• 한국전자현미경학회:학술대회논문집
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• 한국현미경학회 1999년도 제30차 추계학술대회
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• pp.72-72
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• 1999

• 한국환경보건학회지
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• 제39권3호
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• pp.289-299
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• 2013

Objectives: For the field application of the dielectric barrier discharge plasma reactor, scale-up of the plasma reactor is needed. This study investigated the possibility of inactivation of microorganisms in sewage using pilot multi-plasma reactor. We also considered the possibility of degradation of total organic carbon (TOC) and nonbiodegradable matter ($UV_{254}$) in sewage. Methods: The pilot plasma reactor consists of plasma reactor with three plasma modules (discharge electrode and quartz dielectric tube), liquid-gas mixer, high voltage transformers, gas supply equipment and a liquid circulation system. In order to determine the operating conditions of the pilot plasma reactor, we performed experiments on the operation parameters such as gas and liquid flow rate and electric discharge voltage. Results: The experimental results showed that optimum operation conditions for the pilot plasma reactor in batch experiments were 1 L/min air flow rate), 4 L/min liquid circulation rate, and 13 kV electric discharge voltage, respectively. The main operation factor of the pilot plasma process was the high voltage. In continuous operation of the air plasma process, residual microorganisms, $UV_{254}$ absorbance and TOC removal rate at optimal condition of 13 kV were $10^{2.24}$ CFU/mL, 56.5% and 8.6%, respectively, while in oxygen plasma process at 10 kV, residual microorganisms, $UV_{254}$ absorbance and TOC removal rate at optimal conditions were $10^{1.0}$ CFU/mL, 73.3% and 24.4%, respectively. Electric power was increased exponentially with the increase in high voltage ($R^2$ = 0.9964). Electric power = $0.0492{\times}\exp^{(0.6027{\times}lectric\;discharge\;voltage)}$ Conclusions: Inactivation of microorganisms in sewage effluent using the pilot plasma process was done. The performance of oxygen plasma process was superior to air plasma process. The power consumption of oxygen plasma process was less than that of air plasma process. However, it was considered that the final evaluation of air and oxygen plasma must be evaluated by considering low power consumption, high process performance, operating costs and facility expenses of an oxygen generator.

• 화약ㆍ발파
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• 제16권3호
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• pp.35-48
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• 1998

지난 3월 27일 코롱건설(주) 회의실에서 그간 (주)수상중공업에서 새로 개발한 Plasma파암장비에 대한 수차에 걸친 실험결과를 가지고 개발자인 제환영 박사, 개발 DATA에 대한 분석을 맡았던 한국자원연구소 유창하 박사, 실험시 Plasma 파암의 파종별 식별 및 유사 기종과의 비교 등을 검토한 바 있는 허전박사, 그리고 Plasma 암비를 가지고 처음부터 끝까지 현장실험을 맏아 본 박철화 화학비관이기사(전문건설(주) 차장) 등 토론회에서 발표한 내용이다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 추계학술대회 논문집 학회본부 C
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• pp.950-952
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• 1998

DC Arc Plasma was applied in order to convert of hydrocabon fuels (Methane) to hydrogen, which has higher available energy. Plasma can generate very high temperatures with a high degree of control, using electricity. Plasma can be used to produce the pure hydrogen fuel, and has rapid response time. In addition, the use of plasma could provide for a greater variety of operating modes including the posibility of virtual elimination of $CO_2$ production by pyrolytic operation and could obtain byproduct (Carbonblack).

• Fibers and Polymers
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• 제2권1호
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• pp.152-156
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• 2001

Three different silicone polymer systems, such as aminofunctional, epoxyfunctional, and hydrophilic epoxyfunctional silicone polymers, were applied onto plasma pretreated wool fabric to improve the dimensional properties. The results showed that the plasma pretreatment modified the cuticle surface of the wool fiber and increased the reactivity of wool fabric toward silicone polymers. Felting shrinkage of plasma and silicone treated wool fabric was decreased with different level depending on the applied polymer system. Fabric tear strength and hand were adversely affected by plasma treatment, but these properties were favorably restored on polymer application. Therefore, it has been concluded that the combination of plasma and silicone treatments can achieve the improved dimensional stability, and better performance properties of wool fabric. The surface smoothness appearances of treated fabrics were measured using a new evaluation system, which showed good correspondence with the results of KES-FB4 surface tester.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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• pp.846-848
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• 2002

A large-area (830mm ${\times}$ 1,020mm) inductively coupled plasma source with a six internal straight antennas was developed for large area FPD etch process applications and the effects of magnetic fields employing permanent magnets on the plasma characteristics were investigated. By employing the magnetic fields perpendicular to the six straight antenna currents using permanent magnets, improved plasma characteristics such as increase of the ion density and decrease of both electron temperature and plasma potential could be achieved in addition to the stability of the plasma possibly due to the reduction of the electron loss. However, the application of the magnetic field decreased the plasma uniformity slightly even though the uniformity within 10% could be maintained in the 800mm processing area.

• Transactions on Electrical and Electronic Materials
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• 제2권3호
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• pp.7-11
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• 2001

Utility boiler operators seeking to gain the greatest economic advantage from their units are faced with three challenges, namely the obligatory light-up fuel costs, the additional expense of supplementary fuel firing should they wish to use a cheaper fuel that may be beyond the original burner manufacturer’s stability and combustion performance assurances and the immediate environmental impact of both. The novel use of plasma arc technology can provide a solution to these challenges. This paper introduces the work being undertaken through a joint collaboration between the EU, Kazahkstan and Russia in order to develop a tried and tested engineering methodology and a mathematical based application and sensitivity analysis approach for the design and optimisation stage of these plasma devices that, as a consequence, their assist in their universal introduction.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제53권2호
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• pp.62-66
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• 2004

This paper investigated the characteristics of a newly developed high density hollow cathode plasma (HCP) system and its application for the etching of silicon wafers. We used SF$_{6}$ and $O_2$ gases in the HCP dry etch process. Silicon etch rate of $0.5\mu\textrm{m}$/min was achieved with $SF_6$$O_2$plasma conditions having a total gas pressure of 50mTorr, and RF power of 100 W. This paper presents surface etching characteristics on a crystalline silicon wafer and large area cast type multicrystlline silicon wafer. The results of this experiment can be used for various display systems such as thin film growth and etching for TFT-LCDs, emitter tip formations for FEDs, and bright plasma discharge for PDP applications.s.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제51권9호
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• pp.413-416
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• 2002

It was reported that low temperature plasma developed by our group was apparently homogeneous and stable at atmospheric pressure, and was generated if the alumina was used as a dielectric insulating material and Ar gas as a plasma gas. This is a structure in which the dielectric materials are covered and arranged in parallel in the one side of electrode. In this experiment, we discovered that dielectric material was important to generate normal electric discharge. To examine the effect of dielectric material on the electric discharge characteristic, the voltage and current of the plasma was measured and the electrical effect of dielectric material was examined. Also, it was applied to an etching of tin oxide films.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.360-363
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• 2003

In this paper, we investigated SiNx film as a buffer layer of TFT-FRAM. Buffer layers were prepared by two step process of a $N_2$ plasma treatment and subsequent $SiN_x$ deposition. By employing $N_2$ plasma treatment, interface traps such as mobile charges and injected charges were removed, hysteresis of current-voltage curve disappeared. After $N_2$ plasma treatment, a leakage current was decreased about 2 orders. From these results, it is possible to perform the plasma treating process to make a good quality buffer layer of MFIS-FET or capacitor as an application of non-volatile memory.