• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.7
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• pp.413-416
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• 2017

We investigated solution-processed indium-yttrium-oxide (IYO) TFTs using apoly (methyl methacrylate) (PMMA) passivation layer. The IYO semiconductor solution was prepared with 0.1 M indium nitrate hydrate and 0.1 M yttrium acetate dehydrate as precursor solutions. The solution-processed IYO TFTs showed good performance: field-effect mobility of $13.13cm^2/Vs$, a threshold voltage of 8.2 V, a subthreshold slope of 0.93 V/dec, and a current on-to-off ratio of $7.2{\times}10^6$. Moreover, the PMMA passivation layers used to protectthe IYO active layer of the TFTs, did so without deteriorating their performance under ambient conditions; their operational stability and electrical properties also improved by decreasing leakage current.

• Journal of the Korean Physical Society
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• v.73 no.11
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• pp.1675-1678
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• 2018

Methylammonium lead halide ($MAPbI_3$) perovskites are considered as promising materials owing to their excellent optical and electrical properties. However, perovskite materials suffer from degradation in air, which limits their practical applications. Here, we demonstrate successful passivation of the $MAPbI_3$ photodetectors through monochloro-para-xylylene (Parylene-C) deposition. The time-dependent photocurrent characteristics were systematically investigated, and we achieved significantly improved device performance and stability with Parylene-C passivation. Based on the excitation-power-dependent photoluminescence (PL) data, we confirmed that Parylene-C can reduce the carrier losses in $MAPbI_3$, leading to the enhancement of photocurrent and PL in $MAPbI_3$ photodetectors.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.11a
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• pp.468-472
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• 1997

The effect of the surface state on the quantum efficiency of underlying GaAs/AlGaAs multi-quantum well(MQW) structures consisting of three GaAs quantum wells with different thickness, is studied by low temperature photoluminescence(PL). The structure was grown by molecular beam epitaxy(MBE) on (100) GaAs substrate. The thickness of three GaAs quantum wells was 3, 6 and 9 nm, respectively. The MQWs were placed apart from 50 nm AlGaAs edge-barriers including two inner-barriers with 15 nm in thickness. The samples used in this study were prepared with different growth temperatures. Particularly, the hydrogen passivation effect to the 9 nm quantum well located at near surface appeared much stronger than any others. Transition energy and optical gain related to the hydrogen passivation effects on the multi-quantum well structure was calculated by transfer matrix method.

• Proceedings of the KIEE Conference
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• 1995.07c
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• pp.1239-1241
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• 1995

The different hydrogen passivation effects on low-temperature processed and high-temperature processed poly-Si thin film transistors have been investigated. The hydrogen passivation on low-temperature processed poly-Si TFT results in the increase of the field-effect mobility and the decrease or the threshold voltage, while the hydrogenation increases the field-effect mobility and decreases the leakage current in high-temperature processed poly-Si TFT. The effective trap state densities of low-temperature processed poly-Si TFT before and after 5 hours of hydrogenation are estimated at about $4.0{\times}10^{12}/cm^2$ and $1.5{\times}10^{12}/cm^2$, while those of high-temperature processed poly-Si TFT are about $1.5{\times}10^{12}/cm^2$ and $1.2{\times}10^{12}/cm^2$, respectively.

• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.172-175
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• 2009

n-type crystalline silicon wafers were passivated with intrinsic a-Si:H thin films on both sides using HWCVD. Minority carrier lifetime measurement was used to verify interface passivation properties between a-Si:H thin film and crystalline Si wafer. Thin film interface characteristics were investigated depending on $H_2/SiH_4$ ratio and hot wire deposition temperature. Vacuum annealing were processed after deposition a-Si:H thin films on both sides to investigate thermal effects from post process steps. We noticed the effect of interface passivation properties according to $H_2/SiH_4$ ratio and hot wire deposition temperature, and we had maximum point of minority carrier lifetime at H2/SiH4 10 ratio and $1600^{\circ}C$ wire temperature.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1443-1445
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• 1996

Hydrogen passivation enhances the electrical characteristics of poly-Si TFT(Thin Film Transistor). However, the weak Si-H bonds, generated during hydrogenation, degrade the stability of the device. So, we carried out the passivation treatment with $NH_3$ or $N_2$. We compared the effect of $NH_3$ or $N_2$ passivation treatments with that of hydrogenation in terms of stability. Through the $NH_3$ passivation treatment, we obtained the most improved subthreshold swing of 1.2V/decade from the initial subthreshold swing of 1.56V/decade. When electrical stress was given, the $NH_3$ passivated devices showed best electrical stability.

