• Title/Summary/Keyword: plasma frequency

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Multi-hole RF CCP 방전에서 방전 주파수가 미치는 영향

  • Lee, Heon-Su;Lee, Yun-Seong;Seo, Sang-Hun;Jang, Hong-Yeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.145-145
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    • 2011
  • Recently, multi-hole electrode RF capacitively coupled plasma discharge is being used in the deposition of microcrystalline silicon for thin film solar cell to increase the speed of deposition. To make efficient multi-hole electrode RF capacitively coupled plasma discharge, the hole diameter is to be designed concerning the plasma parameters. In past studies, the relationship between plasma parameters such as pressures and gas species, and hole diameter for efficient plasma density enhancement is experimentally shown. In the presentation, the relationship between plasma deriving frequency and hole diameter for efficient multi-hole electrode RF capacitively coupled plasma discharge is shown. In usual capacitively coupled plasma discharge, plasma parameter, such as plasma density, plasma impedence and plasma temperature, change as frequency increases. Because of the change, the optimum hole diameter of the multi-hole electrode RF capacitively coupled plasma for high density plasma is thought to be modified when the plasma deriving frequency changes. To see the frequency effect on the multi-hole RF capacitively coupled plasma is discharged and one of its electrode is changed from a plane electrode to a variety of multi-hole electrodes with different hole diameters. The discharge is derived by RF power source with various frequency and the plasma parameter is measured with RF compensated single Langmuir probe. The shrinkage of the hole diameter for efficient discharge is observed as the plasma deriving frequency increases.

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Effects of Phase Difference between Voltage loaves Applied to Primary and Secondary Electrodes in Dual Radio Frequency Plasma Chamber

  • Kim, Heon-Chang
    • Journal of the Semiconductor & Display Technology
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    • v.4 no.2 s.11
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    • pp.11-14
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    • 2005
  • In plasma processing reactors, it is common practice to control plasma density and ion bombardment energy by manipulating excitation voltage and frequency. In this paper, a dually excited capacitively coupled rf plasma reactor is self-consistently simulated with a three moment model. Effects of phase differences between primary and secondary voltage waves, simultaneously modulated at various combinations of commensurate frequencies, on plasma properties are investigated. The simulation results show that plasma potential and density as well as primary self-dc bias are nearly unaffected by the phase lag between the primary and the secondary voltage waves. The results also show that, with the secondary frequency substantially lower than the primary frequency, secondary self·do bias remains constant regardless of the phase lag. As the secondary frequency approaches to the primary frequency, however, the secondary self-dc bias becomes greatly altered by the phase lag, and so does the ion bombardment energy at the secondary electrode. These results demonstrate that ion bombardment energy can be more carefully controlled through plasma simulation.

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Application of Low Frequency Region of Microwave Transmission Spectrum in the Cutoff Probe

  • Kim, D.W.;You, S.J.;Na, B.K.;Kim, J.H.;Chang, H.Y.;Oh, W.Y.
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.147-147
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    • 2012
  • Cutoff probe has been used for measuring a plasma density using the cutoff peak which is located at the plasma frequency in the low pressure plasma. However, research on analysis of low frequency region of transmission microwave frequency (TMF) spectrum does not performed even though important plasma parameters are located in the low frequency region, i.e., ion plasma frequency and collision frequency. In this research, we analyzed the low frequency region of the TMF spectrum. Experimental results reveal the effect of plasma parameters on the low frequency region on the TMF spectrum. Based on the response of TMF spectrum from changing of plasma parameters, deduction of the plasma parameters was tried. This comprehensive analysis of TMF spectrum expands applicable area of cutoff probe.

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A Study on Magnetized Inductively Coupled Plasma Using Cutoff Probe (Cutoff Probe를 이용한 자화유도결합 플라즈마의 특성 연구)

  • Son, Eui-Jeong;Kim, Dong-Hyun;Lee, Ho-Jun
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.65 no.10
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    • pp.1706-1711
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    • 2016
  • Electromagnetic wave simulation was performed to predict characteristics of manufactured cutoff probe at low temperature magnetized plasma medium. Microwave cutoff probe is designed for research the properties of magnetized inductively coupled plasma. It was shown that the cutoff probe method can safely be used for weakly magnetized high density plasma sources. Cutoff probe system with two port network analyzer has been prepared and applied to measure electron density distributions in large area, 13.56MHz driven weakly magnetized inductively coupled plasma source. The results shown that, the plasma frequency confirmed cut-off characteristics in low temperature plasma. Especially, cut-off characteristics was found at upper hybrid resonance frequency in the environment of the magnetic field. In case of a induced weak magnetic field in inductively coupled plasma, plasma density estimated from the cutoff frequency in the same way at unmagnetized plasma due to nearly same plasma frequency and upper hybrid resonance frequency. The plasma density is increased and uniformity is improved by applying a induced weak magnetic field in inductively coupled plasma.

