• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.12
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• pp.2217-2220
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• 2007

In this paper, we propose a new wafer level package (WLP) for the RF MEMS applications. The Film Bulk Acoustic Resonator (FBAR) are fabricated and hermetically packaged in a new wafer level packaging process. With the use of Au-Sn eutectic bonding method, we bonded glass cap and FBAR device wafer which has groove-shaped via formed in the backside. The device wafer includes a electrical bonding pad and groove-shaped via for connecting to the external bonding pad on the device wafer backside and a peripheral pad placed around the perimeter of the device for bonding the glass wafer and device wafer. The glass cap prevents the device from being exposed and ensures excellent mechanical and environmental protection. The frequency characteristics show that the change of bandwidth and frequency shift before and after bonding is less than 0.5 MHz. Two packaged devices, Tx and Rx filters, are attached to a printed circuit board, wire bonded, and encapsulated in plastic to form the duplexer. We have designed and built a low-cost, high performance, duplexer based on the FBARs and presented the results of performance and reliability test.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.5
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• pp.353-357
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• 1998

Cracking problem of Epoxy Molding Compound(EMC) is critical for the reliability of the plastic package during temperature cycling and IR-reflow condition. Fracture toughness of EMC, which is defined as the resistance of EMC to the crack propagation, is a useful factor in ht estimation of EMC against package crack. Thus, development of EMC having high fracture toughness at a given loading condition would be important for confirming the integrity of package. In this study, toughness of several EMC was measured by varying the test conditions such as temperature, loading speeds, and weight percent of filler in order to quantify the variation of toughness of EMC under various applicable conditions. It was found from the experiments that toughness of all EMC has following trends, i.e., it rapidly decreases over the glass transition temperature, remains almost same or little decreases below $0^{\circ}C$. It decreases with the growth of cross head speed in EMC and the weight percent of filler as the degree of brittleness of EMC increases with the amount of filler content.

• Archives of Plastic Surgery
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• v.51 no.2
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• pp.251-257
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• 2024

Background Plastic surgery has developed to benefit in a variety of challenging areas formerly handled by other disciplines. Medical students do not have a clear picture of plastic surgery as a career due to lacking scope, clinical practice, and understanding of plastic surgery as a clinical area of expertise, including general practitioners, nursing staff, medical trainees, and the general public, and misconceptions about the extent of reconstructive and plastic surgery. Methods A cross-sectional observational study was conducted on Kuwait University Medical students (2nd-7th Years) over a period of 1 month. A questionnaire and a consent form were provided to eligible students. The inclusion criteria were Kuwait University Medical students from 2nd to 7th Years with signed consent form. The response was collected via email sent in coordination with the Vice Dean of Student Affairs in the Faculty of Medicine. Using statistical package for the social sciences, responses were statistically analyzed. Pearson's chi-square test was used to calculate p-values, where p < 0.05 was considered statistically significant. Results A total of 244 eligible medical students, 121 males and 123 females, were included in the study, with a mean age of 21 (±2) years. Similarly, 126 (51.6%) were preclinical students (2nd-4th-year students), while 118 (48.4%) were clinical students (5th-7th-year students). About 79.8% of medical students believed that plastic surgery plays an essential role in trauma management, whereas 9.2% did not consider plastic surgery significant for trauma management. This study found that only 15.5% of medical students were interested in enrolling in plastic surgery residency after graduation, while 47.1% of students did not consider plastic surgery residency after graduation. However, 37.4% were uncertain. The two most driving factors in deciding on plastic surgery residency were expected income (61.8%) and lifestyle (14.3%). Conclusion Improving medical students' education quality can enhance their perception and awareness of plastic surgery. Students should be taught the broader scope of plastic surgery. The inclusion of formal training during undergraduation is the essence of time and should be added to or improved during plastic surgery rotations with more emphasis on reconstructive and hand/peripheral nerve surgery. Student-led interest groups can be a useful tool for educating students about their specialty.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• 1998.10a
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• pp.223-238
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• 1998

In this study, to investigate the effect of process variables such as reduction in area, semi-die angle and the rectangular ratio to the corner filling which influences the dimensional accuracy of the final product in the drawing of the cluadrangle rod from a round bar, it has been simulated by three dimensional rigid-plastic finite element method. In order to reduce the number of simulation artificial neural network has been introduced. Also, through the experimental investigation, the present results have been implemented on the industrial product. In results, the main process variable is the combination of the semi-die angle in case of the irregular shaped drawing process and reduction in area in the event of regular shaped drawing process, respectively.

