• Title/Summary/Keyword: plasma flow

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COMPUTATIONAL MODELING AND SIMULATION OF METAL PLASMA GENERATION BETWEEN CYLINDRICAL ELECTRODES USING PULSED POWER (펄스파워를 이용한 실린더형 전극간 금속 플라즈마 생성현상의 전산유동해석)

  • Kim, K.;Kwak, H.S.;Park, J.Y.
    • Journal of computational fluids engineering
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    • v.19 no.4
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    • pp.68-74
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    • 2014
  • This computational study features the transient compressible and inviscid flow analysis on a metallic plasma discharge from the opposing composite electrodes which is subjected to pulsed electric power. The computations have been performed using the flux corrected transport algorithm on the axisymmetric two-dimensional domain of electrode gap and outer space along with the calculation of plasma compositions and thermophysical properties such as plasma electrical conductivity. The mass ablation from aluminum electrode surfaces are modeled with radiative flux from plasma column experiencing intense Joule heating. The computational results shows the highly ionized and highly under-expanded supersonic plasma discharge with strong shock structure of Mach disk and blast wave propagation, which is very similar to muzzle blast or axial plasma jet flows. Also, the geometrical effects of composite electrodes are investigated to compare the amount of mass ablation and penetration depth of plasma discharge.

Modeling of Process Plasma Using a Radial Basis Function Network: A Cases Study

  • Kim, Byungwhan;Sungjin Rark
    • Transactions on Control, Automation and Systems Engineering
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    • v.2 no.4
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    • pp.268-273
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    • 2000
  • Plasma models are crucial to equipment design and process optimization. A radial basis function network(RBFN) in con-junction with statistical experimental design has been used to model a process plasma. A 2$^4$ full factorial experiment was employed to characterized a hemispherical inductively coupled plasma(HICP) in characterizing HICP, the factors that were varied in the design include source power, pressure, position of shuck holder, and Cl$_2$ flow rate. Using a Langmuir probe, plasma attributes were collected, which include typical electron density, electron temperature. and plasma potential as well as their spatial uniformity. Root mean-squared prediction errors of RBEN are 0.409(10(sup)12/㎤), 0.277(eV), and 0.699(V), for electron density, electron temperature, and Plasma potential, respectively. For spatial uniformity data, they are 2.623(10(sup)12/㎤), 5.704(eV) and 3.481(V), for electron density, electron temperature, and plasma potential, respectively. Comparisons with generalized regression neural network(GRNN) revealed an improved prediction accuracy of RBFN as well as a comparable performance between GRNN and statistical response surface model. Both RBEN and GRNN, however, experienced difficulties in generalizing training data with smaller standard deviation.

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N$_2$ Plasma Treatment Effects of Silicon Nitride Insulator Layer for Thin Film Transistor Applications

  • Ko, Jae-Kyung;Park, Yong-Seob;Park, Joong-Hyun;Kim, Do-Young;Yi, Jun-Sin;Chakrabarty, K.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2002.08a
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    • pp.563-566
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    • 2002
  • We investigated to decrease the leakage current of SiNx film by employing $N_2$ plasma treatment. The insulator layers were prepared by two step process; the $N_2$ plasma treatment and then PECVD SiNx deposition with $SiH_4$, $N_2$ gases. To prove the influence of the $N_2$ plasma treatment, the Si substrate was exposed to the plasma, which was generated in Ne gas ambient. Without plasma treatment SiNx film grow at the rate of 7. 03 nm/min, has a refractive index n = 1.77 and hydrogen content of $2.16{\times}10^{22}cm^{-3}$ for $N_2/SiH_4$ gas flow ratio of 20. The obtained films were analyzed in terms of deposition rates, refractive index, hydrogen concentration, and electrical properties. By employing $N_2$ plasma treatment, interface traps such as mobile charges and injected charges were removed, hysteresis of capacitance-voltage (C-V) disappeared. We observed plasma treated sample were decreased the leakage current density reduces by 2 orders with respect to the sample having no plasma treatment.

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Characterization of Inductively Coupled Ar/CH4 Plasma using the Fluid Simulation (유체 시뮬레이션을 이용한 유도결합 Ar/CH4 플라즈마의 특성 분석)

  • Cha, Ju-Hong;Lee, Ho-Jun
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.65 no.8
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    • pp.1376-1382
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    • 2016
  • The discharge characteristics of inductively coupled $Ar/CH_4$ plasma were investigated by fluid simulation. The inductively coupled plasma source driven by 13.56 Mhz was prepared. Properties of $Ar/CH_4$ plasma source are investigated by fluid simulation including Navier-Stokes equations. The schematics diagram of inductively coupled plasma was designed as the two dimensional axial symmetry structure. Sixty six kinds of chemical reactions were used in plasma simulation. And the Lennard Jones parameter and the ion mobility for each ion were used in the calculations. Velocity magnitude, dynamic viscosity and kinetic viscosity were investigated by using the fluid equations. $Ar/CH_4$ plasma simulation results showed that the number of hydrocarbon radical is lowest at the vicinity of gas feeding line due to high flow velocity. When the input power density was supplied as $0.07W/cm^3$, CH radical density qualitatively follows the electron density distribution. On the other hand, central region of the chamber become deficient in CH3 radical due to high dissociation rate accompanied with high electron density.