A Study on the Optimal Design of 5 kW Plasma Discharger (5kW급 플라즈마 방전장치 설계 최적화의 관한 연구)

  • Noh, Hyun-Kyu;Shin, Chul-Jun;Lee, Jun-Young
    • The Transactions of the Korean Institute of Power Electronics
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    • v.21 no.2
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    • pp.150-159
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    • 2016
  • This paper presents a study on the design optimization of a 5 kW plasma discharger for driving plasma reactor. The proposed study is composed of a high-frequency inverter based on the full-bridge circuit using soft switching techniques for high-frequency switching. The switching frequency in the operating region is the area of 130-200 kHz. By applying the LC resonance technique and a variable switching frequency, control technique is designed to be stable under changes in the load characteristics of the plasma reactor. This paper presents a quantitative analysis technique for design optimization. Experiments are performed according to load characteristic variations depending on the vacuum of the plasma reactor. This paper has verified the topology and design method for the 5 kW plasma discharger design.

Electron-neutral Collision Frequency Measurement Using Cutoff Method

  • Yu, Gwang-Ho;Kim, Dae-Ung;Na, Byeong-Geun;Jang, Hong-Yeong;Yu, Sin-Jae;Kim, Jeong-Hyeong;Seong, Dae-Jin;Sin, Yong-Hyeon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.150-150
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    • 2011
  • Electron-neutral collision frequency is one of the important parameters in the plasma physics. Recently, It is employed to monitor the plasma processing in industrial plasma engineering [1]. Using the wave-cutoff probe with network analyzer, the plasma impedance was measured in inductively coupled argon plasma and analyzed to determine the resonance frequency. The electron-neutral collision frequency is directly calculated from the resonance frequency. The calculated electron-neutral collision frequency is good agree with reference which is calculated by measured EEDF using single langmuir probe (SLP).

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Selective etching of SiO2 using embedded RF pulsing in a dual-frequency capacitively coupled plasma system

  • Yeom, Won-Gyun;Jeon, Min-Hwan;Kim, Gyeong-Nam;Yeom, Geun-Yeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.136.2-136.2
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    • 2015
  • 반도체 제조는 chip의 성능 향상 및 단가 하락을 위해 지속적으로 pattern size가 nano size로 감소해 왔고, capacitor 용량은 증가해 왔다. 이러한 현상은 contact hole의 aspect ratio를 지속적으로 증가시킨바, 그에 따라 최적의 HARC (high aspect ratio contact)을 확보하는 적합한 dry etch process가 필수적이다. 그러나 HARC dry etch process는 많은 critical plasma properties 에 의존하는 매우 복잡한 공정이다. 따라서, critical plasma properties를 적절히 조절하여 higher aspect ratio, higher etch selectivity, tighter critical dimension control, lower P2ID과 같은 plasma characteristics을 확보하는 것이 요구된다. 현재 critical plasma properties를 제어하기 위해 다양한 plasma etching 방법이 연구 되어왔다. 이 중 plasma를 낮은 kHz의 frequency에서 on/off 하는 pulsed plasma etching technique은 nanoscale semiconductor material의 etch 특성을 효과적으로 향상 시킬 수 있다. 따라서 본 실험에서는 dual-frequency capacitive coupled plasma (DF-CCP)을 사용하여 plasma operation 동안 duty ratio와 pulse frequency와 같은 pulse parameters를 적용하여 plasma의 특성을 각각 제어함으로써 etch selectivity와 uniformity를 향상 시키고자 하였다. Selective SiO2 contact etching을 위해 top electrode에는 60 MHz pulsed RF source power를, bottom electrode에는 2MHz pulse plasma를 인가하여 synchronously pulsed dual-frequency capacitive coupled plasma (DF-CCP)에서의 plasma 특성과 dual pulsed plasma의 sync. pulsing duty ratio의 영향에 따른 etching 특성 등을 연구 진행하였다. 또한 emissive probe를 통해 전자온도, OES를 통한 radical 분석으로 critical Plasma properties를 분석하였고 SEM을 통한 etch 특성분석과 XPS를 통한 표면분석도 함께 진행하였다. 그 결과 60%의 source duty percentage와 50%의 bias duty percentage에서 가장 향상된 etch 특성을 얻을 수 있었다.

