• Journal of the Korean Society for Precision Engineering
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• v.17 no.4
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• pp.69-80
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• 2000

Generally, die polishing is a lime consuming process, resulting in 30∼50％ of the whole die manufacturing time. However, die polishing has not been automated yet, since it needs a great deal of experience and skill. This paper describes a new development of automated system for die polishing and focuses on the successful achievements of the element techniques to realize from hand skill to automation, as followings: (1) The 5 axes polishing system by the aid of robot with 2 degrees of freedom, is developed for the application of curved surface die. (2) The CAM system realizes a 5 axes tool path control for polishing and measuring. (3) The conductive elastic tool is able to meet curved surfaces of die and gives a high efficient and quality polishing characteristics. (4) The surface roughness measurement device with noncontact laser is developed and has a high reliability without surface damage.

• Transactions of Materials Processing
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• v.21 no.2
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• pp.138-143
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• 2012

A polishing method using magnetorheological (MR) fluid has been developed as a new precision technique to obtain a fine surface. The process uses a MR fluid that consists of magnetic carbonyl iron (CI) particles, nonmagnetic polishing abrasives, water and stabilizers. But the CI particles in MR fluids cause a severe corrosion problem. When coated with Xanthan gum, the CI particles showed long-term stability in corrosive aqueous environment. The surface roughness obtained from the MR polishing process was evaluated. A series of experiments were performed on fused silica glass using prepared slurries and various process conditions, including different polishing times. Outstanding surface roughness of Ra=2.27nm was obtained on the fused silica glass. The present polishing method could be used to produce ultra-precision micro parts.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.5
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• pp.848-854
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• 2012

SCM420 steel cutting gear to improve the durability is quenched. When quenching, increases surface hardness, a change of the physical properties and machinability or fall. This study, using a solid carbide hobs skiving hobbing gear cutting finishing. And cutting tool solid carbide TiAlN coating hove when TiAlN coating on the surface of multi-con polishing hob conducted aero lap nano polishing for each cutting. Experimental results conducted aero lap nano coating on the surface polishing tool machinability was excellent. And aero lap nano polishing tool results were reduced 2.5 times the tool wear compared to TiAlN coated tools. Excellent results were 1.42 times longer tool life.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.525-529
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• 1999

A cone shape drum polisher was developed to make up for the demerits of conventional CMP apparatus. The developed equipment has several superiorities. First of all, it can achieve uniform velocity profile on all the contact line because of its shape and easy to control the amount of slurry at the position of use. The whole area of wafer surface is exposed to the visual area except the contact line between wafer and drum, hence we can detect polishing end point more easily than any other polishing equipments. Also it has additional merits such as small foot print and polishing load. Polishing characteristics were investigated by developed equipment.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.7
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• pp.311-315
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• 2002

Chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD), inter-level dielectric (ILD) layers of multi-layer interconnections. In this paper, we studied the characteristics of polishing pad, which can apply shallow trench isolation (STI)-CMP process for global planarization of multi-level interconnection structure. Also, we investigated the effects of different sets of polishing pad, such as soft and hard pad. As an experimental result, hard pad showed center-fast type, and soft pad showed edge-fast type. Totally, the defect level has shown little difference, however, the counts of scratch was detected less than 2 on JR111 pad. Through the above results, we can select optimum polishing pad, so we can expect the improvements of throughput and device yield.

• Design & Manufacturing
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• v.13 no.3
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• pp.12-18
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• 2019

Fluid jet polishing is a method of jetting a fluid to polish a concave or free-form surface. However, the fluid jet method is difficult to form a stable polishing spot because of the lack of concentration. In order to solve this problem, MR fluid jet polishing system using an abrasive mixed with an MR fluid whose viscosity changes according to the intensity of a magnetic field is under study. MR fluid jet polishing is not easy to formulate for precise optimal conditions and material removal due to numerous fluid compositions and process conditions. Therefore, in this paper, quantitative data on the factors that have significant influence on the machining conditions are presented using various simulations and the correlation studies are conducted. In order to verify applicability of the fabricated MR fluid jet polishing system by nozzle diameter, the flow pattern and velocity distribution of MR fluid and polishing slurry of MR fluid jet polishing were analyzed by flow analysis and shear stress due to magnetic field changes was analyzed. The MR fluid of the MR fluid jet polishing and the flow pattern and velocity distribution of the polishing slurry were analyzed according to the nozzle diameter and the effects of nozzle diameter on the polishing effect were discussed. The analysis showed that the maximum shear stress was 0.45 mm at the diameter of 0.5 mm, 0.73 mm at 1.0 mm, and 1.24 mm at 1.5 mm. The cross-sectional shape is symmetrical and smooth W-shape is generated, which is consistent with typical fluid spray polishing result. Therefore, it was confirmed that the high-quality surface polishing process can be stably performed using the developed system.

