• Title/Summary/Keyword: polishing characteristic

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About The Root Finder of The High Order Characteristic Equation In Prony Analysis (프로니 해석시 나타나는 고차 특성 방정식 해법에 대하여)

  • Hong, Jun-Hee;Cho, Kyung-rae;Jeong, Byung-Tae;Son, Kwang-Myoung;Park, Jong-Keun
    • Proceedings of the KIEE Conference
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    • 1994.11a
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    • pp.78-80
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    • 1994
  • Conventional methods for root finding of the algebraic equations are intrinsically synthetic division methods, i.e., which are the factorization in forms of $f(x)=(x-x_i)Q(x)$. So existing methods have some demerits such as deflation and root-polishing procedures. To overcome these defects a new powerful algorithm, namely circular arithmetic algorithm(CSM), was introduced and has been investigated about its fascinating properties. In this paper, we will propose a simple and effective method of getting the initial guesses for the roots of the equation. With this method the CSM can me all the root of equation with great efficiency.

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The Effect of Slurry flow Rate and Temperature on CMP Characteristic (슬러리 온도 및 유량에 따른 CMP 연마특성)

  • 정영석;김형재;최재영;정해도
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.11
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    • pp.46-52
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    • 2004
  • CMP (Chemical-Mechanical Polishing) is a process in which both chemical and mechanical mechanisms act simultaneously to produce the planarized wafer. CMP process is an extensive usage and continuing high growth rates in the semiconductor industry. The understanding of the process, however, is much slower. The nature of material removal from the wafer is still undefined and ambiguous. Material removal rate according to the slurry flow rate is also undefined and ambiguous. Thus, in this study, the basic mechanism of material removal rate as slurry flow rate is defined in terms of energy supply and energy loss.

Development of the Measurement System for Evaluating Mechanical Properties of Nano-diamond Coated Film (나노 다이아몬드 코팅박막의 기계적 특성 평가를 위한 계측시스템의 개발)

  • Kweon, Hyun Kyu;Lee, So Jin;Kweon, Yong Min
    • Journal of the Semiconductor & Display Technology
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    • v.18 no.1
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    • pp.25-31
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    • 2019
  • In this study, a new adhesion evaluating equipment and data processing methods were developed to overcome some limitations of existing evaluating equipment. Nano-diamond coated tool is a specimen of experiment. When applying frictional force and shear force on the specimen by a rotating polishing pad, delamination occurs at a moment. During each experiment, the vibration, load, and torque is obtained by accelerometer, loadcell and torque s+ kpensor. Frictional force and coefficient of friction are obtained by calculating torque and load. Based on FFT transformation, acceleration is processed and analyzed. As a result, the moment of delamination and the load at that time can be detected by the new developed equipment and measurement system. Finally, we call this load as an Adhesion force.

Immersion Corrosion Characteristic of SUS420J2 Steel with a Material for Fish Pre-Processing Machinery (어류 전처리 가공기계용 재료 SUS420J2강의 침지부식 특성)

  • 김선진;안석환;최대검;정현철;김상수
    • Journal of the Korean Society of Fisheries and Ocean Technology
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    • v.38 no.1
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    • pp.79-88
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    • 2002
  • 13%Cr martensitic stainless steel has been used mainly with a material for fish pre-processing machinery. However, it has not very nice cutting section because of little of the carbon content. Therefore, SUS420J2 steel that contents 0.3%C with high-strength in spite of the rust is used with a material for fish pre-processing machinery. However, studies on the corrosion characteristics of SUS420J2 steel are relatively rare. Especially, the corrosion phenomenon may cause serious degradation because the fish pre-processing machinery is exposed always to seawater environment. In this paper, the immersion corrosion test was carried out at seawater environment (pH=7.52) on SUS420J2 steel specimens that have various post-treatment conditions and its corrosion characteristics were evaluated. From test results, the specimens such as base metal, vacuum heat treatment, electrolytic polishing and tempering after quenching tend somewhat sensitive from the corrosion. In the case of vacuum heat treatment specimen of continuous immersion during 360 days, the weight loss ratio was high about seven times when compared with the different specimens. On the contrary, SUS420J2 steel specimen that has the heat treatment of tempering after quenching and the electrolytic polishing was less sensitive from the corrosion, and the weight loss ratio was very low.

