• Korean Journal of Materials Research
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• v.15 no.4
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• pp.246-251
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• 2005

Plasma enhanced chemical vapor deposition(PE-CVD) method has an advantage in synthesizing carbon nanotubes(CNTs) at lower temperature compared with thermal enhanced chemical vapor deposition(TE-CVD) method. In this study, CNTs was prepared by using PE-CVD method. The growth rate of CNT was faster more than 100 times on using Invar alloy than iron as catalyst. It was found that chrome silicide was formed at the interface between chrome layer and silicon substrate which should be considered in designing process. Nanoparticles of Invar catalyst were found oxidized on their surfaces with a depth of 10 m. Microstructure was analyzed by scanning electron microscopy, transmission electron microscopy, scanning transmission electron microscopy, and energy dispersive x-ray spectrometry. Based on the result of analysis, growth mechanism at an initial stage was suggested.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.248-248
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• 2012

Synthesis graphene on Cu substrate by plasma-enhanced chemical vapor deposition (PE-CVD) is investigated and its quality's affection factors are discussed in this work. Compared with the graphene synthesized at high temperature in chemical vapor deposition (CVD), the low-temperature graphene film by PE-CVD has relatively low quality with many defects. However, the advantage of low-temperature is also obvious that low melting point materials will be available to synthesize graphene as substrate. In this study, the temperature will be kept constant in $400^{\circ}C$ and the graphene was grown in plasma environment with changing the plasma power, the flow rate of precursors, and the distance between plasma generator coil and substrates. Then, we investigate the effect of temperature and the influence of process variables to graphene film's quality and characterize the film properties with Raman spectroscopy and sheet resistance and optical emission spectroscopy.

• Journal of the Semiconductor & Display Technology
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• v.23 no.2
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• pp.55-59
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• 2024

Plasma Enhanced Chemical Vapor Deposition (PE-CVD) is a widely used technology in semiconductor manufacturing for thin film deposition. The implementation of wafer guide rings in PE-CVD processes is crucial for enhancing efficiency and product quality by ensuring uniform deposition around wafer edges and reducing particle generation. On the other hand, to prevent overall temperature non-uniformity and degradation of thin film quality within the chamber, it is essential to consider various parameters comprehensively. In this study, after applying the wafer guide rings, temperature variations and fluid flow changes were simulated. Additionally, by simulating the temperature and flow changes when applied to the PE-CVD chamber, this paper discusses the importance of optimizing variables within the entire chamber.

• The korean journal of orthodontics
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• v.36 no.6
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• pp.451-464
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• 2006

The purpose of this study was to search for an appropriate method of coating $TiO_2$ on orthodontic appliances. $TiO_2$ thin films were deposited on orthodontic wires and brackets using sol-gel, CVD (Chemical Vapor Deposition) and PE-CVD (Plasma Enhanced-CVD) methods. The roughness of $TiO_2$-coated surfaces was investigated via scanning electron microscope (SEM) and adhesive strength of $TiO_2$ thin films was measured by adhesive tape pull test. Methylene blue degradation test was carried out to evaluate the photocatalytic activity of $TiO_2$ and the corrosion resistance of $TiO_2$ thin films against fluoride solution was also analyzed by observing the surfaces of $TiO_2$-coated wires and brackets via SEM after immersion in sodium fluoride solution. Through the comparison of properties and photocatalytic activity of $TiO_2$ thin films according to the coating methods, the following results were obtained. Smoother surfaces of $TiO_2$ thin films were generated by CVD or PE-CVD methods than through the sol-gel method or the control. Adhesive strength of the $TiO_2$ thin films was highest in PE-CVD and gradually became lower in the order of CVD, then the sol-gel method. Photocatalytic activity of $TiO_2$ thin films on methylene blue was the highest in PE-CVD and gradually became lower in the order of CVD, then the sol-gel method. Corrosion resistance of $TiO_2$ thin films against fluoride solution was stronger in CVD and PE-CVD methods than in the sol-gel method. The results of this study suggest that the CVD or PE-CVD methods is more appropriate than the sol-gel method for $TiO_2$ coating on orthodontic wires and brackets.

