• Title/Summary/Keyword: plastic package

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Overview on Flip Chip Technology for RF Application (RF 응용을 위한 플립칩 기술)

  • 이영민
    • Journal of the Microelectronics and Packaging Society
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    • v.6 no.4
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    • pp.61-71
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    • 1999
  • The recent trend toward higher frequencies, miniaturization and lower-cost in wireless communication equipment is demanding high density packaging technologies such flip chip interconnection and multichip module(MCM) as a substitute of conventional plastic package. With analyzing the recently reported research results of the RF flip chip, this paper presents the technical issues and advantages of RF flip chip and suggest the flip chip technologies suitable for the development stage. At first, most of RF flip chips are designed in a coplanar waveguide line instead of microstrip in order to achieve better electrical performance and to avoid the interaction with a substrate. Secondly, eliminating wafer back-side grinding, via formation, and back-side metallization enables the manufacturing cost to be reduced. Finally, the electrical performance of flip chip bonding is much better than that of plastic package and the flip chip interconnection is more suitable for Transmit/Receiver modules at higher frequency. However, the characterization of CPW designed RF flip chip must be thoroughly studied and the Au stud bump bonding shall be suggested at the earlier stage of RF flip chip development.

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Performance of Wood-plastic Panel Made from Populus alba × glandulosa and Low Density Polyethylene (은수원사시나무와 저밀도 폴리에틸렌으로 제조된 목질플라스틱패널의 성능)

  • Kwak, Jun-Hyuk;Oh, Yong-Sung
    • Journal of the Korean Wood Science and Technology
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    • v.32 no.1
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    • pp.67-72
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    • 2004
  • Wood/polyethylene panels were manufactured from Populus alba × glandulosa particles and low density polyethylene particles at three mixing rates, 50:50, 60:40, and 70:30. A total of 15 wood/polyethylene panels was made at 145℃ and 5 minutes hot-press time. Wood/polyethylene panels were tested for internal bond, bending, and dimensional stabilities such as thickness swell and water absorption. Panel performance data were analyzed using the SAS programing package. The test results of the wood/polyethylene panels showed that as the polyethylene mixing rates were increased, the panel property values increased. Based on panels' dimensional stabilities, the optimum wood/polyethylene mixing ratio appeared to be 60:40.

Kimchi Packaging Technology: An Overview

  • Jeong, Suyeon;Yoo, SeungRan
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.22 no.3
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    • pp.41-47
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    • 2016
  • This paper provides an overview of kimchi packaging technology, focusing on packaging materials, package design, and active/intelligent packaging technology for kimchi. From a packaging-material standpoint, although various materials have been used to ensure customer satisfaction and convenience, plastic is the most widely used material, in the form of bags, trays, pouches, and rigid containers. Additionally, recent efforts in the kimchi packaging industry have allowed companies to differentiate their products by using different packaging materials and technologies, while simultaneously improving product safety and quality. On the other hand, the biggest problem in kimchi packaging is excess $CO_2$ production, leading to package expansion and leakage. To alleviate this problem, the use of $CO_2$ absorbers, high $CO_2$-permeable films, and degassing valves, in addition to the use of different packaging systems, has been investigated. Active and/or intelligent packaging systems have been developed, to include active functions beyond simply inert, passive containment and protection of the kimchi product. However, most such approaches are not yet adequately effective to be useful on a commercial scale. Therefore, further studies are needed to resolve the limitations of each technology.

Nano-level High Sensitivity Measurement Using Microscopic Moiré Interferometry (마이크로 무아레 간섭계를 이용한 초정밀 변형 측정)

  • Joo, Jin-Won;Kim, Han-Jun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.32 no.2
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    • pp.186-193
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    • 2008
  • [ $Moir{\acute{e}}$ ] interferometry is an optical method, providing whole field contour maps of in-plane displacements with high resolution. The demand for enhanced sensitivity in displacement measurements leads to the technique of microscopic $moir{\acute{e}}$ interferometry. The method is an extension of the $moir{\acute{e}}$ interferometry, and employs an optical microscope for the required spatial resolution. In this paper, the sensitivity of $moir{\acute{e}}$ interferometry is enhanced by an order of magnitude using an immersion interferometry and the optical/digital fringe multiplication(O/DFM) method. In fringe patterns, the contour interval represents the displacement of 52 nm per fringe order. In order to estimate the reliability and the applicability of the optical system implemented, the measurements of rigid body displacements of grating mold and the coefficient of thermal expansion(CTE) for an aluminium block are performed. The system developed is applied to the measurement of thermal deformation in a flip chip plastic ball grid array package.