Analysis of Inductively Coupled Plasma using Electrostatic Probe and Fluid Simulation (정전 탐침법과 유체 시뮬레이션을 이용한 유도결합 Ar 플라즈마의 특성 연구)

  • Cha, Ju-Hong;Lee, Ho-Jun
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.65 no.7
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    • pp.1211-1217
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    • 2016
  • Discharge characteristics of inductively coupled plasma were investigated by using electrostatic probe and fluid simulation. The Inductively Coupled Plasma source driven by 13.56 Mhz was prepared. The signal attenuation ratios of the electrostatic probe at first and second harmonic frequency was tuned in 13.56Mhz and 27.12Mhz respectively. Electron temperature, electron density, plasma potential, electron energy distribution function and electron energy probability function were investigated by using the electrostatic probe. Experiment results were compared with the fluid simulation results. Ar plasma fluid simulations including Navier-Stokes equations were calculated under the same experiment conditions, and the dependencies of plasma parameters on process parameters were well agreed with simulation results. Because of the reason that the more collision happens in high pressure condition, plasma potential and electron temperature got lower as the pressure was higher and the input power was higher, but Electron density was higher under the same condition. Due to the same reason, the electron energy distribution was widening as the pressure was lower. And the electron density was higher, as close to the gas inlet place. It was found that gas flow field significantly affect to spatial distribution of electron density and temperature.

플라즈마 디스플레이 패널(Plasma Display Panel) 텔레비전에서의 냉각 소음 저감

  • 김규영;최민구;이덕주
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2003.05a
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    • pp.719-724
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    • 2003
  • The present experimental study deals with noise reduction and improvements in cooling performance in a plasma display panel(PDP) television (TV). To reduce the noise, the effects of installation parameters are studied. The experimental parameters under investigation are the distance between the fan and the rear case of a PDP TV, position of the strut on the fan, and the fan RPM. The variance of RPM is the most significant facto., and a 250 RPM decrease from 910 RPM causes about 4㏈(A) reduction in the system noise. To increase performance, flow characteristics are investigated by using a visualization technique and measuring the volume flow rate. The visualized results show that a radial direction flow due to large system resistance is significant, and an axial velocity oscillation is observed from the measurement of the volume flow rate. To prevent both a radial direction flow and an axial velocity oscillation, sponges are inserted in the space between f3n and the rear case. Inserted sponges improve the volume flow rate of cooling fans up to 32% since they convert a radial direction flow to an axial direction flow. Also an axial velocity oscillation with large amplitude and low RPM disappears. Increasing volume flow rate causes the PDP TV to improve its cooling performance. Additionally the same volume flow rate can be obtained with a decreased fan speed due to the inserted sponge. Noise reductions of 4.2 ㏈(A) at the rear and 1.1 ㏈(A) at the front of the TV are obtained by the decreased RPM. An increase of 10% of the volume flow rate is also achieved by inserting sponges.

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Capacitively Coupled SF6, SF6/O2, SF6/CH4 Plasma Etching of Acrylic at Low Vacuum Pressure (저진공 축전결합형 SF6, SF6/O2, SF6/CH4 플라즈마를 이용한 아크릴의 반응성 건식 식각)

  • Park, Yeon-Hyun;Joo, Young-Woo;Kim, Jae-Kwon;Noh, Ho-Seob;Lee, Je-Won
    • Korean Journal of Materials Research
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    • v.19 no.2
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    • pp.68-72
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    • 2009
  • This study investigated dry etching of acrylic in capacitively coupled $SF_6$, $SF_6/O_2$ and $SF_6/CH_4$ plasma under a low vacuum pressure. The process pressure was 100 mTorr and the total gas flow rate was fixed at 10 sccm. The process variables were the RIE chuck power and the plasma gas composition. The RIE chuck power varied in the range of $25{\sim}150\;W$. $SF_6/O_2$ plasma produced higher etch rates of acrylic than pure $SF_6$ and $O_2$ at a fixed total flow rate. 5 sccm $SF_6$/5 sccm $O_2$ provided $0.11{\mu}m$/min and $1.16{\mu}m$/min at 25W and 150W RIE of chuck power, respectively. The results were nearly 2.9 times higher compared to those at pure $SF_6$ plasma etching. Additionally, mixed plasma of $SF_6/CH_4$ reduced the etch rate of acrylic. 5 sccm $SF_6$/5 sccm $CH_4$ plasma resulted in $0.02{\mu}m$/min and $0.07{\mu}m$/min at 25W and 150W RIE of chuck power. The etch selectivity of acrylic to photoresist was higher in $SF_6/O_2$ plasma than in pure $SF_6$ or $SF_6/CH_4$ plasma. The maximum RMS roughness (7.6 nm) of an etched acrylic surface was found to be 50% $O_2$ in $SF_6/O_2$ plasma. Besides the process regime, the RMS roughness of acrylic was approximately $3{\sim}4\;nm$ at different percentages of $O_2$ with a chuck power of 100W RIE in $SF_6/O_2$ plasma etching.

