• 제목/요약/키워드: point-contact

검색결과 1,218건 처리시간 0.026초

Bending Strain Effect on the Critical Current of Jointed BSCCO Tapes

  • Shin, Hyung-Seop;Dedicatoria, Marlon
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 추계학술대회 논문집
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    • pp.217-217
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    • 2009
  • In this study, the effect of bending strain on the transport property and critical current of lap and butt-jointed BSCCO tapes have been investigated. The samples were joined using a mechanically controlled jointing procedure. In order to ensure a uniform pressure application at the joint part, a single point contact has been devised and also to achieve a uniform thickness at the joint interface.

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$CO_2$ 레이저 주파수 측정용 점접촉 MIM 다이오드 (Point-Contact MIM Diode at $CO_2$ Laser Freqiencies)

  • 조재홍;윤태현;박정환;원종욱
    • 한국광학회:학술대회논문집
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    • 한국광학회 1990년도 광학 및 양자전자학 워크샵
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    • pp.133-138
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    • 1990
  • 점접촉 MIM (Metal-Insulator-Metal) 다이오드는 레이저 광속의 검출기, 고조파 발생기 및 믹서로 사용되며, 그 검출범위가 수십 THz의 주파수 영역까지 가능하다. 이러한 MIM 다이오드의 여러사기 변수들에 대한 감응도를 측정하였으며, 이들의 특성을 조사하기 위한 관원으로는 10P(36) line의 CO2 레이저 광속을 이용했다. 또한 제작된 점접촉 MIM 다이오드를 이용하여 두 CO2레이저 사이의 주파수 차이에 의한 맥놀이 주파수를 측정하였다. 그리고 MIM 다이오드에서 발견된 초퍼의 초핑 주파수에 의한 비선형 현상을 논하였다.

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일점 접촉 문제를 고려한 선형 초음파모터 해석 (Analysis of a Linear Ultrasonic Motor Considering One Point Contact Mechanism)

  • 이경표;노종석;정현교
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2008년도 추계학술대회 논문집 전기기기 및 에너지변환시스템부문
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    • pp.77-79
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    • 2008
  • 본 논문에서는 고리모양 판의 멀티모드를 이용하여 동작하는 선형 초음파모터에 대한 해석방범을 제시하였다. 고정자의 변위는 3D 유한요소법을 이용하여 해석하였으며, 시간에 따른 접촉 면적과 접촉표면의 운동속도의 변화를 반영한 해석적 방법을 이용하여 고정자와 이동자 사이의 접촉을 해석하였다. 해석방법 검증을 위하여 외경 10.00mm, 두께 1.00mm인 선형 초음파모터 모델에 대한 해석결과를 실험결과와 비교하였다.

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소규모 건설현장의 효율적인 기술지원 방안 연구 (A Study on the Efficient Technical Assistance for Small-sized Construction Sites)

  • 이기태
    • 한국안전학회지
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    • 제21권5호
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    • pp.72-76
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    • 2006
  • This study deals with problems of technical assistance through accidents analysis and questionnaires on small-sized construction sites which are difficult to understand real condition and administrate legally and indicated following efficient methods of technical assistance. (1) Ensuring access to the small-sized construction sites. (2) Delegation technical assistance service to civilian and supporting selected. (3) Raising of the person's safe consciousness concerned with the small-sized construction sites. (4) Safety consulting for the head office of small-sized construction sites.

소비자의 제조물책임에 대한 태도 (Investigation of Consumers' Attitudes toward Product Liability)

  • 양덕순
    • 대한가정학회지
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    • 제35권3호
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    • pp.259-274
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    • 1997
  • This research explores the consumer perspective on several questions relating to product liability. The purpose of this study was (1) to assess consumers' attitudes level toward product liability, and (2) to identify respondents' socio-economic and consumer related variables that influence attitudes toward product liability. Data were collected from questionaires with 319 adults who were residents of Seoul. This paper presents the results of general agreement(2.59-3.58 by 4 point likert) concerning important issues related product liability. The attitudes toward product liability were significant partly according to education level, job, monthly family income, consumer education experience, the experience of reading journals, consumer information contact frequency and product safety orientation.

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마이크로콤퓨터에 의한 방향성 승합 엘리베이터 운전 시스템 제어의 실험적 연구 (Experimental study on control of selective-collective elevator drive system using microcomputer)

  • 황희륭;이영욱;김수운
    • 전기의세계
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    • 제30권1호
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    • pp.55-63
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    • 1981
  • This paper deals with the drive contrl of common elevator systems which may be realized with .mu.p-controlled selective-collective elevator systems. Incorporation on non-contact point circuits instead of electromagnetic relays in such an elevator system results in miniaturization of complicated hardware controllers currently being used. The drive control method is implemented by software programming. The important features are not only technical advantages such as higher performance, high speed data processing and more improved reliability, but also lower cost as compared with the conventional elevator drive control units equipped with a number of sequential electromagnetic relays and even more recent static IC logic circuits.

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시뮬레이션을 통한 콜센터의 성능 개선 (Enhancing the Performance of Call Center using Simulation)

  • 김윤배;이창헌;김재범;이계신;이병철
    • 한국시뮬레이션학회논문지
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    • 제12권4호
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    • pp.83-94
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    • 2003
  • Managing a call center is a complex and diverse challenge. Call center becomes a very important contact point and a data ware house for successful CRM. Improving performance of call center is critical and valuable for providing better service. In this study we applied forecasting technique to estimate incoming calls and ProModel based simulation model to enhance performance of a mobile telecommunication company's call center. The simulation study shows reduction in managing cost and better customer's satisfaction.

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영상처리를 이용한 구조물 변위측정을 위한 고속 알고리즘 (High Speed Image Processing Algorithm for Structure Displacement Measurement)

  • 오주성;이종운
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2006년도 하계종합학술대회
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    • pp.835-836
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    • 2006
  • For non-contact structure vibration displacement measurement system, an algorithm for image processing using high speed CCD camera is introduced. The system sets the target to the structure, take picture using camera and image processing is performed to display the vibration data. The algorithm flow is basic preprocessing, projection data generation and curve fitting to find three crossing points for calibration or one center point in limited area.

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거친 가공표면 형상의 고정밀 측정법 개발 (Precision Profile Measurement on Roughly Processed Surfaces)

  • 김병창;이세한
    • 한국기계가공학회지
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    • 제7권1호
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    • pp.47-52
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    • 2008
  • We present a 3-D profiler specially devised for the profile measurement of rough surfaces that are difficult to be measured with conventional non-contact interferometer. The profiler comprises multiple two-point-diffraction sources made of single-mode optical fibers. Test measurement proves that the proposed profiler is well suited for the warpage inspection of microelectronics components with rough surface, such as unpolished backsides of silicon wafers and plastic molds of integrated-circuit chip package.

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