• Journal of Distribution Science
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• v.9 no.4
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• pp.83-91
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• 2011

In addition to the globalization of the distribution industry and intensified competition, the importance of Private Brands has been emphasized, and thus, many studies that clarify the various preceding factors that affect PB purchase intent are being conducted. Following this trend, the purpose of this study is the following. First, the effect of distributor's corporate image on consumer behavior was verified. Second, the perceived quality difference on PB products according to consumers' job was verified. Third, satisfaction difference for PB products according to consumers' job was examined. Research results were shown as the following. First, factorial analysis, conducted to verify distributor's corporate image, gave out the result of ethicality, reliability, stability factors. Among those factors, ethicality and stability were shown to have an effect on brand attitude. However, reliability was not shown to influence PB brand attitude. Second, through the analysis to see the effect of distributor's corporate image on PB product attitude, it was verified that stability has an effect on PB product attitude but ethicality and reliability do not. Third, the analysis to verify the effect of distributor's corporate image on PB product purchase intent showed that ethicality has an effect on purchase intent, but reliability and stability do not. Fourth, housewives, the most active users of distributors, were shown the highest in the research on whether there is perceived quality difference according to consumers' job. Following the group were college students, and then office workers. Fifth, research on the level of satisfaction according to consumers' job showed that there was not a significant difference. The limitations and suggestions of this research were as the following. First, this study could go over each corporate image according to distributor type and characteristics. Due to the vast development of distribution industry, the companies can be classified according to the various types. Therefore, we propose the corporate image of each distributors to be checked, and furthermore, to verify which image of the different types of distributors has positive influence on consumer attitude. Second, PB products should have various perceived quality. However, in this research, it has not been verified which specific factors among the various perceived quality of PB products has a more meaningful influence on consumer attitude. Therefore, we also would like to propose a need for closer research on the specific factors and on which factor has a more positive influence on consumer attitude.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.13-19
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• 2018

The soldering property of Pb-containing solder(Sn-Pb) and Pb-free solders(Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In) for solar combiner box module was compared. The solar combiner box module was composed of voltage and current detecting modules, diode modules, and other modules. In this study, solder paste printability, printing shape inspection, solder joint property, X-ray inspection, and shear force measurements were conducted. For optimization of Pb-free soldering process, step 1 and 2 were divided. In the step 1 process, the printability of Pb-containing and Pb-free solder alloys were estimated by using printing inspector. Then, the relationship between void percentages and shear force has been estimated. Overall, the property of Pb-containing solder was better than two Pb-free solders. In the step 2 process, the property of reflow soldering for the Pb-free solders was evaluated with different reflow peak temperatures. As the peak temperature of the reflow process gradually increased, the void percentage decreased by 2 to 4%, but the shear force did not significantly depend on the reflow peak temperature by a deviation of about 0.5 kgf. Among different surface finishes on PCB, ENIG surface finish was better than OSP and Pb-free solder surface finishes in terms of shear force. In the thermal shock reliability test of the solar combiner box module with a Pb-free solder and OSP surface finish, the change rate of electrical property of the module was almost unchanged within a 0.3% range and the module had a relatively good electrical property after 500 thermal shock cycles.

• Fisheries and Aquatic Sciences
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• v.22 no.1
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• pp.2.1-2.9
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• 2019

In the present study, the protective effects of Hizikia fusiforme and Chlorella sp. extracts on lead acetate-induced hepatotoxicity were investigated. Hepatic damage was induced in rats by intraperitoneal (i.p.) injection of lead acetate and the protective effects of H. fusiforme (HZK) and Chlorella sp. (CHL) extracts on lead acetate-induced hepatic damage in rat liver were examined. The results revealed significantly increased glutamic oxaloacetate and glutamic pyruvic transaminase levels in the group treated with lead acetate only (Pb group); oral administration of HZK and CHL extracts tended to decrease the enzyme levels similar to those observed in the control group. Regarding antioxidant enzymes, superoxide dismutase activity was increased in the Pb group and decreased in a concentration-dependent manner in the HZK- and CHL-treated groups. Glutathione levels were increased in a concentration-dependent manner in the HZK- and CHL-treated groups. There was no significant difference in catalase activity. Western blot analysis showed inflammation-related protein expression in mitogen-activated protein kinase and Nrf2 pathways was affected in the HZK- and CHL-treated groups. Therefore, HZK and CHL extracts exerted antioxidant and anti-inflammatory effects against lead acetate-induced hepatotoxicity. Development of functional health foods containing HZK and CHL extracts, which have hepatoprotective effects against inhaled lead acetate, should be considered.

