• Title/Summary/Keyword: physical and strength properties

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Soil Analysis on Prediction of Consolidation Settlement in Marine Clays (항만점토(港灣粘土)의 압밀심하량(壓密沈下量) 예측(預測)을 위(爲)한 토질분석(土質分析))

  • Kwon, Moo Nam;Son, Kwang Sik;Lee, Sang Ho
    • Current Research on Agriculture and Life Sciences
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    • v.4
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    • pp.87-94
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    • 1986
  • This study was performed in order to contemplate their correlations between physical and mechanical properties of the marine clays which were collected from main harbors in Korea. The results obtained are as follows: 1. Most of the soils in experimental districts consist of CH. CL. and ML. and they are considered to be still proceeding. 2. The equations of the relationship between compression index and liquid limit are as, follows: CH : $C_c=0.0137$ (LL-22.60) CL : $C_c=0.0123$ (LL-14.64) 3. The relationship between compression index and initial void ratio appears that the higher the plasticity, the easier the slope of the regression line. The equations are as follows : CH : $C_c=0.431$ ($e_o-0.504$) CH : $C_c=0.471$ ($e_o-0.235$) ML : $C_c=0.641$ ($e_o-0.393$) 4. The equations of the relationship between compression index and natural water content are as follows: CH : $C_c=0.0133$ ($W_n-28.27$) CL : $C_c=0.0225$ ($W_n-23.56$) ML : $C_c=0.0106$ ($W_n-16.42$) 5. The relationship between initial void ratio and natural water content, and compression index is highly positive correlation and the equations are as follows : CH : $C_c=0.301$ ($e_o+0.017W_n-1.05$) CL : $C_c=0.141$ ($e_o+0.0567W_n-1.054$) ML : $C_c=0.421$ ($e_o+0.0214W_n-1.121$) 6. The equations of the relationship between initial void ratio and liquid limit, and compression index are as follows : CH : $C_c=0.36$ ($e_o+0.08LL-0.819$) CL : $C_c=0.269$ ($e_o+0.026LL-0.929$) 7. The cohesion of marine clays is no concerned with the increment of depth. The equations of relationship between cohesion and unconfined compression strength are as follows. CH : qu=1.896C+0.0107 CL : qu=1.849C+0.04.

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Fabrication and Characterization of Transparent Conductive Film based on Bacterial Cellulose (Bacterial cellulose를 기반으로 하는 투명전도성막의 제조 및 특성평가)

  • Yim, Eun-Chae;Kim, Seong-Jun;Kee, Chang-Doo
    • Korean Chemical Engineering Research
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    • v.51 no.6
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    • pp.766-773
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    • 2013
  • A transparent film was fabricated based on bacterial cellulose (BC), BC has excellent physical strength and stability at high temperature and it is an environmental friendly flexible material. In order to improve the conductivity, silver nanowire (AgNW) and/or graphene were introduced to the BC membrane. The aspect ratio of the AgNW synthesized in this study was 214, with a length of $15{\mu}m$ and width of 70 nm. The higher aspect ratio improved the conductivity by reducing the contact resistance. The thermal and electrical properties of 7 types of films prepared were investigated. Each film was fabricated with rectangular shape ($2mm{\times}2mm{\times}50{\mu}m$). The films were scored with a net shape by a knife, and filled with AgNW and graphene to bestow conductivity. The film filled with AgNW showed favorable electrical characteristics with a thickness of $350{\mu}m$, electron concentration of $1.53{\times}10^{19}$, electron mobility of $6.63{\times}10^5$, and resistivity of 0.28. The film filled with graphene had a thickness of $360{\mu}m$, electron concentration of $7.74{\times}10^{17}$, electron mobility of 0.17, and resistivity of 4.78. The transmittances at 550 nm were 98.1% and 80.9%, respectively. All the films were able to light LEDs bulbs although their brightness differed. A thermal stability test of the BC and PET films at $150{\pm}5^{\circ}C$ showed that the BC film was more stable, whereas the PET film was quickly banded. From these results, it was confirmed that there it is possible to fabricate new transparent conductivity films based on BC.

