• Proceedings of the KSR Conference
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• 2007.11a
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• pp.1560-1565
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• 2007

A surveillance system is used many industrial places, and public places to monitor the present situation. Most of the existing surveillance system is composed of the monitors and a lot of cameras that are installed each place to be monitored. The system is usually using the CCTV, closed circuit television, system that is a passive surveillance system. Urban transit operation corporations use the passive surveillance system to monitor the situation of the passengers, and the status of the important facilities. However the officers or operators cannot monitor all of the situation or status constantly, and cannot respond to emergency. In this paper, we propose a sensor network-based intelligent surveillance system to solve these problems. The proposed system is composed of a lot of intelligent sensors that can determine the present status and integrated processor units to detect more precisely events using the information from the sensors. The sensors and the integrated processor are connected by communication network. The proposed system can be installed and used without a lot of change of the existing facilities such as the enormous communication bandwidth increase.

• ETRI Journal
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• v.35 no.2
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• pp.245-252
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• 2013

In this work, we study the physical layer solutions for 10-gigabit-capable passive optical networks (PONs), particularly for an optical link terminal (OLT) including a 10-Gbit/s electroabsorption modulated laser (EML) and a 2.5-Gbit/s burst mode receiver (BM-Rx) in a novel bidirectional optical subassembly (BOSA). As unique features, a bidirectional mini-flat package and a 9-pin TO package are developed for a 10-gigabit-capable PON OLT BOSA composed of a 1,577-nm EML and a 1,270-nm avalanche photodiode BM-Rx, including a single-chip burst mode integrated circuit that is integrated with a transimpedance and limiting amplifier. In the developed prototype, the 10-Gbit/s transmitter and 2.5-Gbit/s receiver characteristics are evaluated and compared with the physical media dependent (PMD) specifications in ITU-T G.987.2 for XG-PON1. By conducting the 10-Gbit/s downstream and 2.5-Gbit/s upstream transmission experiments, we verify that the developed 10-gigabitcapable PON PMD prototype can operate for extended network coverage of up to a 40-km fiber reach.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.313-313
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• 2008

Aerosol Deposition(AD) method is based on the impact consolidation phenomenon of ceramic fine particles at room temperature. AD is promising technology for the room temperature deposition of the dielectrics thin films with high quality. Embedding of passive components such as capacitors into printed circuit board is becoming an important strategy for electronics miniaturization and device reliability, manufacturing cost reduction. So, passive integration using aerosol deposition. In this study, we examine the effects of the characteristics of raw powder on the thickness, roughness, electrical properties of $BaTiO_3$ thin films. Thin films were deposited on the copper foil and copper plate. Electrical and material properties was investigated as a change of annealing temperature. We final aim the effects of before and after of laminated on the electrical properties and suit of embedded capacitor.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.45 no.12
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• pp.128-132
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• 2008

This paper presents a filter design technique with the embedded passive elements using the low temperature co-fired ceramic (LTCC) process. For the high performance and size reduction, the parasitic elements of the proposed multi-layer structure are positively considered by using the proposed circuit transformation procedures. As a result, the compact low ass filter (LPF) not only has at least 50% more compact thickness than other reported compact structures, but also provides ideal LPF response between 0.5GHz and 5GHz.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.25 no.9B
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• pp.1635-1640
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• 2000

In this paper, a 18 GHz oscillator is designed with the push-push method an fabricated by semi-MMIC process, in which the second harmonic is the main output signal with the suppressed fundamental mode. In semi-MMIC process, passive components with microstrip transmission line are implemented using MMIC process on semi-insulating GaAs substrate. Then, chip types of P-HEMT, resistors, and capacitors are connected through Au wire-bonding. Also, the ground plane is inserted around the circuit and connected each other with the back-side of substrate through Au wire-bonding instead of via-hole. The semi-MMIC push-push oscillator shows the output powder of -10.5 dBm, the fundamental frequency suppression of -17.3 dBc/Hz, and the phase noise of -97.9 dBc/Hz at the offset frequency of 100 kHz.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2023.05a
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• pp.281-282
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• 2023

The solid-state reference electrodes made of polyaniline-coated MnO₂ (SSRE-PAM) and their electrochemical characteristics were studied in simulated concrete pore solutions (SCPS) containing 0 and 3.5% NaCl. Saturated calomel electrodes (SCE) have been used to conduct electrochemical studies on the stability behavior of SSRE-PAM. Open circuit potential (OCP) and potentiodynamic polarization techniques were used to assess the corrosion performance of steel rebar exposed in SCPS with 0 and 3.5% NaCl using SSRE-PAM. The results demonstrate that the SSRE-PAM was capable of identifying steel rebar in a concrete environment that was either passive or active. Potentiodynamic polarization parameters such as E_corr and I_corr for steel rebar in SCPS containing 0 and 3.5%)NaCl are greater than that of the passive condition (0% NaCl). All the studies validate the importance of using SSRE-PAM for corrosion monitoring applications in concrete structures.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.6
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• pp.91-98
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• 2004

