• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.28 no.2
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• pp.81-87
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• 2022

Paper is a promising alternative to petroleum-based plastic materials for sustainable packaging applications. However, paper exhibits poor gas and water vapor barrier properties, which restrict its effective application in the packaging industry. To enhance the properties of papers, sodium caseinate (CasNa)/transglutaminase (TG) coating solutions with various TG contents were prepared and coated on the papers. The chemical and morphological structures, mechanical properties, seal strength, and water vapor barrier properties of the coated papers were thoroughly investigated. The paper properties depended significantly on the chemical and morphological structures. Pristine CasNa and CasNa/TG coating solutions were evenly coated on the paper surfaces, without any cracks. The chemical structure of the CasNa/TG coated papers was slightly influenced by TG addition, resulting in increased elongation at break and enhanced water barrier properties. To promote the use of CasNa-coated papers in packaging applications, additional investigations must be performed to prevent gas and moisture permeation and enhance the mechanical strength of these papers via chemical reactions and introduction of organic/inorganic composites.

• Design & Manufacturing
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• v.1 no.1
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• pp.17-21
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• 2007

In the manufacture and processing of large plastic materials, product quality is tested and verified through several techniques such as injection processing, residual stress through injection molding and shrinkage. With regards to the injection molding process, common problems such as inconsistent density is seen when different points of the product are discovered to have varying thickness levels. Sink marks in product are then evident. This occurs when there is poor molding conditions caused about by poor runner and packaging systems incorporated into the process. We designed the runner system which is possible balanced filling to cavities using CAE program $Moldflow^{TM}$ and then obtained optimal processing conditions by Taguchi's Robust Design technique.

• Prospectives of Industrial Chemistry
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• v.22 no.1
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• pp.38-45
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• 2019

포장이란 사람이 아이를 안전하게 감싸다라는 의미를 가진 '포'자와 겉을 아름답게 꾸민다는 의미의 '장'자가 합쳐져 만들어진 단어로 포장은 보호성, 편리성, 심미성 3가지의 목적과 기능을 가져야 한다. 세계 포장 시장은 약 1,030조원 규모이며, 국내 포장재 시장은 플라스틱 연포장(비닐포장), 용기, 지류, 금속 등 44조 2000억 원 규모로 매년 3% 이상 성장 중이다. 식품 포장은 이 중 55%를 차지하고 있으며, 과거 주로 일본 포장 전문 회사의 노하우를 채택하였지만 최근에는 한식에 맞는 포장법에 대한 연구와 개발이 활발해지고 있다. 또한 1인 가족, 핵가족, 맞벌이,노령화 등 한국 사회의 가구 형태 변화로 개별 포장의 필요성에 따라 식품 분야 포장 산업의 성장세가 급증하고 있다. 한편 식품 산업은 부가가치 창출이 최우선되는 4차 산업혁명의 가장 핵심적인 산업이 될 것이라는 통계가 나오고 있으므로 성장 가능성이 높다고 전망되고 있다. 현재는 새로운 푸드테크, 소재 개발, 소재 도입이 중요한 시기로 여겨지고 있다. 따라서 본 기고에서는 글로벌 시장에서 새롭게 떠오르고 있는 식품 포장재 기술의 발전 방향과 시장 성장단계 및 동향을 제시하고자 한다.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.24 no.3
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• pp.131-140
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• 2018

As global environmental problems become more serious, bio plastic suppliers in developed countries are expected to drive demand for eco friendly packaging materials due to recycling regulations and consumer's attention. To catch up with this demand, various types of bio plastics have been introduced using plants such as corn and domestic companies are increasingly interested in this. Industrial interest in bio plastics is increasing to solve the recent environmental problems. The critical disadvantages of the weak mechanical strength and expensive product cost were gradually solved by extensive researches. In order to promote the active use of bio plastics, countries around the world are operation certification marks and standard systems. In this article, we have summarized recent trends in domestic and overseas bio plastics regulations, certification marks and identification labels.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.30 no.1
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• pp.53-62
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• 2024

Molded pulp products has become more attractive than traditional materials such as expanded polystyrene foam (EPS) owing to low-priced recycled paper, environmental benefits such as biodegradability, and low production cost. In this study, various design factors regarding compression and cushioning characteristics of the molded pulp cushion with truncated pyramid-shaped structural units were analyzed using a test specimen with multiple structural units. The adopted structural factors were the geometric shape, wall thickness, and depth of the structural unit. The relative humidity was set at two levels. We derived the cushion curve model of the target molded pulp cushion using the stress-energy methodology. The coefficient of determination was approximately 0.8, which was lower than that for EPS (0.98). The cushioning performance of the molded pulp cushion was affected more by the structural factors of the structural unit than by the material characteristics. Repeated impacts, higher static stress, and drop height decreased the cushioning performance. Its compression behavior was investigated in four stages: elastic, first buckling, sub-buckling, and densification. It had greater rigidity during initial deformation stages; then, during plastic deformation, the rigidity was greatly reduced. The compression behavior was influenced by structural factors such as the geometric shape and depth of the structural unit and environmental conditions, rather than material properties. The biggest difference in the compression and cushioning characteristics of molded pulp cushion compared to EPS is that it is greatly affected by structural factors, and in addition, strength and resilience are expected to decrease due to humidity and repetitive loads, so future research is needed.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.21-27
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• 2007