Surface Modification of Polyurethane Film Using Atmospheric Pressure Plasma (대기압 플라스마에 의한 폴리우레탄 필름의 표면 개질)

  • Yang In-Young;Myung Sung-Woon;Choi Ho-Suk;Kim In-Ho
    • Polymer(Korea)
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    • v.29 no.6
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    • pp.581-587
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    • 2005
  • Commercial polyurethane film (PU) was modified with Ar plasma ionized in dielectric barrier discharge (DBD) plate-type reactor under atmospheric pressure. We measured the change of the contact angle and the surface fee energy with respect to the plasma treatment conditions such as treatment time, RF-power, and Ar gas flow rate. We also optimized the plasma treatment conditions to maximize the surface peroxide concentration. At the plasma treatment time of 70 sec, the power of 120 W and the Ar gas flow rate of 5 liter per minute (LPM), the best wettability and the highest surface fee energy were obtained. The 1,1 diphenyl-2-picrylhydrazyl (DPPH) method confirmed that the surface peroxide concentration was about 2.1 nmol/$\cm^{2}$ at 80 W, 30 sec, 6 LPM.

Adhesion Enhancement of Solvent type and Water Soluble Adhesive Using Atmospheric Plasma (대기압 플라즈마를 이용한 용제형 및 수용성 접착제의 접착력 향상)

  • Jung, Young Sig;Seul, Soo Duk
    • Journal of Adhesion and Interface
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    • v.10 no.3
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    • pp.148-153
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    • 2009
  • An atmospheric plasma pre-treatment method was applied to PU foam, Leather (Action), Rubber to improve its adhesion using solvent and water soluble type pressure sensitive adhesion in atmospheric plate type reactor. In order to investigate the optimum reaction condition of plasma treatment, type of reaction gas (nitrogen), rate of gas flow (30~100 mL/min), and reaction time (0~30 s) were examined in a plate plasma reactor. The result of the surface modification with respect to the treatment procedure was characterized by using SEM. Due to a de-crease of the contact angle of various materials, the greatest adhesion strength was achieved at optimum condition such as flow rate of 100 mL/min, reaction time of 10 second for an atmospheric plasma treatment of the PU foam, EVA foam, Leather (Action) and Rubber also resulted in the improvement of the adhesion.

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RENAL REGULATION OF UREA EXCRETION IN SWAMP BUFFALO FED WITH HIGH PROTEIN SUPPLEMENTATION

  • Chaiyabutr, N.;Chanpongsang, S.;Loypetjra, P.
    • Asian-Australasian Journal of Animal Sciences
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    • v.8 no.3
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    • pp.275-280
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    • 1995
  • The effect of supplemented high protein diet intake on renal urea regulation in swamp buffalo was carried out in the present experiment Five swamp buffalo heifers weighing between 208-284 kg were used for this study. The animals were fed with a supplementary high protein diet and renal function and kinetic parameters for urea excretion were measured. This was compared to a control period where the same animals had been fed only with paragrass and water hyacinth. For 2 months the same animals were fed a mixed of paragrass, water hyacinth plus 2 kgs of a high protein supplement (protein 18.2% DM basis) per head per day. In comparison to the control period, there were no differences in the rate of urine flow, glomerular filtration rate (GFR), effective renal plasma flow (ERPF), plasma urea concentration and filtered urea. In animals supplemented with high protein intake mean values of urea clearance, excretion rate and the urea urine/plasma concentration ratio markedly increased (p < 0.05) while renal urea reabsorption significantly decreased from 40% to 26% of the quantity filtered. In this same study group urea space distribution and urea pool size increased which coincided with an increase in plasma volume (p < 0.05). Plasma protein decreased while plasma osmolarity increased (p < 0.05). Both urea turnover rate and biological half-life of $^{14}C$-urea were not affected by a supplementary high protein intake. The results suggest that animals supplemented with high protein diets are in a state of dynamic equilibrium of urea which is well balanced between urea excreted into the urine and the amount synthesized. The limitation for renal tubular urea reabsorption would be a change in extra-renal factors with an elevation of the total pool size of nitrogenous substance.