• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.957-961
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• 2004

In order to realize high performance thin film transistor (TFT) on plastic substrate, Si film was deposited on plastic substrate at 170$^{\circ}C$ by using inductivity coupled plasma chemical vapor deposition (ICPCVD). Hydrogen concentration in as-deposited Si film was 3.8% which is much lower than that in film prepared by using conventional plasma enhanced chemical vapor deposition (PECVD). Si film was deposited as micro crystalline phase rather than amorphous phase even at 170$^{\circ}C$ because of high density plasma. By step-by-step Excimer laser annealing, dehydrogenation and recrystallization of Si film were carried out simultaneously. With step-by-step annealing and optimization of underlayer structure, it has succeeded to achieve large grain size of 300nm by using ICPCVD. Base on these results, poly-Si TFT was fabricated on plastic substrate successfully, and it is sufficient to drive pixels of OLEDs, as well as LCDs.

• Transactions on Electrical and Electronic Materials
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• v.7 no.3
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• pp.118-122
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• 2006

Diamond-like carbon (DLC) films were prepared on silicon substrates by the RF PECVD (Plasma Enhanced Chemical Vapor Deposition) method using methane $(CH_4)$ and hydrogen $(H_2)$ gas. We examined the effects of the post annealing temperature on the tribological properties of the DLC films using friction force microscopy (FFM). The films were annealed at various temperatures ranging from 300 to $900^{\circ}C$ in steps of $200^{\circ}C$ using RTA equipment in nitrogen ambient. The thickness of the film was observed by scanning electron microscopy (SEM) and surface profile analysis. The surface morphology and surface energy of the films were examined using atomic force microscopy and contact angle measurement, respectively. The hardness of the DLC film was measured as a function of the post annealing temperature using a nano-indenter. The tribological characteristics were investigated by atomic force microscopy in FFM mode.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.218-221
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• 2008

Bottom-gate microcrystalline silicon thin film transistors (${\mu}c$-Si:H TFTs) were fabricated on glass and transparent polyimide substrates by conventional 13.56 MHz RF plasma enhanced chemical vapor deposition at $200^{\circ}C$. The deposition rate of the ${\mu}c$-Si:H film is 24 nm/min and the amorphous incubation layer near the ${\mu}c$-Si:H/silicon nitride interface is unobvious. The threshold voltage of ${\mu}c$-Si:H TFTs can be improved by $H_2$ or $NH_3$ plasma pretreatment silicon nitride film.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.692-693
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• 2002

Well-aligned multi-wall carbon nanotubes (MWNTs) were fabricated by utilizing a radio frequency plasma-enhanced chemical vapor deposition (rf-PECVD) system from Ni particles at the bottom of anodic alumina nanoholes (AAN). To remove the amorphous graphite layers on the AAN surface and to eliminate the protrusion of MWNT tips, the AAN surface with MWNTs were treated by external rf plasma source. As a result, the AAN surface almost became flat without having any protrusion of MWNT tips. The diameter, length of MWNTs and AAN were investigated by using a scanning electron microscopy (SEM). Raman spectroscopy was also used to characterize wall structure of the carbon nanotube. And the emission properties of the MWNTs were measured for the application of field emission display (FED) in near future.

• 한국방재학회:학술대회논문집
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• 2008.02a
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• pp.815-818
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• 2008

Titanium was oxidized with oxygen plasma and calcinated with rapid thermal annealing for degradation of humic acid dissolved in water. Titania photocatalytic plate was produced by titanium surface oxidized with oxygen plasma by Plasma Enhanced Chemical Vapor Deposition(PECVD). RF-power and deposition condition is controlled under 100 W, 150 W, 300 W and 500 W. Treatment time was controlled by 5 min and 10 min. The film properties were evaluated by the X-ray Photoelectron Spectroscopy (XPS) and X-Ray Diffraction (XRD). From the experimental results, we found the optimal condition of titania film which exhibited good performance. Moreover photocatalytic capacity was about twice better than thermal spray titania film, and also as good as titania powder.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.04a
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• pp.87-88
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• 2007