• Proceedings of the IEEK Conference
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• 2002.06b
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• pp.73-76
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• 2002

In this paper we present an integrated Hail sensor It for fan motors, fabricated in industrial bipolar process. As a discrete Hall sensor and signal processing circuitry In the fan motor system were Integrated into single chip a temperature dependence of Hall sensitivity and Hall offset voltage can be compensated and cancelled by on-chip circuitry. We Propose a novel temperature compensation of Hall sensitivity with negative temperature coefficient (TC) using the differential amplifier gain with Positive TC. After a package of the chip was sealed using a plastic Package 20 Pins, the thermal and magnetic characteristics were investigated. The obtained experimental results are in agreement with analytical predictions and have more excellent performance than\ulcorner conventional the fan motor system using discrete Hall sensor.

• Journal of Welding and Joining
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• v.17 no.2
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• pp.61-65
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• 1999

Because of the need for packages which accommodate high pin count, high density and high speed device, PBGA(plastic ball grid array) package gets more spotlight. But the substrate material which is used for PBGA package is in nature susceptible to moisture penetration. The objective of the study is to find out the path of delamination in the stacked structure of substrate. To increase the adhesion between the cooper laminate and PSR(photo solder resist) which is the weakest part, experiments were performed by changing parameters of printing pre-treatment and post-treatment process. As a result of experiments, the factor effects on the adhesion between the cooper laminate and PSR is caused by all of the pre-treatment and post-treatment condition. A considerable change was observed depending on the amount of UV irradiation after thermal cure which is typical of printing post-treatment condition rather than pre-treatment condition.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.10
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• pp.22-28
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• 1998

Signal transmission and crosstalk of coupled bondwires buried in plastic packages are analyzed using the Method of Moments and the Fourier Transform algorithm. It is also shown that the quasi-static crosstalk model of SPICE is inappropriate for designing the high-speed plastic packages. Plastic packaging material, increasing the self and mutual capacitances, is found to be helpful for the signal transmission integrity due to the dielectric compensation effect. However, it is also observed that the plastic material increases the crosstalk due to the radiation-enhanced mutual coupling effect. By investigating the geometrical and material dependence of the pulse transmission and crosstalk, it is found that the radiation-enhanced coupling effect is significant for most of typical bondwire geometries and plastic package materials. These calculation results can be effectively used for designing plastic packages of high-speed digital IC's and monolithic RFIC's.

• Journal of the Korean Society of Food Science and Nutrition
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• v.41 no.3
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• pp.418-429
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• 2012

In this study we surveyed the packaging preferences of consumers for Korean rice cakes as current commercial products in Korea. The questionnaire was developed from a preliminary investigation of typical rice cake packaging patterns and sent to 2332 residents in Korea by random sampling mail. The questionnaire contained questions on the preferences of interior design in packaging, opening methods, individually separated types, printing position, packaging methods, and packaging materials such as paper and plastic. There were responses from 304 residents. The collected data was analyzed by an SPSS package program. Most of the packaging used for Korean rice cakes was plastic (58.9%) which was used for packaging materials and stretch wrap (42.9%) as packing methods. The results showed the preference was the perforated line type used by hand for opening a packaging and interior packaging design with 2~3 partitions. Most respondents expressed an interest in using individual packaging and having printing directly on the packaging. Also, the respondents preferred the packaging design that let them see the contents of a package. Based on the results of the questionnaire, this paper suggested that most consumers would prefer to choose a packaging system with a partition design in a plastic container, individually separated products, and a transparent container for Korean rice cakes. The results of packaging preferences could provide important information for suitable packaging development for Korean rice cakes. Further research should be conducted to improve the shelf life of Korean rice cakes with functional packaging systems such as modified atmosphere packaging or anti-microbial packaging.

• Proceedings of the Korea Concrete Institute Conference
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• 2001.11a
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• pp.65-70
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• 2001

The compression toe of structural wall is designed to resist the axial compression and shear force caused by wind or earthquake. The performance of shear wall used in tall building is highly influenced by combined shear and axial force. For this reason, it is possible to result in local brittle failure because of concentrated damage in the potential plastic hinge region under severe earthquake. Thus, it is necessary to establish the lateral confinement details at the plastic hinge of shear wall so that shear wall can behave a ductile manner, The objective of this study is to evaluate the seismic performance of L-shaped walls with different confinement details. For this purpose, three wall specimens were tested experimentally and also analyzed using Nonlinear FEM package.