• Journal of the Korean Institute of Telematics and Electronics
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• v.7 no.2
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• pp.33-42
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• 1970

This report is concerned with the fahrication with the falricationof silicon VVC diode by the double diffusion planer technique. At first, some design charts for VVC diode were derived by considering the voltage-capacitance relations, the critical field intensity at the metallurgical junction, and the cut-off frequency of the diode. These charts enables the fabrication engineers to design VVC diode easily without going into the sophisticated design theory. We started with a 2.5 ohm-cm n-type epitaxial silicon wafer. The phosphorous was diffused by POCl3 impurity source. Then boron diffusion followed make hyperabrupt p-n junction by BN source. The maximum to minimum capacitance ratio of the diode as a tuning diode for a TV tuner made in these experiments was 4:1. Measured electrical characteristics of the sample diodes showed in good agreement with the theoretical expectations. Slicing and polishing technique of the silicon wafer and diffusion technique of the impurity atoms, which were employed in our study, are also stated briefly in this report.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.3
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• pp.289-294
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• 2012

There are several indicators to represent characteristics of chemical mechanical planarization (CMP) such as material removal rate (MRR), surface quality and removal uniformity on a wafer surface. Especially, the removal uniformity on the wafer edge is one of the most important issues since it gives a significant impact on the yield of chip production on a wafer. Non-uniform removal rate at the wafer edge (edge effect) is mainly induced by a non-uniform pressure from nonuniform pad curvature during CMP process, resulting in edge exclusion which means the region that cannot be made to a chip. For this reason, authors tried to minimize the edge exclusion by using an edge profile control (EPC) ring. The EPC ring is equipped on the polishing head with the wafer to protect a wafer from the edge effect. Experimental results showed that the EPC ring could dramatically minimize the edge exclusion of the wafer. This study shows a possibility to improve the yield of chip production without special design changes of the CMP equipment.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.11
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• pp.7773-7780
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• 2015

Analysis of existing kettle and its heating system has been the topic for localization technology development. Test pieces are made, polished and etched for existing kettle analysis. Surface of test pieces is observed using SEM, the kettle is verified to be made by deep drawing process from Ferrite-Perlite material. The kettle is also identified to be plated $16{\sim}49{\mu}m$ of thickness with Nickel(16%). Also heat transfer characteristics based on hot wire arrangement is investigated and optimal hot wire system is developed. Developed control system detects overheating and stops the whole system on the long operating time. Developed kettle takes the performance evaluation test for volume expansion and satisfied for standard 'KS G3602'.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.527-527
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• 2007

CMP가 1980년 IBM에 의해 반도체 웨이퍼의 표면 연마를 위해 적용된 후, 많은 연구 개발의 노력으로 반도체 집적회로의 제조 공정에서 필수 핵심기술이 되었으나, 소모자재(연마패드, 탄성지지대, 슬러리, 패드 컨디셔너)의 비용이 CMP 공정 비용의 70% 이상을 차지하는 등 제조단가가 높다는 단점을 극복할 수가 없었다. 특히, 고가의 슬러리가 차지하는 비중이 40% 이상을 넘고 있어, 슬러리 원액의 소모량을 줄이기 위한 연구들이 현재 활발히 연구 중이다. 슬러리의 변수로는 연마입자의 종류 및 특성, 용액의 pH, 연마입자의 슬러리내 안정성 등이 있다. 슬러리내 연마입자는 연마량과 균일도 측면에서 밀접한 관계를 가지고 있다. 또한, 연마제의 영향에 따라 연마율의 차이 즉, CMP 특성의 변화를 보이고 있기 때문에 투입량 또한 최적화가 필요하다. 본 연구에서는 새로운 연마제의 특성을 알아보기 위해 탈이온수(de-ionized water; DIW)에 $CeO_2,\;MnO_2,\;ZrO_2$ 등을 첨가한 후 분산시간에 따른 연마 특성과 atomic force microscopy (AFM)분석을 통해 표면 거칠기를 비교 분석하였다. 그리고, 세 가지 종류의 연마제를 각각 1wt%, 3wt%, 5wt% 첨가하여 산화막에 대한 CMP 특성을 알아본 후, scanning electron microscopy (SEM) 측정과 입도 분석을 통해 그 가능성을 알아보았다.

• Tunnel and Underground Space
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• v.8 no.4
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• pp.332-341
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• 1998

Conventional polishing of stone panel edges has been done by hand. While this has changed somewhat with the advent of automatic machines, it is still very much a hand finishing technology. For the development of edge shape milling tool, the primary test on characteristics of edge shape milling tool was carried out. This paper presents the results of tests focused upon the milling capability that was varied by the variables of operation parameters. Author tried to confirm the effect of six operation parameters of equipment such as rotation speed, advance speed, applied load, water flow rate and rotational direction. The result from test was described in term of shape milling capability that was defined as cutting volume of rock by unit weight of tool wear. The variance of the results could indicate the optimum level of each operating parameters. The test was also carried out to determine the abrasion resistance varied according to the abrasive flow rate. The abrasion resistance was increased with the abrasive flow rate, but over some rate it was not changed.