• Journal of the korean academy of Pediatric Dentistry
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• v.43 no.3
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• pp.275-283
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• 2016

The aim of this study was to evaluate the surface characteristics of composite resins polished with two different polishing methods. 30 disk-shaped specimens were prepared with microhybrid (Filtek$^{TM}$ Z250) and nanofilled (Filtek$^{TM}$ Z350) resins respectively, and classified into three groups: not polished as controls, polished by an abrasive disk (Soflex), and polished by a polishing brush (Occlubrush). Surface roughness was increased after polishing. In terms of micro-roughness, there were no significant differences between the two polishing methods. But macro-roughness values were markedly increased in the Occlubrush group (p < 0.05). In the Sof-lex group, the matrix and fillers were polished together, resulting into a smoother and homogeneous surface. However, in the Occlubrush group, the matrix layer was torn off, with more heterogeneous surfaces and large scratches. In regards to micro-hardness, no significant differences were observed between the two polishing systems (p > 0.05). And the hardness value increased about 25% after polishing. In conclusion, the method of polishing should be chosen deliberately in view of the hardness characteristics of composite resins. Sof-lex is recommended to improve the surface characteristics of polished resins.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.7 s.238
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• pp.983-989
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• 2005

The effects of mechanical parameters on the characteristics of chemical mechanical polishing(CMP) can be directly evaluated by friction force. The piezoelectric quartz sensor for friction force measurement was installed, and friction force could be detected during CMP process. Furthermore, friction energy can be calculated by multiplying relative velocity by integration of the friction force throughout the polishing time. $SiO_2$ slurry for interlayer dielectric(ILD) CMP was used in this experiment to consider the relation of frictional characteristics and polishing results. From this experiment, it is proven that the friction energy is an essential factor of removal rate. Also, the friction force is related to removal amount per unit length(dH/ds) and friction energy has corelation to the removal rate(dH/dt) and process temporature. Moreover, within wafer non-unifornity(WIWNU) is related to coefficient of friction because of the mechanical moment equilibrium. Therefore, the prediction of polishing result would be possible by measuring friction force.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1014-1020
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• 2003

We have developed the ultrasonic polishing system to get super finishing that consist of machine part that can rotate and travel the main shaft with power 1.5kW, ultrasonic generator with frequency 20kHz. By using this system we were investigated the characteristics of ultrasonic polishing and deduced the major facters which affect the surface roughness by the experimental plans for three different materials such as ceramic, glass, and wafer, and so could be obtained following results. We could be obtained the excellent surface for hard-to-difficult cutting materials. The rotating speed could be found to be major factor influencing the surface roughness. In the case of ceramic and wafer, we were able to obtain good surface roughness when the feed rate and ultrasonic output is higher. In the case of glass, the surface roughness becames worse when ultrasonic output is higher because of increasing of load affacting on the particles in slurry.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.5
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• pp.90-95
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• 2007

Single side final polishing is a very important role to stabilize a wafer finally before the device process on the wafer is executed. In this study, the machining variables, such as pressure, machining time, and the velocity of pad table were adopted. These parameters have the major influence on the characteristics of wafer polishing. We investigated the surface roughness changing these variables to find the optimal polishing condition. Pad, slurry, slurry quantity, and oscillation distance were set to the fixed variables. In order to reduce defects and find a stable machining condition, a hall sensor was used on the polishing process. AE sensor was attached to the polishing machine to verify optimal condition. Applying data analysis of the sensor signal, experiments were performed. We can get better surface roughness from loading the quasi static force and improving wafer-holding method.