Study on Ti-doped LiNi0.6Co0.2Mn0.2O2 Cathode Materials for High Stability Lithium Ion Batteries (고안정성 리튬이온전지 양극활물질용 Ti 치환형 LiNi0.6Co0.2Mn0.2O2 연구)

  • Jeon, Young Hee;Lim, Soo A
    • Journal of the Korean Electrochemical Society
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    • v.24 no.4
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    • pp.120-132
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    • 2021
  • Although the development of high-Nickel is being actively carried out to solve the capacity limitation and the high price of raw cobalt due to the limitation of high voltage use of the existing LiCoO2, the deterioration of the battery characteristics due to the decrease in structural stability and increase of the Ni content. It is an important cause of delaying commercialization. Therefore, in order to increase the high stability of the Ni-rich ternary cathod material LiNi0.6Co0.2Mn0.2O2, precursor Ni0.6Co0.2Mn0.2-x(OH)2/xTiO2 was prepared using a nanosized TiO2 suspension type source for uniform Ti substitution in the precursor. It was mixed with Li2CO3, and after heating, the cathode active material LiNi0.6Co0.2Mn0.2-xTixO2 was synthesized, and the physical properties according to the Ti content were compared. Through FE-SEM and EDS mapping analysis, it was confirmed that a positive electrode active material having a uniform particle size was prepared through Ti-substituted spherical precursor and Particle Size Analyzer and internal density and strength were increased, XRD structure analysis and ICP-MS quantitative analysis confirmed that the capacity was effectively maintained even when the Ti-substituted positive electrode active material was manufactured and charging and discharging were continued at high temperature and high voltage.

Effects of Fire Retardant Treatment on Mechanical Properties and Fire Retardancy of Particleboard and Complyboard (내화처리(耐火處理)가 파아티클보오드와 콤플라이보오드의 기계적성질(機械的性質) 및 내화도(耐火度)에 미치는 영향(影響))

  • Kwon, Jin-Heon;Lee, Phll-Woo
    • Journal of the Korean Wood Science and Technology
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    • v.13 no.4
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    • pp.3-57
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    • 1985
  • This research was conducted to examine the feasibility of developing fire retardant particleboard and complyboard. Particleboard were manufactured using meranti particle(Shorea spp.)made with Pallmann chipper, and complyboard meranti particle and apitong veneer (Dipterocarpus spp.). Particles were passed through 4mm (6 mesh) and retained on 1mm (25 mesh). Urea formaldehyde resin was added 10 percent on ovendry weight of particle. Face veneer for complyboard was 0.9, 1.6 and 2.3mm in thickness and spread with 36 g/(30.48 cm)$^2$ glue on one side. Veneers were soaked with 10 percent solution of five fire retardant chemicals (diammonium phosphate, ammonium sulfate, monoammonium phosphate, Pyresote and Minalith), and particles with 5, 10, 15 and 20 percent solution of five chemicals. Particleboard and complyboard were evaluated on physical and mechanical properties, and fire retardancy. The results obtained were summarized as follows. 1. Among five fire retardant chemicals treated to particleboard and complyboard, the retention of ammonium sulfate in 5 percent solution showed the lowest as 1.39 kg/(30.48 cm)$^3$ exceeding the minimum retention of 1.125 kg/(30.48 cm)$^3$ recommended by Forest Products Laboratory and Koch. 2. Particleboard and complyboard treated with diammonium phosphate showed higher modulus of rupture (MOR), modulus of elasticity (MOE), internal bond strength and screw holding power than those with the other chemicals. 3. MOR and MOE of complyboard treated with fire retardant chemicals were greater than those of fire retardant particleboard. 4. Thickness swelling of fire retardant complyboard was lower than that of fire retardant particleboard. 5. The moisture content of the boards treated with Pyresote and Minalith increased and with monoammonium phosphate reduced. 6. Fire retardant particleboard showed no ignition, and fire retardant complyboard started ignition, but time required to ignite was prolonged comparing the controlboard. Complyboard with only shell veneer treated showed ignition and lingering flame, but lingering flame time was shorter than controlboard. Complyboard with treated both core and veneer showed ignition but not lingering flame. 7. Flame length, carbonized area and weight loss were smaller than controlboard but had no significant difference among chemicals treated. 8. Temperature of unexposed surface of fire retardant particleboard was lowered with the increasing concentration of five chemicals. 9. Temperature of unexposed surface of fire retardant particleboard was lowered with the highest in Pyresote and the lowest in Minalith. 10. Temperature of unexposed surface of fire retardant complyboard was lower than that of controlboard.