나노 다결정 실리콘 박막 증착을 하기 위해서 현재 정전결합플라즈마(CCP, Capacitively Coupled Plasma)를 이용한 PECVD(Plasma Enhanced Chemical Vapor Deposition) 공정에 관한 여구가 활발히 이루어지고 있다. 유도결합플라즈마는(ICP, Inductively Coupled Plasma) 정전결합플라즈마보다 플라즈마 밀도가 높고 파워전달 효율이 좋은 것으로 알려져 있으나 대면적가 어려워 기판이 큰 TFT-LCD로는 많이 연구되고 있지 않다. 본 연구는 유도결합플라즈마를 위해 내장형 multiple U-type 선형 안테나를 이용하여 나노 다결정 실리콘 박막을 증착하여 그 특성을 분석하였다.

• Journal of the Korean Vacuum Society
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• v.10 no.1
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• pp.119-126
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• 2001

Hydrogenated amorphous carbon (a-C:H) films were deposited by ECR-PECVD (electron cyclotron resonance-plasma enhanced chemical vapor deposition) method with deposition conditions such as ECR plasma source power, gas composition of methane and hydrogen, deposition time and substrate bias voltage. The hydrogen content in the films has been measured by ERDA (elastic recoil detection analysis) using 2.5 MeV $He^{++}$ ion beam. From the results of AES (Auger electron spectroscopy), RBS (Rutherford backscattering spectrometry) and ERDA, the composition elements of deposited film were confirmed the carbon atom and the hydrogen atom. It was observed by FTIR (Fourier transform infrared) that the hydrogen contents in the film varied according to the deposition conditions. In deposition condition of substrate bias voltage, the hydrogen contents were decreased remarkably because the amount of dehydrogenation in films was increased as the substrate bias voltage increased. In the rest deposition conditions, the hydrogen contents in the film were measured in the range 45~55%.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.130-130
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• 2010

Thin Si films were grown by a plasma-enhanced chemical vapor deposition (PECVD, SNTEK, Korea) system. Two different deposition condition were applied and formed a fully amorphous Si (a-Si) film and a micromorph mixing of microcrystalline Si (mc-Si) and a-Si film. Under one sun illumination, the micromorph device provided the enhanced open circuit voltage and fill factor values. It presents the fabrication of the micromorph Si film and the a-Si film by modulating a deposition condition. The performances of the Si thin film Schottky solar cells are discussed.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1473-1474
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• 2011

박막트랜지스터(Thin Film Transistor: TFT)의 게이트 절연층 에서는 박막의 전계강도, 고유전율 및 우수한 표면 특성이 요구된다. HD-PECVD(High Density - Plasma Enhanced Chemical Vapor Deposition)를 이용하여 $NH_3$ 유량 및 기판 온도를 변화시키면서 SiN 박막을 제작하고, 표면특성을 AFM 으로, CONTACT ANGLE로 접촉각을 측정하여 Young's Equation 으로 Surface Energy를 계산하였고 전기적 특성은 MIM 구조를 제작하고 C-V 측정을 하여 조사하였다.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.8
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• pp.34-41
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• 1993

Effect of high temperature annealing conditions on Ta$_{2}O_{5}$ thin films was investigated. Ta$_{2}O_{5}$ thin films were deposited on P-type silicon substrates by plasma-enhanced chemical vapor deposition (PECVD) using tantalum ethylate. Ta(C$_{2}H_{5}O)_{5}$, and nitrous oxide. N$_{2}$O. The microstructure changed from amorphous to polycrystalline above 700.deg. C annealing temperature. The refractive index, dielectric onstant and leakage current of the film increased as annealing temperature increased. However, annealing in oxygen ambient reduced leakage currents and dielectric constant due to the formation of interfacial SiO$_{2}$ layer. By optimizing annealing temperature and ambient, leakage current lower than 10$^{-8}$ A/cm$^{2}$ and maximum capacitance of 9 fF/${\mu}m^{2}$ could be obtained.