발전이 이루어졌다. TFT에는 반도체 재료로서, Poly-Si을 사용하는 Poly-Si TFT와 a-Si:H를 이용하는 a-Si;H TFT가 있는데 a-Si는 $350^{\circ}C$ 이하의 저온으로 제작이 가능하여 많이 사용되고 있다. 이러한 방향에 맞추어 bottom gate 구조의 a-Si TFT 실험을 진행하였다. P-type silicon substrate ($0.01{\sim}0.02{\Omega}-cm$)에 gate insulator 층인 SiNx (SiH4 : NH3 = 6:60)를 200nm 증착하였다. 그리고 그 위에 active layer 층인 a-Si (SiH4 : H2 : He =2.6 : 10 : 100)을 다른 RF power를 적용하여 100 nm 증착하였다. 그 위에 Source와 Drain 층은 Al 120 nm를 evaporator로 증착하였다. active layer, gate insulator 층은 ICP-CVD 장비를 이용하여 증착하였으며, 공정온도는 $300^{\circ}C$ 로 고정하였다. active layer층 증착시 RF power는 100W, 300W, 500W, 600W로 가변하였고, width/length는 100 um/8um로 고정하였다. 증착한 a-Si layer층을 Raman spectroscope, SEM 측정 하였으며, TFT 제작 후, VG-ID, VD-ID 측정을 통해 전기적 특성인 Threshold voltage, Subthreshold swing, Field effect mobility, ON/OFF current ratio를 비교해 보았다.

• 한국표면공학회지
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• 제47권6호
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• pp.354-361
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• 2014

In order to utilize silicon carbide (SiC) as an inner part of fluidized bed reactor (FBR) for manufacturing poly-silicon, we have carried out the thermodynamic calculation on the overall reactions including poly-silicon synthesis and compatibility of SiC with FBR process. The resources of silicon included $SiH_4(MS)$, $SiHCl_3(TCS)$ and $SiCl_4(STC)$ and the thermodynamic yield of the FBR with MS, TCS and STC were compared each other with variable range of temperature, pressure and hydrogen to silicon ratio. The silicon yield of MS, TCS and STC were 100%, 28% and 4%, respectively, throughout the conventional FBR conditions. Silicon carbide having high hardness and strength showed strong resistance to granule collisions during the FBR process using a lab-scale reactor. And it also showed quite good compatibility with the typical FBR processes of MS and TCS resources.

• Transactions on Electrical and Electronic Materials
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• 제4권1호
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• pp.15-20
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• 2003

NiCr alloys are prepared onto poly-Si/ $SiO_2$/Si substrates to replace Pt bottom electrode with a new one for integration of high dielectric constant materials. Alloys deposited at Ni and Cr power of 40 and 40 W showed optimum properties in the composition of N $i_{1.6}$C $r_{1.0}$. The grain size of films increases with increasing deposition temperature. The films deposited at 50$0^{\circ}C$ showed a severe agglomeration due to homogeneous nucleation. The NiCr alloys from the rms roughness and resistivity data showed a thermal stability independent of increasing annealing temperature. The 80 nm thick BST films deposited onto N $i_{1.6}$C $r_{1.0}$/poly-Si showed a dielectric constant of 280 and a dissipation factor of about 5 % at 100 kHz. The leakage current density of as-deposited BST films was about 5$\times$10$^{-7}$ A/$\textrm{cm}^2$ at an applied voltage of 1 V. The NiCr alloys are possible to replace Pt bottom electrode with new one to integrate f3r high dielectric constant materials.terials.

• Bulletin of the Korean Chemical Society
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• 제33권6호
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• pp.2031-2036
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• 2012

Melt copolymerization reactions of several bis(diethylamino)silane derivatives, bis(diethylamino)methylphenylsilane, bis(diethylamino)methyloctylsilane, 1,2-bis(diethylamino)tetramethyldisilane, and 1,3-bis(diethylamino) tetramethyldisiloxane, with 2,7-dihydroxyfluoren-9-one were carried out to yield poly[oxy(2,7-fluoren- 9-onenylene)oxy(diorganosilylene)]s bearing the fluoren-9-one fluorescent aromatic group in the polymer main chain: poly[oxy(2,7-fluoren-9-onenylene)oxy(methylphenylsilylene)], poly[oxy(2,7-fluoren-9-onenylene) oxy(methyloctylsilylene)], poly[oxy(2,7-fluoren-9-onenylene)oxy(tetramethyldisilylene)], and poly[oxy- (2,7-fluoren-9-onenylene)oxy(tetramethyldisiloxanylene)]. These polymeric materials are soluble in common organic solvents such as $CHCl_3$ and THF. FTIR spectra of all the materials reveal characteristic Si-O-C stretching frequencies at 1012-1018 $cm^{-1}$. In the THF solution, the prepared materials show strong maximum absorption peaks at 258-270 nm, strong maximum excitation peaks at 260-280 nm, and strong maximum fluorescence emission bands at 310-420 nm. TGA thermograms suggest that most of the polymers are essentially stable to $200^{\circ}C$ without any weight loss and up to $300^{\circ}C$ with only a weight loss of less than 5% in nitrogen.

• Bulletin of the Korean Chemical Society
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• 제21권3호
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• pp.291-294
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• 2000

The bulk photopolymerization of methyl methacrylate(MMA) with bis(silane)s such as 1,4-$C_6H_4(SiH_3)_2$ (1) and 1,4-$C_6H_4(SiH_2Me)_2$ (2) was performed to produce poly(MMA)s possessing the corresponding bis(silyl) moiety as an end group. For the bis(silane)s, while the polymerizaiton yields and the polymer molecular weights decreased, the TGA residue yields and the relative intensities of Si-H IR stretching bands increased as the relative bis(silane) concentration over MMA increased. The polymerizaion yield, polymer molecular weight, and TGA residue yield of MMA with 1 were found to be higher than those with 2. The bis(silane)s appears to influence significantly upon the photopolymerization of MMA as both chain initiation and chain transfer agents.

• 한국결정성장학회지
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• 제12권3호
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• pp.120-125
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• 2002

Si-wafers for solar cells were cast in a size of $50{\times}46{\times}0.5{\textrm}{mm}^3$ by vacuum casting method. The graphite mold coated by BN powder, which was to prevent the reaction of carbon with the molten silicon, was used. Without coating, the wetting and reaction of Si melt to graphite mold was very severe. In the case of BN coating, SiC was formed in the shape of tiny islands at the surface of Si wafer by the reaction between Si-melt and carbon of the graphite mold on the high temperature. The grain size was about 1 mm. The efficiency of Si solar cell was lower than that of Si solar cell fabricated on commercial single and poly crystalline Si wafer. The reason of low efficiency was discussed.