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A study of compaction ratio and permeability of soil with different water content (축제용흙의 함수비 변화에 의한 다짐율 및 수용계수 변화에 관한 연구)

  • 윤충섭
    • Magazine of the Korean Society of Agricultural Engineers
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    • v.13 no.4
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    • pp.2456-2470
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    • 1971
  • Compaction of soil is very important for construction of soil structures such as highway fills, embankment of reservoir and seadike. With increasing compaction effort, the strength of soil, interor friction and Cohesion increas greatly while the reduction of permerbilityis evident. Factors which may influence compaction effort are moisture content, grain size, grain distribution and other physical properties as well as the variable method of compaction. The moisture content among these parameter is the most important thing. For making the maximum density to a given soil, the comparable optimum water content is required. If there is a slight change in water content when compared with optimum water content, the compaction ratio will decrease and the corresponding mechanical properties will change evidently. The results in this study of soil compaction with different water content are summarized as follows. 1) The maximum dry density increased and corresponding optimum moisture content decreased with increasing of coarse grain size and the compaction curve is steeper than increasing of fine grain size. 2) The maximum dry density is decreased with increasing of the optimum water content and a relationship both parameter becomes rdam-max=2.232-0.02785 $W_0$ But this relstionship will be change to $r_d=ae^{-bw}$ when comparable water content changes. 3) In case of most soils, a dry condition is better than wet condition to give a compactive effort, but the latter condition is only preferable when the liquid limit of soil exceeds 50 percent. 4) The compaction ratio of cohesive soil is greeter than cohesionless soil even the amount of coarse grain sizes are same. 5) The relationship between the maximum dry density and porosity is as rdmax=2,186-0.872e, but it changes to $r_d=ae^{be}$ when water content vary from optimum water content. 6) The void ratio is increased with increasing of optimum water content as n=15.85+1.075 w, but therelation becames $n=ae^{bw}$ if there is a variation in water content. 7) The increament of permeabilty is high when the soil is a high plasticity or coarse. 8) The coefficient of permeability of soil compacted in wet condition is lower than the soil compacted in dry condition. 9) Cohesive soil has higher permeability than cohesionless soil even the amount of coarse particles are same. 10) In generall, the soil which has high optimum water content has lower coefficient of permeability than low optimum water content. 11) The coefficient of permeability has a certain relations with density, gradation and void ratio and it increase with increasing of saturation degree.

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A Study on Physical and Mechanical Properties of Sawdustboards combined with Polypropylene Chip and Oriented Thread (폴리프로필렌사(絲)칩과 배향사(配向絲)를 결체(結締)한 톱밥보드의 물리적(物理的) 및 기계적(機械的) 성질(性質)에 관(關)한 연구(硏究))

