• Korean Journal of Materials Research
• /
• v.9 no.3
• /
• pp.234-239
• /
• 1999

A Abstract Yttria-stabilized zirconia(YSZ) thin films were synthesized by plasma enhanced chemical vapor deposition process. $Zr[TMHD]_4$ $Y[TMHD]_3$ precursors and oxygen were used with the deposition temperature of $425^{\circ}C$ and rf power ranging 0-100 watt. Effects of the deposition parameters were studied by X-ray diffraction and thickness anal­ysis. YSZ thin films have cubic crystal structure with (200) orientation. From the results of EDX analysis, the converte ed content of TEX>$Y_2O_3$ was determined to be 0-36%, and the film thickness was increased with bubbling temperature which is considered to be due to increasing TEX>$Y_2O_3$ flux. The depth profiles of Zr, Y and 0 appeared relatively $\infty$nstant through film thickness. Columnar grains of $1000~2000\AA$ grew vertical to the substrate surface for the case of Ar carri­er gas. In case of He carrier gas, the grain size was observed to be about $1000~2000\AA$. X-ray diffraction data showed the increase of lattice constant with TEX>$Y_2O_3$ content. It was that the presence of the cracks formed during film deposition, partially released the stress generated by the increase of lattice constant.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.18 no.7
• /
• pp.662-666
• /
• 2005

Silicon nitride $(SiN_x)$ film is a promising material for anti-reflection coating and passivation of multicrystalline silicon (me-Si) solar cells. In this work, a plasma-enhanced chemical vapor deposition (PECVD) system with batch-type reactor tube was used to prepare highly robust $SiN_x$ films for screen-printed mc-Si solar cells. The Gas flow ratio, $R=[SiH_4]/[NH_3]$, in a mixture of silane and ammonia was varied in the range of 0.0910.235 while maintaining the total flow rate of the process gases to 4,200 sccm. The refractive index of the $SiN_x$ film deposited with a gas flow ratio of 0.091 was measured to be 2.03 and increased to 2.37 as the gas flow ratio increased to 0.235. The highest efficiency of the cell was $14.99\%$ when the flow rate of $SiH_4$ was 350 sccm (R=0.091). Generally, we observed that the efficiency of the mc-Si solar cell decreased with increasing R. From the analysis of the reflectance and the quantum efficiency of the cell, the decrease in the efficiency was shown to originate mainly from an increase in the surface reflectance for a high flow rate of $SiH_4$ during the deposition of $SiN_x$ films.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.11a
• /
• pp.151-152
• /
• 2007

탄소나노튜브(CNTs)는 우수한 물리적, 화학적, 기계적 특성으로 다양한 분야에서 연구가 진행 되고있다. 특히, field emission displays (FEDs)로의 응용을 위해서는 기본적으로 sodalime glass 위에 직접 CNTs를 성장시켜야 하며, 소자 응용을 위해 기판인 sodalime glass를 왜곡시키는 온도보다 낮은 온도에서 CNT의 수직 성장이 이루어져야 한다. 본 연구에서는 Hot-filament plasma enhanced chemical vapor deposition (HF-PECVD)를 이용하여 합성온도를 400, 450, 500, $550^{\circ}C$로 변화시켰으며 촉매 층인 Ni의 두께를 5~40 nm까지 조절하여 탄소나노튜브를 합성하였다. 저온에서 합성된 탄소나노튜브는 FE-SEM을 이용하여 성장 형태 및 표면 특성을 확인하였으며, 미세구조는 HR-TEM을 이용하여 확인하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1991.10a
• /
• pp.63-67
• /
• 1991

Amorphous silicon films were deposited on glass, [100] single crystal silicon wafer with thermally grown silicon dioxide, and [100] silicon wafer substrates by Plasma Enhanced Chemical Vapor Deposition(with argon diluted silane source gas). Growth rate, UV optical band edge, and the hydrogen quantity in the amorphous silicon films have been investigated as a function of the preparation conditions by measuring film thickness, UV-absorbency, and FT-IR transmittance. The growth rate of the ${\alpha}$-Si:H films increases with increasing substrate temperture, flow rate and R.F. power density. The UV optical band edge shifts to blue with the increases in the deposition pressure. Increasing substrate temperature shifts the UV optical band edge of the films to red. Hydrogen quantity in the ${\alpha}$-Si:H films increases with an increases in the R.F. powr and decreases with an increase in the substrate temperature.

• Proceedings of the KIEE Conference
• /
• 1997.07d
• /
• pp.1383-1386
• /
• 1997

Dimond-like carbon(DLC) films have been deposited by using both rf plasma-enhanced chemical vapor deposition (PECVD) and filtered cathodic vacuum arc (FCVA) deposition systems. Effects of deposition conditions, such as dc self-bias, $CH_4$ gas pressure, substrate bias, and $N_2$ partial pressure, on the structural and electrical properties of DLC films are examined. The experimental results obtained have also been discussed by considering a theoretical model for film growth.

