• Title/Summary/Keyword: plated structure

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Liquid Culture Enhances Protoplast Formation from the Auxotroph (Ser-) of lentinula edodes

  • Kim, Chae-Kyun;Kim, Byong-Kak
    • Archives of Pharmacal Research
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    • v.20 no.3
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    • pp.206-211
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    • 1997
  • The optimal conditions for the production and regeneration of the protoplasts from Lentinula edodes were studied. Protoplast formation from the mycelia of L. edodes which were cultured in liquid medium showed a significantly high yield compared with that of the mycelia which were cultured on cellophane covered agar media. A mixture of Novozyme 234 (15 mg/ml) and Cellulase Onozuka R10 (10 mg/ml) in 0.6 M mannitol (pH 4) was optimal lytic enzyme for the protoplast release. The optimal incubation time and mycelia age were 3.5-4 hours at $30^{\circ}C$ and 6-8 days, respectively. Regeneration frequency was 0.18% plated onto a medium containing 0.6 M sucrose, and 0.08% plated onto a medium containing mannitol. But hardly any regeneration was observed in the media containing NaCl, KCl, or $MgSO_{4}$ More than 90% of the protoplasts contained nuclei and the nucleus number per protoplast was 1.1. The DNA content per nucleus was 5.1 pg. The diameter of the protoplast was $3-5{\mu}m$ and it had a well defined cell structure.

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Analysis of Ni/Cu Metallization to Investigate an Adhesive Front Contact for Crystalline-Silicon Solar Cells

  • Lee, Sang Hee;Rehman, Atteq ur;Shin, Eun Gu;Lee, Doo Won;Lee, Soo Hong
    • Journal of the Optical Society of Korea
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    • v.19 no.3
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    • pp.217-221
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    • 2015
  • Developing a metallization that has low cost and high efficiency is essential in solar-cell industries, to replace expensive silver-based metallization. Ni/Cu two-step metallization is one way to reduce the cost of solar cells, because the price of copper is about 100 times less than that of silver. Alkaline electroless plating was used for depositing nickel seed layers on the front electrode area. Prior to the nickel deposition process, 2% HF solution was used to remove native oxide, which disturbs uniform nickel plating. In the subsequent step, a nickel sintering process was carried out in $N_2$ gas atmosphere; however, copper was plated by light-induced plating (LIP). Plated nickel has different properties under different bath conditions because nickel electroless plating is a completely chemical process. In this paper, plating bath conditions such as pH and temperature were varied, and the metal layer's structure was analyzed to investigate the adhesion of Ni/Cu metallization. Average adhesion values in the range of 0.2-0.49 N/mm were achieved for samples with no nickel sintering process.

Improvement of Interfacial Adhesion of Metal Plated Synthetic Fabrics for Electromagnetic Wave Shielding by Using Cold Plasma (저온 플라즈마 처리에 의한 전자파 차폐성 금속화 합성섬유의 계면 밀착성 개선)

  • 천태일
    • Textile Coloration and Finishing
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    • v.10 no.2
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    • pp.8-17
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    • 1998
  • In this study we have examined electroless chemical plating on the plasma grafted poly [ethylene terephathalate](PET) fabric in order to improve the interfacial adhesion between metal and fiber. The vapour phase of acrylic acid introduced on the PET surface and the graft polymerization was carried out by using cold plasma, resulting in the grafting yield of 0.8-1.3 wt%. The carboxyl group of the plasma grafted was identified by FT-IR-ATR spectra. The Interfacial adhesion was related to the carboxyl group. After electroless chemical plating of nickel, it showed that the more the carboxyl, the better the interfacial adhesion. Comparing to the untreated, the plasma grafted fabric showed fairly good interfacial adhesion(5B grade, ASTM D3359) . The shielding effect of electromagnetic wave showed 95dB. The shielding effect depends on the fabric structure, the surface structure, and the cross sectional shape of fibers. The dense fabric structure, the etched surface like a microcrater, and the trigonal cross sectional shape were prefered.

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A Study on the Comparison of Performances between Section Property Method and Section Shape Method for the Section Design of Vehicle Structure (차체단면설계를 위한 단면계수법 및 단면형상법의 성능비교에 관한 연구)

  • 서명원;이정환
    • Transactions of the Korean Society of Automotive Engineers
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    • v.8 no.1
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    • pp.135-147
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    • 2000
  • Section design of vehicle structure has been developed by two methods. One is the section property method which uses section property as a design variable. This method shows the tendency of an optimum section approximately. The other method is the section shape method which utilizes geometric parameter of section as a design variable. Practical solutions are obtained by this method. However, it is very expensive for large-scale problems due to the large number of geometric parameters. These two methods are compared through several sample problems. The finite element method is used for the structural and sensitivity analyses. The results are analyzed based on the number of function evaluations, the quality of cost function, the complexity of programing, and etc. The applications of both methods are also discussed.

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Investigation of Ni/Cu Solar Cell Using Selective Emitter and Plating (선택도핑에 도금법으로 Ni/Cu 전극을 형성한 태양전지에 관한 연구)

  • Kwon, Hyuk-Yong;Lee, Jae-Doo;Lee, Hae-Seok;Lee, Soo-Hong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.12
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    • pp.1010-1017
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    • 2011
  • The use of plated front contact for metallization of silicon solar cell may alternative technologies as a screen printed and silver paste contact. This technologies should allow the formation of contact with low contact resistivity a high line conductivity and also reduction of shading losses. A selective emitter structure with highly dopes regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing. When fabricated Ni/Cu plating metallization cell with a selective emitter structure, it has been shown that efficiencies of up to 18% have been achieved using this technology.