A STUDY ON THE MICROSTRUCTURES OF THE AMALGAM ALLOYS AND AMALGAMS (치과용 아말감합금 및 아말감의 마세구조에 관한 연구)

  • Yeon, Sang-Heum;Lee, Chung-Sik;Lee, Myung-Jong;Um, Chung-Moon
    • Restorative Dentistry and Endodontics
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    • v.21 no.1
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    • pp.87-105
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    • 1996
  • The purpose of this study is to investigate the characteristics of the compositions and phases of amalgam alloys and amalgams by using EMPA and X-ray diffractometer. Each specimen was made from Caulk Fine Cut Clow copper lathe cut amalgam), Caulk Spherical (low copper spherical amalgam), Tytin (high copper unicorn position amalgam), Dispersally (high copper admixed amalgam) and Valiant (Palladium enriched amalgam). For preparing amalgam alloys, Tytin and Valiant were used as powder forms and the others were used as tablet forms after being polished with polishing machine. For preparing amalgams, each amalgam alloy and Hg were measured, and triturated by mechanical amalgamater according to user's instructions. After triturating, the triturated mass was inserted to cylindrical metal mold and simultaneously adapted by cylindrical condenser with same diameter and condensed by Instron universal testing machine with 80kg pressure & 1mm/min speed. Each specimen was removed from the metal mold and stored at room temperature for a week. The specimen was polished with the same polishing machine for amalgam alloy. For observation of microstructure and analysis of composition of amalgam alloys and amalgams, EMPA was used to get secondary electron images, backscattered images and characteristic X-ray images of Ag, Sn, Cu, Zn, Hg. To analyze compositions of amalgam alloys and amalgams, X-ray diffractometer was used. Amalgam alloys were scanned at the range of 2${\theta}$ of 30-$85^{\circ}$ and the speed of $4^{\circ}$/min with Cuka line and amalgams were scanned at the range of 2${\theta}$ of 28-$44^{\circ}$ and the speed of $4^{\circ}$/min with Cuka line. By comparing obtained d(distance between surfaces) and d of expected phases and atoms in amalgam alloys and amalgams in ASTM card, phases and atoms were identified. The results were as follows, 1. In Caulk Fine Cut amalgam alloy typical ${\gamma}$ phase was shown, and in amalgam, ${\gamma}$, ${\gamma}_1$ and ${\gamma}_2$ phases were observed. 2. In Caulk Spherical amalgam alloy ${\gamma}$, Ag, Cu and $\varepsilon$ phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, ${\gamma}_2$ and $\eta$ phases were observed. 3. In Tytin amalgam alloy ${\gamma}$, Cu and $\varepsilon$ phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, $\eta$ and $\varepsilon$ phases were observed. 4. In Dispersalloy ${\gamma}$, Ag, Cu and $\varepsilon$ phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, $\eta$ and $\varepsilon$ phases were observed. 5. In Valiant alloy ${\gamma}$, Cu and e phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, $\eta$ and $\varepsilon$ phases were observed.

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Fiber-Optic Directional Coupler Using HF Wet-Etching (플루오린화 수소산의 습식식각법을 이용한 광섬유형 방향성 결합기)

  • Son, Gyeongho;Jung, Youngho;Yu, Kyoungsik
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.28 no.1
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    • pp.25-32
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    • 2017
  • In this paper, a fabrication method of low-loss tapered optical fibers coupler using hydrofluoric acid with surface tension driven is proposed. The proposed fabrication method is very simple compared to flame-based method, and shows low excess insertion losses compared to polishing method. The adiabatic-tapered structure along the coupling region of the coupler shows wavelength independent characteristic over the C-band in optical communication system, and will enable promising applications.

A Study of Aesthetical Value of Composition principle on Security Guard Martial Arts (경호무도 구성 원리의 미학적 탐색)

  • Jeong, Yeon-Wan;Hong, Eun-Sun
    • Journal of the Society of Disaster Information
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    • v.5 no.2
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    • pp.108-122
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    • 2009
  • Purpose of this research about reduction the scholastic systematic triangular position of the security guard martial art which repeats a development is insufficient with demand of the while society to recognize and for the philosophic value research of security guard martial art composition principle puts out with the one method and from the reporter to search the aesthetics which appears does. In order to attain the goal of the research which sees the literature which relates with an security guard martial art widly, was an investigation and observed the aesthetics from concept and martial art of aesthetics and this the technical free use ability from actual site of the technical find which leads the practice voluntary repetition practice of security guard martial art with character and the body guard aesthetic integral part experience possibly did, there being will be able to acquire an aesthetic inspiration, confirmed. So the security guard martial art follows the composition principle of maximization central attitude and shock point breath control and mental intensive etc. of reinforcement of direction shock of relativity redundancy mental moral culture body agreement characteristic force and relaxation force and is completed and will be able to embody an aesthetic value with aesthetic elements of technical polishing process inside goes about reduction.