This paper proposes a PCB plane model for generic SPICE circuit simulators. The proposed model reflects two frequency-dependent losses, namely skin and dielectric losses. After power/ground plane pair is divided into arrays of unit-cells, each unit-cell is modeled using a transmission line and two loss models. The loss model is composed of a resistor for DC loss, series HL ladder circuit for skin loss and series RC ladder circuit for dielectric loss. To verify the validity of the proposed model, it is compared with SPICE ac analysis using frequency-dependent resistors. Also, we show that the estimation results using the proposed model have a good correlation with that of VNA measurement for the typical PCB stack-up structure of general desktop PCs. With the proposed model, not only ac analysis but also transient analysis can be easily done for circuits including various non-linear/linear devices since the model consists of passive elements onl.

• Journal of Advanced Navigation Technology
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• v.18 no.4
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• pp.359-363
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• 2014

This paper presents the design and performance of an unequal divider with physical separation and electrical isolation. This divider has a series $18{\Omega}$ resistor and 0.7 pF capacitor circuit between two quarter-wave transmission lines at half phase angle from input terminal. This design method was improved a physical isolation between output ports and easy connected other circuit because of unnecessary of extra transmission line. To show the validity of the unequal divider with complex isolation components, a 4:1 ratio unequal divider was designed and measured at center frequency of 2 GHz. The measured divider performances have the return loss of 17 dB, insertion loss of 1.5 dB and 7.7 dB, and isolation of 18 dB. Its performance is in good agreement with the simulated results.

• Journal of Power Electronics
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• v.15 no.2
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• pp.555-566
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• 2015

A TRIAC dimming LED driver that can control the brightness of LED arrays for a wide range of source voltage variations is proposed in this paper. Unlike conventional PWM LED drivers, the proposed LED driver adopts a TRIAC switch, which inherently guarantees zero current switching and has been proven to be quite reliable over its long lifetime. Unlike previous TRIAC type LED drivers, the proposed LED driver is composed of an LC input filter and a variable switched capacitance, which is modulated by the TRIAC turn-on timing. Thus, the LED power regulation and dimming control, which are done by a volume resistor in the same way as the conventional TRIAC dimmers, can be simultaneously performed by the TRIAC control circuit. Because the proposed LED driver has high efficiency and a long lifetime with a high power factor (PF) and low total harmonic distortion (THD) characteristics, it is quite adequate for industrial lighting applications such as streets, factories, parking garages, and emergency stairs. A simple step-down capacitive power supply circuit composed of passive components only is also proposed, which is quite useful for providing DC power from an AC source without a bulky and heavy transformer. A prototype 60 W LED driver was implemented by the proposed design procedure and verified by simulation and experimental results, where the efficiency, PF, and THD are 92%, 0.94, and 6.3%, respectively. The LED power variation is well mitigated to below ${\pm}2%$ for 190 V < $V_s$ < 250 V by using the proposed simple control circuit.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.209-209
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• 2007

Passive Device는 RF Circuit을 제작할 때 많은 면적을 차지하고 있으며 이를 감소시키기 위해 여러 연구가 진행되고 있다. 최근 SoP-L 공정을 이용한 많은 연구가 진행되고 있는데 PCB 제작에 이용되는 일반적인 재료와 공정을 그대로 이용함으로써 개발 비용과 시간 면에서 많은 장점을 가지기 때문이다. SoP-L의 또 하나 장점은 다층구조를 만들기가 용이하다는 점이다. 각 층 간에는 Via를 사용하여 연결하게 되는데, RF Circuit은 회로의 구조와 물성에 따라 특성이 결정되며, 그만큼 Via를 썼을 때 그 영향을 생각해야 한다. 본 연구에서는 multi-layer LCP substrate에 다수의 Via를 chain 구조로 형성하여 전기적 특성을 확인하였다. Via가 70um 두께의 substrate를 관통하면서 상층과 하층의 Conductor을 연속적으로 연결하게 된다. 이 구조의 Resistance와 Insertion Loss를 측정하여, Via의 크기 별 수율과 평균적인 Resistance, RF 계측기로 재현성을 확인하였다. 이를 바탕으로 공정에서의 안정성을 확보하고 Via의 크기와 도금방법에 의한 RF Circuit에서의 영향을 파악하여, 앞으로의 RF Device 개발에 도움이 될 것으로 기대한다. 특히 유기물을 이용한 다층구조의 고주파 RF Circuit에 Via를 적용할 때의 영향을 설계에서부터 고려할 수 있는 자료가 될 것이다.