Effects of Electroplating Current Density and Duty Cycle on Nanocrystal Size and Film Hardness

  • Sun, Yong-Bin
    • Journal of the Semiconductor & Display Technology
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    • v.14 no.1
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    • pp.67-71
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    • 2015
  • Pulse electroplating was studied to form nanocrystal structure effectively by changing plating current density and duty cycle. When both of plating current density and duty cycle were decreased from $100mA/cm^2$ and 70% to $50mA/cm^2$ and 30%, the P content in the Ni matrix was increased almost up to the composition of $Ni_3P$ compound and the grain growth after annealing was retarded as well. The as-plated hardness values ranging from 660 to 753 HV are mainly based on the formation of nanocrystal structure. On the other hand, the post-anneal hardness values ranging from 898 to 1045 HV, which are comparable to the hardness of hard Cr, are coming from how competition worked between the precipitation of $Ni_3P$ and the grain coarsening. According to the ANOVA and regression analysis, the plating current density showed more strong effect on nanocrystal size and film hardness than the duty cycle.

A Study on the Fabrication of Porous Nickel Substrates Using Graphite Powder (흑연분말을 이용한 다공성 니켈지지체의 제조에 관한 연구)

  • 박성용;백지흠;조원일;조병원;윤경석
    • Journal of the Korean institute of surface engineering
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    • v.28 no.5
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    • pp.276-288
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    • 1995
  • A nickel mesh and an expanded nickel sheet were used as a current collector for supporting active materials of cathode in rechargeable batteries, while a porous nickel substrate was extensively studied because of its 3-dimensional structure which has high capabilities for active materials and current collection. Optimum coating conditions were studied by SEM and two step d. c. constant current electrolysis for the graphite coating and electro-plated nickel on an urethane substance which was highly porous and 3-dimensional structure. The density and the porosity of nickel support obtained by using two step current density and 80 ppi urethane substance were 0.38∼0.40 g /㎤ and 94∼96%, respectively. It was possible to fabricate a highly porous and good packable nickel substrate using two step current density and surfactants at sulfamic acid nickel plating bath.

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Influence of Mg nanoparticles on Hydrogen Adsorption Behaviors of Multi-walled Carbon Nanotubes (다중벽 탄소나노튜브의 수소 흡착 거동에 대한 Mg 나노입자의 영향)

  • Yoo, Hye-Min;Park, Soo-Jin
    • 한국신재생에너지학회:학술대회논문집
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    • 2011.05a
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    • pp.160-160
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    • 2011
  • In this work, magnesium (Mg) nanoparticles were plated onto the surfaces of multi-walled carbon nanotubes (MWNTs) in order to investigate the effects of their presence on the high pressure hydrogen storage behaviors of the resultant Mg/MWNTs. The structure of Mg/MWNTs was characterized by X-ray diffraction (XRD) and transmission electron microscopy (TEM). The pore structure and total pore volumes of Mg/MWNTs were analyzed by $N_2$/77 K adsorption isotherms. The hydrogen storage behaviors of the Mg/MWNTs were investigated by BEL-HP at 298K and 100 bar. From the results, it was found that Mg particles were homogeneously distributed on the MWNT surfaces. The hydrogen storage capacity increased in proportion to the Mg content. It can be concluded that Mg paricles play an important role in hydrogen storage characteristics due to the hydrogen spillover effect.

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Electromagnetic Wave Shielding Effect of Polyester Fabrics Chemically Plated with Copper and Nickel (무전해 금속 도금된 폴리에스테르 섬유의 전자파 차폐성)

  • Son, Ji-Hyun;Chun, Tae-Il
    • Proceedings of the Korean Society of Dyers and Finishers Conference
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    • 2004.11a
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    • pp.238-244
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    • 2004
  • In this study we have examined Copper and Nickel double metal layer on the synthetic fabrics by electroless chemical plating. We have focused on the shielding effect of the four kinds of woven and none-woven structure against electromagnetic fields. The shielding effectiveness of Copper and Nickel double metal layer showed between 90dB and 70dB, which are closely related to the fabric structure, that is cover factor and density. The more dense, The better shielding effect.

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Enhanced Boiling Heat Transfer of Water Using Multi-Stage Electroplating Technique (전기 다단 도금법을 이용한 물의 핵비등열전달 촉진 실험)

  • Cho, Dae-Gwan;You, Seung-Mun;Lee, Joon-Sik
    • Proceedings of the KSME Conference
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    • 2003.04a
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    • pp.1590-1596
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    • 2003
  • The experiments of boiling heat transfer were performed to investigate the boiling enhancement in saturated water by using multi-stage electroplated surface. In order to optimize the boiling performance, current flux and duration in multi-stage electroplating were varied. Current flux, 2 $A/12cm^2$ and 0.33 $A/cm^2$, and duration ranging from 15 second to 50 second are considered. The results showed that multi-stage electro plated surfaces generate enhancement of boiling parameters such as boiling incipient superheat, boiling heat transfer coefficient, and critical heat flux compared to plain surface. The SEM images of the coated surfaces were captured to examine the structure of porous surface, which provides the enhancement of boiling heat transfer.

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