Thermomechanical and Flexural Behavior of WB-PBGA Package Using $Moir{\acute{e}}$ Interferometry (모아레 간섭계를 이용한 WB-PBGA 패키지의 온도변화 및 굽힘하중에 대한 거동해석)

  • Joo, Jin-Won;Lee, Chang-Hee;Han, Bong-Tae;Cho, Seung-Min
    • Proceedings of the KSME Conference
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    • 2001.06a
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    • pp.90-95
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    • 2001
  • Thermo-mechanical and flexural behavior of a wire-bond plastic ball grid array (WB-PBGA) are characterized by high sensitive $moir{\acute{e}}$ interferometry. $Moir{\acute{e}}$ fringe patterns are recorded and analyzed at several various bending loads and temperature steps. At the temperature higher that $100^{\circ}C$, the inelastic deformation in solder balls became more dominant. As a result the bending of the molding compound decreased while temperature increased. The strain results show that the solder ball located at the edge of the chip has largest shear strain by the thermal load while the maximum average shear strain by the bending moment occurs in the end solder. The results also show that $moir{\acute{e}}$ interferometry is a powerful and effective tool in experimental studies of electronic packaging.

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Flexible Low Power Consumption Active-Matrix OLED Displays

  • Hack, Mike;Chwang, Anna;Hewitt, Richard;Brown, Julie;Lu, JengPing;Shih, ChinWen;Ho, JackSon;Street, R.A.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07a
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    • pp.609-613
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    • 2005
  • Advanced mobile communication devices require a bright, high information content display in a small, light-weight, low power consumption package. In this paper we will outline our progress towards developing such a low power consumption active-matrix flexible OLED ($FOLED^{TM}$) display. Our work in this area is focused on three critical enabling technologies. The first is the development of a high efficiency long-lived phosphorescent OLED ($PHOLED{TM}$) device technology, which has now proven itself to be capable of meeting the low power consumption performance requirements for mobile display applications. Secondly, is the development of flexible active matrix backplanes, and for this our team are employing poly-Si TFTs formed on metal foil substrates as this approach represents an attractive alternative to fabricating poly-Si TFTs on plastic for the realization of first generation flexible active matrix OLED displays. Unlike most plastics, metal foil substrates can withstand a large thermal load and do not require a moisture and oxygen permeation barrier. Thirdly, the key to reliable operation is to ensure that the organic materials are fully encapsulated in a package designed for repetitive flexing. We also present progress in operational lifetime of encapsulated T-PHOLED pixels on planarized metal foil and discuss PHOLED encapsulation strategy.

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A Study of the High Reliability in Plastic BGA Solder Joints (플라스틱 BGA 솔더접합부의 고신뢰성에 관한 연구)

  • Kim, Kyung-Seob;Shin, Young-Eui;Lee, Hyuk
    • Journal of Welding and Joining
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    • v.17 no.3
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    • pp.90-95
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    • 1999
  • The increase in high speed, multi-function and high I/O pin semiconductor devices highly demands high pin count, very thin, and high density packages. BGA is one of the solutions, but the package has demerits in package reliability, surface mounting problems due to the PCB warpage and solder joint crack related with TCE mismatch between the materials. On this study to verify the thermal fatigue lifetime of the solder joint FEM and experiments were performed after surface mounting BGA with different solder composition and reliability conditions. FEM showed optimum composition of Ag3.2-Sn96.5 and under the composition minimum creep deformation of the solder joint was calculated, and the thermal fatigue lifetime was improved. In view of temperature cycle condition, the conditions of $-65^{\circ}C$to $150^{\circ}C$ showed minimum lifetime and t was 1/3 of $0^{\circ}C$ to $125^{\circ}C$ condition. Test board was prepared and solder joint crack was verified. Until 1000cycle on soder joint crack was observed.