Nickel bumps for ACF(anisotropic conductive film) flip chip application were fabricated by electroless and electro plating and their mechanical properties and impact reliability were examined through the compressive test, bump shear test and drop test. Stress-displacement curves were obtained from the load-displacement data in the compressive test using nano-indenter. Electroplated nickel bumps showed much lower elastic stress limits (70MPa) and elastic moduli ($7.8{\times}10^{-4}MPa/nm$) than electroless plated nickel bumps ($600-800MPa,\;9.7{\times}10^{-3}MPa/nm$). In the bump shear test, the electroless plated nickel bumps were deformed little by the test blade and bounded off from the pad at a low shear load, whereas the electroplated nickel bumps allowed large amount of plastic deformation and higher shear load. Both electroless and electro plated nickel bumps bonded by ACF flip chip method showed high impact reliability in the drop impact test.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.28 no.3
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• pp.175-182
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• 2022

Heavy metals can be intentionally or unintentionally introduced into plastic food utensils, containers, and packaging (PFUCP) as additives or contaminants, which can be ingested with food by humans. Here, seven-heavy metals (lead, cadmium, nickel, chromium, antimony, copper, and manganese) with toxicity concerns were selected, and risk assessment was done by establishing their migration from 137 PFUCP products made of 16 materials distributed in Korea. Migration of heavy metals was examined by applying 4% acetic acid as a food simulant (70℃, 30 minutes) to the PFUCP products. Inductively coupled plasma mass spectrometry (ICP-MS) was employed for the analysis of migrated heavy metals, and the reliability of quantitative results was confirmed by checking linearity, LOD, LOQ, recovery, precision, and expanded uncertainty. As a result of monitoring, heavy metals were detected at a level of non-detection to 8.76 ± 11.87 ㎍/L and most of the heavy metals investigated were only detected at trace amounts of less than 1 ㎍/L on average. However, antimony migrated from PET products was significantly higher than other groups. Risk assessment revealed that all the heavy metals investigated were safe with a margin of exposure above 311. Collectively, we demonstrated that heavy metals migrated from PFUCP products distributed in Korea appear to be within the safe range.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.28 no.1
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• pp.1-8
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• 2022

With the spread of COVID-19 worldwide, non-face-to-face services have grown rapidly, but at the same time, the problem of plastic waste is getting worse. Accordingly, eco-friendly policies such as carbon neutrality and sustainable circular economy are being promoted worldwide. Due to the high demand for eco-friendly products, the packaging industry is trying to develop eco-friendly packaging materials using PLA and PBAT and create new business models. On the other hand, Ulva australis occurs in large quantities in the southern seas of Korea and off the coast of Jeju Island, causing marine environmental problems. In this study, lactic acid was produced through dilute acid pretreatment, enzymatic saccharification, and fermentation processes to utilize Ulva australis as a new alternative energy raw material. In general, seaweeds vary in carbohydrate content and sugar composition depending on the species, harvest location, and time. Seaweed is mainly composed of polysaccharides such as cellulose, alginate, mannan, and xylan, but does not contain lignin. It is difficult to expect high extraction yield of the complex polysaccharide constituting Ulva australis with only one process. However, the fusion process of dilute acid and enzymatic saccharification presented in this study can extract most of the sugars contained in Ulva australis. Therefore, the fusion process is considered to be able to expect high lactic acid production yield when a commercial-scale production process is established.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• Corrosion Science and Technology
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• v.6 no.6
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• pp.282-285
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• 2007

Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature / humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the electrochemical migration. Many kinds of metal (Cu, Ag, SnPb, Sn etc) using in electronic packages are failed by ECM. Eutectic SnPb which is used in various electronic packaging structures, that is, printed circuit boards, plastic-encapsulated packages, organic display panels, and tape chip carriers, chip-on-films etc. And the material for soldering (eutectic SnPb) using in electronic package easily makes insulation failure by ECM. In real PCB system, not only metals but also many chemical species are included. And these chemical species act as resources of contamination. Model test systems were developed to characterize the migration phenomena without contamination effect. The serpentine-shape pattern was developed for analyzing relationship of applied voltage bias and failure lifetime by the temperature / humidity biased(THB) test.