• Korean Journal of Animal Reproduction
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• v.25 no.1
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• pp.35-42
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• 2001

This study was performed to elucidate the patho-physiology of copper-poisoned rats after consecutive oral administrations of the copper sulfate. The changes in feed and water intake, gains of body weight, blood pictures and mineral compositions of several organs were observed to measure the effects of copper poisoning. 1. Compared with control group, every experimental group of which 1,000, 2,000, or 4,000 ppm/kg of copper sulfate was administered displayed a gradual decrease in feed intake in dose-dependent manners. 2. After 1,000, 2,000 or 4,000 ppm/kg of copper sulfate administration, water intake seemed to decrease in every experimental group in dose-dependent manners, but there was little statistical significance. 3. After 1,000, 2,000 or 4,000 ppm/kg of copper sulfate administration, body weight decreased in every experimental group in dose-dependent manners. 4. After 1000, 2,000 or 4,000 ppm/kg of copper sulfate administration, the PLT values and numbers of RBC and WBC significantly increased after copper sulfate administration, but the values of Hb and PCV were lower than those of control group's. 5. After 2,000 or 4,000 ppm/kg of copper sulfate administration, the levels of Cu, Mn, Fe, Pb and Zn in the liver were lowered, but the levels of Mn, Fe, Pb and Zn in the kidneys increased except Cu levels.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2005.09a
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• pp.145-156
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• 2005

• Journal of the korean academy of Pediatric Dentistry
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• v.29 no.3
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• pp.389-396
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• 2002

The purpose of this study was to compare the microtensile bonding strength of chemomechanically excavated dentin($Carisolv^{TM}$) to conventional caries removal(bur). The following adhesive systems were used; AB: All-Bond 2(3M, USA), PB: Prime & Bond 2.1(Dentsply, DE), AQ: AQ Bond(sun medical, Japan). 42 human molars with occlusal caries were assigned to 6 groups. Sequential caries removal was controlled with laser fluorescence. Each group was devided as follows; group A, B, C were $Carisolv^{TM}$ applied, group D,E,F were bur used. In group A and D, AB was used as a dentin adhesive. group B,E and group C,F was AQ and AQ was used each. The cavity was filled with composite resin(Z-100). The specimens were sectioned vertically into multiple serial 0.7 mm thick slabs. And then those slabs were sectioned into rectangular parts under 0.7 mm width. Finally 0.7-1.0 mm a right hexahedron shape stick become. Microtensile bonding test was carried out with testing apparatus at cross-head speed of $0.5\;mm/min^{-1}$ and fractured surfaces were observed with scanning electron microscope(JSM-6400, Jeol, Japan). The obtained results were summarized as follows ; 1. In the group of caries removal with $Carisolv^{TM}$, micro-tensile bonding strength decreased to $75.8{\sim}80$ percent of bur used group. 2. In the group of caries removal with $Carisolv^{TM}$, decreased degree of micro-tensile bonding strength is not so different in 3 kinds of dentin adhesives(p<0.05). 3. In the group of caries removal with $Carisolv^{TM}$, microtensile bonding strength of AB, PB, AQ was 32.6MPa(2.4), 30.1Mpa (1.8), 21.2Mpa(1.9). 4. In the group of caries removal with Bur and $Carisolv^{TM}$, microtensile bonding strength of AQ was significantly lower than that of AB and PB(p<0.01).

• Journal of the Korean Society for Precision Engineering
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• v.21 no.2
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• pp.138-144
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• 2004

The initiation and the propagation of solder joint crack depend on its environmental conditions, such as high temperature creep and thermal fatigue. Creep is known to be the most important factor for the mechanical failure of solder joints in micro-electronic components and micro-systems. This is mainly caused by the different thermal expansion coefficients of the materials used in the micro-electronic packages. To determine the reliability of solder joints and consequently the electronic components, the characterization of the creep behavior of this group of materials is crucial. This paper is to apply the theory of creep into solder joints and to provide related technical information needed for evaluation of reliability of solder joint to failure. 63Sn-37Pb solder was used in this study. This paper experimentally shows a way to enhance the reliability of solder joints.

• Proceedings of the Korean Ceranic Society Conference
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• 2002.10a
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• pp.32.2-32
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• 2002

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.334-337
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• 2002

In this study, the microstructure, dielectric and piezoelectric properties of $0.15Pb(Ni_{1/3}Nb_{2/3})O_3-0.85(PbZr_{0.5}Ti_{0.5})O_3$(0.15PNN-0.85PZT) ceramics having compositions near the morphotropic phase boundary(MPB) was investigated with respect to the variation of $Y_2O_3$ and $Ga_2O_3$ addition amount. The dielectric properties increased and piezoelectric properties decreased with increasing the amount of $Ga_2O_3$. The solubility limit of $Y_2O_3$ is 0.5mol% in this system. The electro-mechanical coupling factor$(K_p)$ and dielectric constant(${\varepsilon}_r$) were 58.6% and 1755 when the amount of $Y_2O_3$ are 0.5mol%.

• The Journal of the Petrological Society of Korea
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• v.15 no.3 s.45
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• pp.119-127
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• 2006

Detrital zircons in iron-bearing quartzite of the Seosan Croup from southeastern part of the Cyeonggi Hassif were analysed for SHRIHP U-Pb ages. Among 42 analyses, 38 data yield concordant ages (less tan 10 % discordancy), and they concentrated at 1781~1898 Ma (n=19), $1781{\sim}1898\;Ma(n=19),\;1935{\sim}1941\;Ma(n=4),\;1996\;Ma,\;2120\;Ma\;2403{\sim}2459\;Ma(n=5)$, 2661 Ma and 3198 Ma. The data indicate that sedimentation of iron-bearing quartzite should be after ca 1.78 Ga (the youngest detrital zircon age), and argue against some of conventional idea that iron-bearing quartzite of the Seosan Group might be correlated with the Archean iron-bearing quartzite in the North China Craton.