Proceedings of the KSME Conference (대한기계학회:학술대회논문집)
- 2001.06a
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- Pages.90-95
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- 2001
Thermomechanical and Flexural Behavior of WB-PBGA Package Using $Moir{\acute{e}}$ Interferometry
모아레 간섭계를 이용한 WB-PBGA 패키지의 온도변화 및 굽힘하중에 대한 거동해석
- Joo, Jin-Won ;
- Lee, Chang-Hee ;
- Han, Bong-Tae (Dept. of Mechanical Engineering, Univ. of Maryland) ;
- Cho, Seung-Min (Dept. of Mechanical Engineering, Univ. of Maryland)
- Published : 2001.06.27
Abstract
Thermo-mechanical and flexural behavior of a wire-bond plastic ball grid array (WB-PBGA) are characterized by high sensitive
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