  • Suh, Jin-Suk;Lee, Phil-Woo
    • Journal of the Korean Wood Science and Technology
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    • v.16 no.2
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    • pp.1-41
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    • 1988
  • For the purpose of utilizing the sawdust having poor combining properties as board raw material and resulting in dimensional instability of board, polypropylene chip (abbreviated below as PP chip) or oriented PP thread was combined with sawdust particle from white meranti(Shorea sp.). The PP chip was prepared from PP thread in length of 0.25, 0.5, 1.0 and 1.5 cm for conventional blending application. Thereafter, the PP chip cut as above was combined with the sawdust particle by 3, 6, 9, 12 and 15% on the weight basis of board. Oriented PP threads were aligned with spacing of 0.5, 1.0 and 1.5cm along transverse direction of board. The physical and mechanical properties on one, two and three layer boards manufactured with the above combining conditions were investigated. The conclusions obtained at this study were summarized as follows: 1. In thickness swelling, all one layer boards combined with PP chips showed lower values than control sawdustboard, and gradually clear decreasing tendendy with the increase of PP chip composition. Two layer board showed higher swelling value than one layer board, but the majority of boards lower values than control sawdustboard. All three layer boards showed lower swelling values than control sawdustboard. 2. In the PP chip and oriented thread combining board, the swelling values of boards combining 0.5cm spacing oriented thread with 1.0 or 1.5cm long PP chip in 12 and 15% by board weight were much lower than the lowest of one or three layer. 3. In specific gravity of 0.51, modulus of rupture of one layer board combined with 3% PP chip showed higher value than control sawdustboard. However, moduli of rupture of the boards with every PP chip composition did not exceed 80kgf/cm2, the low limit value of type 100 board, Korean Industrial Standard KS F 3104 Particleboards. Moduli of rupture of 6%, 1.5cm-long and 3% PP chip combined boards in specific gravity of 0.63 as well as PP chip combined board in specific gravity of 0.72 exceeded 80kgf/$cm^2$ on KS F 3104. Two layer boards combined with every PI' chip composition showed lower values than control sawdustboard and one layer board. Three layer boards combined with.1.5cm long PP chip in 3, 6 and 9% combination level showed higher values than control sawdustboard, and exceeded 80kgf/$cm^2$ on KS F 3104. 4. In modulus of rupture of PP thread oriented sawdustboard, 0.5cm spacing oriented board showed the highest value, and 1.0 and 1.5cm spacing oriented boards lower values than the 0.5cm. However, all PP thread oriented sawdustboards showed higher values than control saw-dustboard. 5. Moduli of rupture in the majority of PP chip and oriented thread combining boards were higher than 80kgf/$cm^2$ on KS F 3104. Moduli of rupture in the boards combining longer PP chip with narrower 0.5cm spacing oriented thread showed high values. In accordance with the spacing increase of oriented thread, moduli of rupture in the PP chip and oriented thread combining boards showed increasing tendency compared with oriented sawdustboard. 6. Moduli of elasticity in one, two and three layer boards were lower than those of control sawdustboard, however, moduli of elasticity of oriented sawdustboards with 0.5, 1.0 and 1.5cm spacing increased 20, 18 and 10% compared with control sawdustboard, respectively. 7. Moduli of elasticity in the majority of PP chip and oriented thread combining boards in 0.5, 1.0 and 1.5cm oriented spacing showed much higher values than control sawdustboard. On the whole, moduli of elasticity in the oriented boards combined with 9% or less combination level and 0.5cm or more length of PP chip showed higher values than oriented sawdustboard. The increasing effect on modulus of elasticity was shown by the PP chip composition in oriented board with narrow spacing. 8. Internal bond strengths of all one layer PP chip combined boards showed lower values than control sawdust board, however, the PP chip combined boards in specific gravity of 0.63 and 0.72 exceeded 1.5kgf/$cm^2$, the low limit value of type 100 board and 3kgf/$cm^2$, type 200 board on KS F 3104, respectively. And also most of all two, three layer-and oriented boards exceeded 3kgf/$cm^2$ on KS F. 9. In general, screw holding strength of one layer board combined with PP chip showed lower value than control sawdustboard, however, that of two or three layer board combined with PP chip did no decreased tendency, and even screw holding strength with the increase of PP chip composition. In the PP chip and oriented PP thread combining boards, most of the boards showed higher values than control sawdustboard in 9% or less PP chip composition.

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