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Effect of Surface Treatments of Polycrystalline 3C-SiC Thin Films on Ohmic Contact for Extreme Environment MEMS Applications (극한 환경 MEMS용 옴익 접촉을 위한 다결정 3C-SiC 박막의 표면 처리 효과)

  • Chung, Gwiy-Sang;Ohn, Chang-Min
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.20 no.3
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    • pp.234-239
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    • 2007
  • This paper describes the TiW ohmic contact characteristics under the surface treatment of the polycrystalline 3C-SiC thin film grown on $SiO_2/Si(100)$ wafers by APCVD. The poly 3C-SiC surface was polished by using CMP(chemical mechanical polishing) process and then oxidized by wet-oxidation process, and finally removed SiC oxide layers. A TiW thin film as a metalization process was deposited on the surface treated poly 3C-SiC layer and was annealed through a RTA(rapid thermal annealing) process. TiW/poly 3C-SiC was investigated to get mechanical, physical, and electrical characteristics using SEM, XRD, XPS, AFM, optical microscope, I-V characteristic, and four-point probe, respectively. Contact resistivity of the surface treated 3C-SiC was measured as the lowest $1.2{\times}10^{-5}{\Omega}cm^2$ at $900^{\circ}C$ for 45 sec. Therefore, the surface treatments of poly 3C-SiC are necessary to get better contact resistance for extreme environment MEMS applications.

Consumable Approaches of Polysilicon MEMS CMP

  • Park, Sung-Min;Jeong, Suk-Hoon;Jeong, Moon-Ki;Park, Boum-Young;Jeong, Hae-Do;Kim, Hyoung-Jae
    • Transactions on Electrical and Electronic Materials
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    • v.7 no.4
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    • pp.157-162
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    • 2006
  • Chemical-mechanical polishing (CMP), one of the dominant technology for ULSI planarization, is used to flatten the micro electro-mechanical systems (MEMS) structures. The objective of this paper is to achieve good planarization of the deposited film and to improve deposition efficiency of subsequent layer structures by using surface-micromachining process in MEMS technology. Planarization characteristic of poly-Si film deposited on thin oxide layer with MEMS structures is evaluated with different slurries. Patterns used for this research have shapes of square, density, line, hole, pillar, and micro engine part. Advantages of CMP process for MEMS structures are observed respectively by using the test patterns with structures larger than 1 urn line width. Preliminary tests for material selectivity of poly-Si and oxide are conducted with two types of silica slurries: $ILD1300^{TM}\;and\;Nalco2371^{TM}$. And then, the experiments were conducted based on the pretest. A selectivity and pH adjustment of slurry affected largely step heights of MEMS structures. These results would be anticipated as an important bridge stone to manufacture MEMS CMP slurry.

A Study on the Characteristics of Electro Polishing and Utility Materials for Transit High Purity Gas (청정도 가스 이송용 재료의 특성과 전해연마에 관한 연구)

  • Lee, Jong-Hyung;Park, Shin-Kyu;Yang, Seong-Hyeon
    • Journal of the Korean Society of Industry Convergence
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    • v.7 no.3
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    • pp.259-263
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    • 2004
  • In the manufacture progress of LCD or semiconductor, there are used many kinds of gas like erosion gas, dilution gas, toxic gas as a progress which used these gas there are required high puritize to increase accumulation rate of semiconductor or LCD materials work progress of semiconductor or LCD it demand many things like the material which could minimize metallic dust that could be occured by reaction between gas and transfer pipe laying material, illumination of the surface, emition of the gas, metal liquation, welding etc also demand quality geting stricted. Material-Low-sulfur-contend (0.007-0010), vacuum-arc-remelt(VAR), seamless, high-purity tubing material is recommend for enhance welding lower surface defect density All wetted stainless steel surface must be 316LSS elecrto polishinged with ${\leq}0.254{\mu}m$($10.0{\mu}in$) Ra average surface finish, $Cr/Fe{\geq}1.1$ and $Cr_2O_3$ thickness ${\geq}25{\AA}$ From the AES analytical the oxide layer thickness (23.5~36 angstroms silicon dioxide equivalent) and chromum to iron ratios is similar to those generally found on electropolished stainless steel., molybdenum and silicon contaminants ; elements characteristic of stainless steel (iron, nickel and chromium); and oxygen were found on the surface Phosphorus and nitrogen are common contaminants from the electropolish and passivation steps.

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