• Journal of the Semiconductor & Display Technology
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• v.19 no.2
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• pp.16-21
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• 2020

How accurately reproducible energy is delivered to the wafer in the process of making thin films using PE-CVD (Plasma enhanced chemical vapor deposition) during the semiconductor process. This is the most important technique, and most of the reaction on the wafer surface is made by thermal energy. In this study, we studied the method of monitoring the change of thermal energy transferred to the wafer surface by monitoring the temperature change according to the change of the thin film formed on the showerhead facing the wafer. Through this research, we could confirm the monitoring of wafer thin-film which is changed due to abnormal operation and accumulation of equipment, and we can expect improvement of semiconductor quality and yield through process reproducibility and equipment status by real-time monitoring of problem of deposition process equipment performance.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.436-436
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• 2010

국내 반도체 시장은 세계 1위의 시장점유율을 가지고 있지만 핵심장비의 경우 국내 장비 기술의 낙후로 인해 대부분을 선진국에 의존하는 실정이다. 따라서 국내 장비 기술의 발전 요구에 따라 연구가 진행되었으며 기존 PE-CVD (Plasma Enhanced Chemical Vapor Deposition) 장비에서의 하전입자에 의한 기판 손상 가능을 제거하고 개개의 반응 원소의 에너지와 플럭스를 조절하여 다양한 공정온도에서 증착을 구현할 수 있는 HNB-CVD(Hyperthermal Neutral Beam Chemical Vapor Deposition) 장비를 개발하였다. 고밀도 플라즈마 생성을 위한 마이크로웨이브 SLAN(Slot Antenna) 소스를 사용하였으며 대면적 공정에 적합하도록 설계하였다. 최적의 설계와 진단을 위한 마이크로웨이브 SLAN 소스내의 E-field 분포 시뮬레이션과 Langmuir Probe 진단이 이루어졌다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.148-148
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• 2008

Low-k dielectric materials are an alternative plan to improve the signal propagation delay, crosstalk, dynamic power consumption due to resistance and parasitic capacitance generated the decrease of device size. Now, various materials is studied for the next generation. Diethoxymethlysiliane (DEMS) precursor using this study has two ethoxy groups along with one methyl group attached to the silicon atoms. SiCOH thin films were deposited on p-type Si(100) substrate by Plasma Enhanced Chemical Vapor Deposition (PECVD) using DEMS. In this study, we studied the effect of oxygen($O_2$) flow rate for DEMS to characteristics of thin films. The characteristics of thin films deposited using DEMS and $O_2$ evaluated through refractive index, dielectric constant(k), surface roughness, I-V(MIM:Al / SiCOH / Ag), C-V(MIM), deposition rate.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.538-539
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• 2013

여러 장점으로 인해 OLED는 디스플레이 및 조명 등 적용분야가 넓어지고 있지만, 수분 및 산소에 취약하여 그 수명이 제한되는 단점이 있다. 이를 해결하고자 현재까지는 glass cap을 이용한 encapsulation 기술이 적용되고 있지만, flexible 기판에 적용하지 못하는 문제가 있다. 이러한 문제를 해결하고자 여러 가지 thin film encapsulation 기술이 적용되고 있으나 보다 신뢰성이 높은 기술의 개발이 절실한 때이다. Encapsulation 무기 박막 물질로서 $Si_3N_4$ 박막은 PE-CVD (Plasma Enhanced Chemical Vapor Deposition) 등의 박막 증착법을 사용한 많은 연구가 진행되어, 저온에서의 좋은 품질의 박막 증착이 가능하지만, 100도 이하의 thermal budget을 갖는 OLED Encapsulation에 사용하기에는 충분하지 않았다. CVD 박막의 특성을 더욱 개선하기 위해 최근 ALD (Atomic Layer Deposition) 방법을 통한 $Al_2O_3$ film 증착 방법이 연구되고 있지만, 낮은 증착 속도로 인해 양산에 걸림돌이 되고 있다. 본 연구에서는 또 다른 해결책으로서 Digital CVD 방법을 이용한 양질의 $Si_3N_4$ 박막의 증착을 연구하였다. 이것은 ALD 증착법과 유사하며, 1st step에서 PECVD 방법으로 4~5 ${\AA}$의 얇은 silicon 박막을 증착하고, 2nd step에서 nitrogen plasma를 이용하여 질화 반응을 진행하고, 이러한 cycle을 원하는 두께가 될 때까지 반복적으로 진행된다. 이 때 1 cycle 당 증착속도는 7 ${\AA}$/cycle 정도였다. 최적의 증착 방법과 조건으로 기존의 CVD $Si_3N_4$ 박막 대비 1/5 이하로 pinhole을 최소화 할 수는 있지만 완벽하게 제거하기는 힘든 문제가 있고, 이를 해결하기 위한 개선을 위한 접근 방법이 필요하다고 판단하였다. 본 연구에서는 무기물 박막인 carbon nitride를 이용한 SiN/C:N multilayer 증착 연구를 진행하였다. Fig. 1은 CVD 조건으로 증착된 두께 750 nm SiN film에서 여러 층의 C:N film layer를 삽입했을 때, 38 시간의 85%/$85^{\circ}C$ 가속실험에 따라 OLED의 발광 사진이다. 그림에서 볼 수 있듯이 C:N 층을 삽입하고 또한 그 박막의 수가 증가함에 따라서 OLED에 대한 encapsulation 특성이 크게 개선됨을 확인할 수 있다.

