Journal of the Korean institute of surface engineering (한국표면공학회지)
- Volume 29 Issue 5
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- Pages.357-362
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- 1996
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- 1225-8024(pISSN)
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- 2288-8403(eISSN)
APPLICATION OF RADIO-FREQUENCY (RF) THERMAL PLASMA TO FILM FORMATION
- Terashima, Kazuo (The University of Tokyo, Graduate School of Engineering, Department of Metallurgy and Materials Science) ;
- Yoshida, Toyonobu (The University of Tokyo, Graduate School of Engineering, Department of Metallurgy and Materials Science)
- Published : 1996.10.01
Abstract
Several applications of radio-frequency (RF) thermal plasma to film formation are reviewed. Three types of injection plasma processing (IPP) technique are first introduced for the deposition of materials. Those are thermal plasma chemical vapor deposition (CVD), plasma flash evaporation, and plasma spraying. Radio-frequency (RF) plasma and hybrid (combination of RF and direct current(DC)) plasma are next introduced as promising thermal plasma sources in the IPP technique. Experimental data for three kinds of processing are demonstrated mainly based on our recent researches of depositions of functional materials, such as high temperature semiconductor SiC and diamond, ionic conductor
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