• Journal of the Korean Vacuum Society
• /
• v.9 no.4
• /
• pp.328-334
• /
• 2000

DLC (Diamond-Like Carbon) films were deposited by ECR-PECVD (electron cyclotron resonance plasma-enhanced chemical vapor deposition) method with the variation of substrate bias voltage under the others are constant except it. We have investigated the ion bombardment effect induced by the substrate bias voltage on films during the deposition of film. The characteristics of the film were analyzed using the Dektak surface profiler, SEM, FTIR spectroscopy, Raman spectroscopy and Nano Indentation tester. FTIR spectroscopy analysis shows that the amount of dehydrogenation in films was increased with the increase of substrate bias voltage and films thickness was decreased. Raman scattering analysis shows that integrated intensity ratio $(I_D /I_G)$ of the D and G peak was increased as the substrate bias voltage increased, and films hardness was increased. From these results, it can be concluded that films deposited at this experimental have the enhanced characteristics of DLC because of the ion bombardment effect on films during the deposition of film.

• Proceedings of the Korean Vacuum Society Conference
• /
• 1999.07a
• /
• pp.56-56
• /
• 1999

수소화된 비정질 탄소(a-C:H0는 그 형성 조건에 따라서 여러 가지 다른 구조와 특성을 갖게 되며, 특히 DLC(diamond-like carbon)-FED(field emission display) 개발 면에서 중요하게 연구되고 있다. 본 연구에서는 a-C:H 박막을 PECVD(plasma-enhanced chemical vapor deposition) 방법으로 증착하고 주고 ESR 및 Raman 측정을 통하여 그 결과를 조사해 보았다. PECVD 증착가스는 CH4 가스를 사용하였다. 기판은 Corning 1737 glass를 사용하였고, 기판 온도는 32$0^{\circ}C$이었다. 증착 압력과 R>F. power는 각각 0.1-1 Torr 와 12-36 W 사이에서 변화되었다. ESR를 피하기 위하여, microwave power에 대한 ESR 신호 의존성을 측정하고 포화효과를 피하기 위한 Raman spectroscopy로 분석하였다. R.F.power가 증가할수록 증착속도는 0.06 nm/sec 정도까지 대체로 증가하였으나, pressure가 1 Torr 일때는 같은 R.F. power로써 증착이 일어나지 않는 경우도 발생하였다. 증착된 a-C:H 박막은 R.F.power가 증가할수록 스핀밀도의 증가가 두드러졌으며, 기타 증착가스 압력 등의 증착 조건에 따른 ESR 및 Raman 스펙트럼의 변화를 관찰하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.14 no.9
• /
• pp.751-756
• /
• 2001

Carbon nanotubes(CNTs) was successfully grown on Ni coated silicon wafer substrate by PECVD technique(Plasma Enhanced Chemical Vapor Deposition). As a catalyst, Ni thin film of thickness ranging from 15∼30nm was prepared by electron beam evaporator system. In order to find the find the optimum growth condition, initially two different types of gas mixtures such as C$_2$H$_2$-NH$_3$ and C$_2$H$_2$-NH$_3$-Ar were systematically investigated by adjusting the gas mixing ratio in temperature of 600$^{\circ}C$ under 0.4 torr. The diameter of the grown CNTs was 40∼200nm. The diameter of the CNTs increases with increasing the Ni particles size. TEM images clearly demonstrated synthesized nanotubes to be multiwalled.

• Journal of the Semiconductor & Display Technology
• /
• v.7 no.1
• /
• pp.41-45
• /
• 2008

We studied the electrical characteristics of low-k SiOCR interlayer dielectric(ILD) films fabricated by plasma enhanced chemical vapor deposition (PECVD). The precursor bis-trimethylsilylmethane (BTMSM) was introduced into the reaction chamber with the various flow rates. The absorption intensities of Si-O-$CH_x$, bonding group and Si-$CH_x$, bonding group changed synchronously for the variation of precursor flow rate, but the intensity of Si-O-Si(C) responded asynchronously with the $CH_x$, combined bonds. The SiOCH films revealed ultra low dielectric constant around 2.1(1) and reduced further below 2.0 by heat treatments.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2008.11a
• /
• pp.83-85
• /
• 2008

4성분계 Ti-Si-C-N 코팅막은 $TiCl_4$, $SiH_4$, $CH_4$, Ar, 그리고 $N_2$ 가스 혼합체를 이용하여 RF-PECVD 기법에 의해 Si 와 AISI 304 기판위에 합성하였다. Ti-C-(0.6)-N(0.4) 조성의 코팅막에 Si를 첨가함으로 Ti(C,N) 결정질은 줄어들고, Si3N4 및 SiC 비정질상이 나타났다. Ti-Si(9.2 at.%)-C-N의 조성에서 나노 크기의 nc-Ti(C,N) 결정질을 비정질 a-Si3N4/SiC가 둘러싸고 있는 형태의 나노 복합체를 나타내었다. 경도 24 Gpa의 Ti-C-N 코팅막은 Si를 첨가함으로 Ti-Si(9.2 at.%)-C-N 조성에서 46 Gpa의 최고 경도를 나타내었으며, 마찰계수의 경우에도 Ti-C-N 코팅막에 Si를 첨가함으로 크게 낮아졌다.