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Simulation of a Dually Excited Capacitively Coupled RF Plasma

  • Kim, Heon-Chang;Sul, Yong-Tae;Park, Sung-Jin
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07a
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    • pp.513-514
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    • 2005
  • In plasma processing reactors, it is common practice to control plasma density and ion bombardment energy by manipulating excitation voltage and frequency. In this paper, a dually excited capacitively coupled rf plasma reactor is self-consistently simulated with a three moment model. Effects of phase differences between primary and secondary voltage waves, simultaneously modulated at various combination of commensurate frequencies, on plasma properties are investigated. The simulation results show that plasma potential and density as well as primary self-dc bias are nearly unaffected by the phase lag between the primary and the secondary voltage waves. The results also show that, with the secondary frequency substantially lower than the primary frequency, secondary self-dc bias remains constant regardless of the phase lag. As the secondary frequency approaches to the primary frequency, however, the secondary self-dc bias becomes greatly altered by the phase lag, and so does the ion bombardment energy at the secondary electrode. These results demonstrate that ion bombardment energy can be more carefully controlled through plasma simulation.

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The Experimental Research On The Electrical Characteristics For The Ignition Of Plasma Jet Using The Advance Discharge Of High Frequency Voltage With Attenuation (감쇠파 고주파전압의 선행방전을 이용한 Plasma jet의 전기적 기동특성에 대한 실험적 연구)

  • Choon Saing Jhoun
    • 전기의세계
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    • v.21 no.4
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    • pp.27-38
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    • 1972
  • This paper discusses the characteristics about the ignition of D.C. main discharge is a plasma jet generator, manufactured for trial as non-transferred type, when the electrical energy appropriate to the ignition is supplied to the gap between the electrodes by using advance discharge of attenuating high frequency voltage generated by a high frequency oscillator with mercury spark gap. These characteristics are under the influences of (a) the length of mercury gap in high frequency oscillator and the quantity of hydrogen flow supplied to it, (b) the condenser capacity of the high frequency oscillator circuit, (c) the length of plasma jet torch in D.C. main discharge circuit and the quantity of argon flow supplied to it, (d) the circuit constants of D.C. main discharge circuit. The results for these characteristics, obtained by this research, are considered to be helpful to the designs for the ignition of a plasma jet as well as the welding arc stabilizer by high frequency discharge and the high frequency arc welder.

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APPLICATION OF RADIO-FREQUENCY (RF) THERMAL PLASMA TO FILM FORMATION

  • Terashima, Kazuo;Yoshida, Toyonobu
    • Journal of the Korean institute of surface engineering
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    • v.29 no.5
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    • pp.357-362
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    • 1996
  • Several applications of radio-frequency (RF) thermal plasma to film formation are reviewed. Three types of injection plasma processing (IPP) technique are first introduced for the deposition of materials. Those are thermal plasma chemical vapor deposition (CVD), plasma flash evaporation, and plasma spraying. Radio-frequency (RF) plasma and hybrid (combination of RF and direct current(DC)) plasma are next introduced as promising thermal plasma sources in the IPP technique. Experimental data for three kinds of processing are demonstrated mainly based on our recent researches of depositions of functional materials, such as high temperature semiconductor SiC and diamond, ionic conductor $ZrO_2-Y_2O_3$ and high critical temperature superconductor $YBa_2Cu_3O_7-x$. Special emphasis is given to thermal plasma flash evaporation, in which nanometer-scaled clusters generated in plasma flame play important roles as nanometer-scaled clusters as deposition species. A novel epitaxial growth mechanism from the "hot" clusters namely "hot cluster epitaxy (HCE)" is proposed.)" is proposed.osed.

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