• Korean Journal of Optics and Photonics
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• v.19 no.4
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• pp.249-254
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• 2008

We developed a new x-ray image sensor utilizing a reflection-mode liquid crystal panel as its sensitive element, and tested its functionality by using it to obtain an x-ray image of a printed circuit board. In the liquid crystal x-ray image sensors hitherto reported, the liquid crystal layer is in direct contact with the photoconductive film which is deposited on a glass substrate. In the fabrication of the new x-ray image sensor, a liquid crystal panel is fabricated in the first step by using a pair of glass plates of a few centimeters thicknrss. Then one of the glass substrates is ground until its thickness is reduced to about $60\;{\mu}m$. After polishing the glass plate, dielectric films for high reflectance at 630 nm, a film of amorphous selenium for photoconduction, and a transparent conductive film for electrode are deposited in sequence. The new x-ray image sensor has several merits: primarily, fabrication of a large area sensor is more easily compared with the old fashioned x-ray image sensors. Since the reflection type liquid crystal panel has a very steep response curve, the new x-ray sensor has much more sensitivity to x-rays compared with the conventional x-ray area sensor, and the radiation dosage can be reduced down to less then 20%. By combining the new x-ray sensor with CCD camera technology, real-time x-ray images can be easily captured. We report the structure, fabrication process and characteristics of the new x-ray image sensor.

• Journal of Korea Entertainment Industry Association
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• v.15 no.4
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• pp.101-111
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• 2021

This paper is a study that analyzes the use and techniques of rap in music that entered Melon Chart, one of the major music sites in Korea, during 2020. Among the songs that entered the chart, reflecting the public's preference, the trend of rap music, an important element of hip-hop music, is analyzed and musical features such as representative artists or frequently used rhythm patterns are analyzed. Through this paper, characteristics of rap music favored by the public and artists in recent popular music have been organized and formalized, and based on this, the elements of etude development for technical polishing are summarized. Through this, it is hoped that just like the long-time analyzed and structured performance techniques such as vocals and instruments, various styles of rap music can develop into a systematic and step-by-step technique system for students who want to learn and practice it.

• Tribology and Lubricants
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• v.39 no.1
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• pp.28-34
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• 2023

Because of their cleanliness, low friction, and high stiffness, aerostatic bearings are used in numerous applications. Aerostic bearings that use porous materials as means of flow restriction have higher stiffness than other types of bearings and have been successfully applied as guide bearings, which have high motion accuracy requirements. However, the performances of porous bearings exhibit strong nonlinearity and can vary considerably depending on design parameters. Therefore, accurate prediction of the performance characteristics of porous bearings is necessary or their successful application. This study presents a porous bearing design and performance analysis for a spindle used in wafer polishing. The Reynolds and Darcy flow equations are solved to calculate the pressures in the lubrication film and porous busing, respectively. To verify the validity of the proposed analytical model, the calculated pressure distribution in the designed bearing is compared with that derived from previous research. Additional parametric studies are performed to determine the optimal design parameters. Analytical results show that optimal design parameters that obtain the maximum stiffness can be derived. In addition, the results show that cross-coupled stiffness increases with rotating speed. Thus, issues related to stability should be investigated at the design stage.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.6
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• pp.4237-4244
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• 2015

This study examined the efflorescence characteristics of a concrete sidewalk block manufactured using recycled stone powder sludge and photocatalytic generated by surface polishing during the sidewalk block manufacturing process. The study evaluated the characteristics of the sidewalk block in terms of its quality, based on the amount of stone powder sludge used, efflorescence, and further based on the mixing ratio and number of applications of the photocatalytic. The experimental results indicated that heavy metals such as lead, hexavalent chrome, cadmium, and mercury were not present in the concrete sidewalk block, thereby confirming the effectiveness of the recycled stone powder sludge. The optimum mixing ratio of used in the concrete sidewalk block (for satisfying KS standard values such as water absorption ratio and flexural strength) was found to be 20%. The concrete sidewalk block incorporating the stone powder sludge and photocatalytic exhibited a water absorption ratio of 5.4% and flexural strength of 5.2 MPa, thereby satisfying the quality standards. Additionally, when the photocatalytic was used, efflorescence did not occur even at the low temperature of $-5^{\circ}C$, and the by the sidewalk block was found to be 70% under normal conditions and 68% when subjected to an accelerated weathering test.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.39-45
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• 2012

Three-dimensional integrated circuit(3D IC) technology has become increasingly important due to the demand for high system performance and functionality. In this work, BOE and HF wet etching of Cu line surfaces after CMP were conducted for Cu-Cu pattern direct bonding. Step height of Cu and $SiO_2$ as well as Cu dishing after Cu CMP were analyzed by the 3D-Profiler. Step height increased and Cu dishing decreased with increasing BOE and HF wet etching times. XPS analysis of Cu surface revealed that Cu surface oxide layer was partially removed by BOE and HF wet etching treatment. BOE treatment showed not only the effective $SiO_2$ etching but also reduced dishing and Cu surface oxide rather than HF treatment, which can be used as an meaningful process data for reliable Cu-Cu pattern bonding characteristics.