• KSTLE International Journal
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• v.9 no.1_2
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• pp.22-25
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• 2008

This paper investigated the wetting and adhesion property of undulated DLC film with surface morphology controlled for a reduced real area of contact. The undulated DLC Films were prepared by 13.56 MHZ radio frequency plasma enhanced chemical vapor deposition (r.f. PECVD) by using nanoscale Cu dots surface on a Si (100) substrate. FE-SEM, AFM analysis showed that the after repeated deposition and plasma induced damage with Ar ions, the surface was nanoscale undulated. This phenomenon changed the surface morphology of DLC surface. Raman spectra of film with changed morphology revealed that the plasma induced damage with Ar ions significantly suppressed the graphitization of DLC structure. Also, it was observed that while the untreated flat DLC surfaces had wetting angle starting ranged from $72^{\circ}$ and adhesion force of 333ni. Had wetting angle the undulated DLC surfaces, which resemble the surface morphology of a cylindrical shape, increased up to $104^{\circ}$ and adhesion force decreased down to 11 nN. The measurements agree with Hertz and JKR models. The surface undulation was affected mainly by several factors: the surface morphology affinity to cylindrical shape, reduction of the real area of contact and air pockets trapped in cylindrical asperities of the surface.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.319-319
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• 2013

Even though the fabrication methods of metal oxide based thin film capacitor have been well established such as RF sputtering, Sol-gel, metal organic chemical vapor deposition (MOCVD), ion beam assisted deposition (IBAD) and pulsed laser deposition (PLD), an applicable capacitor of printed circuit board (PCB) has not realized yet by these methods. Barium Strontium Titanate (BST) and other high-k ceramic oxides are important materials used in integrated passive devices, multi-chip modules (MCM), high-density interconnect, and chip-scale packaging. Thin film multi-layer technology is strongly demanded for having high capacitance (120 nF/$mm^2$). In this study, we suggest novel multi-layer thin film capacitor design and fabrication technology utilized by plasma assisted deposition and photolithography processes. Ba0.6Sr0.4TiO3 (BST) was used for the dielectric material since it has high dielectric constant and low dielectric loss. 5-layered BST and Pt thin films with multi-layer sandwich structures were formed on Pt/Ti/$SiO_2$/Si substrate by RF-magnetron sputtering and DC-sputtering. Pt electrodes and BST layers were patterned to reveal internal electrodes by photolithography. SiO2 passivation layer was deposited by plasma-enhanced chemical vapor deposition (PE-CVD). The passivation layer plays an important role to prevent short connection between the electrodes. It was patterned to create holes for the connection between internal electrodes and external electrodes by reactive-ion etching (RIE). External contact pads were formed by Pt electrodes. The microstructure and dielectric characteristics of the capacitors were investigated by scanning electron microscopy (SEM) and impedance analyzer, respectively. In conclusion, the 0402 sized thin film multi-layer capacitors have been demonstrated, which have capacitance of 10 nF. They are expected to be used for decoupling purpose and have been fabricated with high yield.