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Research on blind box packaging design based on consumer psychology

  • Ruiyu Li;Alber Young Choi
    • International Journal of Advanced Culture Technology
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    • v.11 no.3
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    • pp.163-171
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    • 2023
  • A blind box is a kind of sales method in that you can only get the product information by opening the package. In 2019, blind box products began to grow rapidly in the Chinese market, and gradually formed a special "blind box economy". The particularity of blind box products is that driven by consumers' curiosity, consumers' purchasing behavior can be directly induced by the visual and tactile perception of commodity packaging. Therefore, it is necessary to explore the psychological needs of consumers and master the blind box packaging design elements under the influence of consumer psychology. This paper takes figurine blind box packaging elements as the research scope and Chinese blind box consumers as the research object. Through market research and literature study, We are designed to conduct a questionnaire survey and SPSS empirical study to find out the differences in the preferences of different consumer temperament types for blind box packaging, taking the characteristics of blind box products and consumer psychology as the relevant theoretical background. The research results show that among the blind box consumers, choleric type consumers predominate, the color of the blind box packaging presents red, orange, and yellow preference, and the material presents metal, and plastic preference. The shape of the blind box shows a preference for special shape.

Numerical Analysis Study on Micro-plastic Particle behavior According to the Shape of Cyclone Separator (Cyclone separator의 형상에 따른 미세플라스틱 입자 거동 수치해석 연구)

  • Insun Kang;Wonjun Seo;Dongho Yu;Yeongshik Kim;Hyeungchul Kim;Seokyeon Im
    • Tribology and Lubricants
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    • v.40 no.2
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    • pp.61-66
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    • 2024
  • Micro-plastics are synthetic high-differentiation chemicals of less than 5mm in size, and are deposited not only on the sea surface but also on the coast. If these micro-plastics are not properly separated from the sand, they can threaten marine ecosystems. Thus, in the present study, we aimed to apply cyclone separator to the micro-plastic retrieval in order to predict the movement of particles according to the formation of the cyclone separator by applying the centrifugal force of the particle in accordance with the rotational movement of the air. The cyclone separator has three shapes, the first one is a typical interconnected cyclone separator. The second is the horn form, except for the cylinder in a regular cyclone separator, and the third is a form that increases the horn's height twice in the second. The numerical analysis simulation of the Cyclone separator used the Fluent software package. The output speed of the Cyclone separator was 5 to 13m/s at 1m/s intervals. The simulated particles include sand, Styrofoam, PET, PP, and PU. Sand particles are assigned a fixed diameter of 2mm, while other particles have a diameter of 3mm. As a result of the analysis, the first form was not separated from plastic. The Styrofoam separation efficiency in the second showed its highest efficiency at 72.7% at 7m/s, and the efficiency decreased after 12m/s as the sand particles were mixed into the plastic attachment location. In the third form, the separation efficiency of Styrofoam at 12m/s was highest at 67.9%.

A Study of Prestige Fashion Brands' Visual Identities on Visual Semiotic Analysis of Cosmetic Products' Packaging -Focused on Yves Saint Laurent and Giorgio Armani- (화장품 패키지의 시각기호학적 분석을 통한 패션 명품 브랜드의 시각적 정체성 연구 - 입생로랑과 조르지오 아르마니의 사례를 중심으로 -)

  • Lee, Mi-jin;Jeon, Hyeong-yeon
    • Journal of Communication Design
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    • v.64
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    • pp.64-75
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    • 2018
  • Luxury fashion brands, which have dominated the market of high-priced apparel, bags and shoes, are recently showing changes of stepping into the cosmetics market. The purpose of this study is to examine how luxury fashion brand identity is transferred to cosmetic brand while expanding into luxury cosmetic brand, and to analyze the plastic signs of cosmetic package design and to analyze visual identity through a semi-symbolic system. Therefore, in this study, we tried to analyze the visual semiotic analysis of the package design such as the cushion compact, the lip tint and the brand logo which appeared in the popular product line of the fashion luxury brand such as Yves Saint Laurent and Armani. As a result of the analysis, this study has identified the semantic qualities expressed by each plastic element through the visual semiotic analysis process of the cosmetic package of Yves Saint Laurent and Giorgio Armani. These traits were found to be used as visual signs to reveal the 'Classicism' identity pursued by Yves Saint Laurent and the 'Baroque' identity pursued by Armani. Based on the results of this study, this study finds that the brand identity as a fashion brand is not transferring to the visual identity of cosmetic brands in the case of Yves Saint Laurent. On the other hand, this study found that Armani uses visual communication strategies to effectively transfer the brand identity as a fashion brand to the visual identity of cosmetic brands. On these two different results, it is necessary to examine whether luxury fashion brands and also Korean fashion brands are expanding into the cosmetics market and how they can better grasp the existing brand identity and apply it to the communication strategies of cosmetics brands.