• Journal of the Korean institute of surface engineering
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• v.41 no.3
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• pp.102-108
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• 2008

In this paper, the LiF and polymer thin film as passivation layer have been evaporated on green OLED devices. HDPE, polyacenaphthylene, polytetrafluoroethylene, poly(2,6-dimethyl-1,4-pheneylene oxide), poly sulfone and poly(dimer-acid-co-alkyl poly-amine) have been used as polymer materials. The optical transmittance of evaporated polymer thin film was very good as an above 90% in visible range. The morphology of polymer thin film was measured by AFM. As a result of the measurement average roughness($R_a$) value of the polysulfone was very low as 2.2 nm. The green OLED devices with a structure of ITO/HIL/HTL/EML/Buffer/Al in series of various passivation films were fabricated and analyzed. It was observed that an OLED device with LiF as first passivation film has shown the good electrical and optical property, and all kind of polymer films did not influence on the I-V-L characteristics and the life time of OLED devices. Therefore, we found that polymer layer played a key role as a buffer layer between the inorganic passivation layers to relieve the stress of the inorganic layers.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.114-115
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• 2007

In this paper, it was demonstrated that organic thin-film transistors (OTFTs) were fabricated with the organic passivation layer by vapor deposition polymerization (VDP) processing, In order to form polymeric film as an passivation layer, VDP process was also introduced instead of spin-coating process, where polymeric film was co-deposited by high-vacuum thermal evaporation from 6FDA and ODA followed by curing, Field effect mobility, threshold voltage, and on-off current ratio with 450-nm-thick organic passivation layer were about $0.21\;cm^2/Vs$, IV, and $1\;{\times}\;10^5$, respectively.

• Journal of the Korean institute of surface engineering
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• v.45 no.1
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• pp.20-24
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• 2012

Multilayer passivation film on OLED with organic/inorganic hybrid structure as to diminish the thermal stress and expansion was researched to protect device from the direct damage of $O_2$ and $H_2O$ and improve life time characteristics. Red OLED doped with 1 vol.% Rubrene in $Alq_3$ was used as a basic device. The films consist of ITO(150 nm)/ELM200_HIL(50 nm)/ELM002_HTL(30 nm)/$Alq_3$: 1 vol.% Rubrene(30 nm)/$Alq_3$(30 nm) and LiF(0.7 nm)/Al(100 nm) which were formed in that order. Using LiF/$SiN_x$ as a buffer layer was determined because it significantly improved life time characteristics without suffering damage in the process of forming passivation film. Multilayer passivation film on buffer layer didn't produce much change in current efficiency, while the half life time at 1,000 $cd/m^2$ of OLED/LiF/$SiN_x$/E1/$SiN_x$ was 710 hours which showed about 1.5 times longer than OLED/LiF/$SiN_x$/E1 with 498 hours. futhermore, OLED/LiF/$SiN_x$/E1/$SiN_x$/E1/$SiN_x$ with 1301 hours showed about twice than OLED/LiF/$SiN_x$/E1/$SiN_x$ which demonstrated that superior characteristics of life time was obtained in multilayer passivation film. Through the above result, it was suggested using LiF/$SiN_x$ as a buffer layer could reduce the damage from the difference of thermal expansion coefficient in OLED with protective films, and epoxy layer in multilayer passivation film could function like a buffer between $SiN_x$ inorganic layers with relatively large thermal stress.

• Journal of Powder Materials
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• v.20 no.6
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• pp.405-410
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• 2013

During sintering of Ni-electrode multi-layer ceramic capacitors (MLCCs), the Ni electrode often becomes discontinuous because of its lower sintering temperature relative to that of $BaTiO_3$. In an attempt to retard the sintering of Ni, we introduced passivation of the Ni powder. To find the optimal passivation conditions, a thermogravimetric analysis (TGA) was conducted in air. After passivation at $250^{\circ}C$ for 11 h in air, a nickel oxide shell with a thickness of 4-5 nm was formed on nickel nanoparticles of 180 nm size. As anticipated, densification of the compacts of the passivated Ni/NiO core-shell powder was retarded: the starting temperature of densification increased from ${\sim}400^{\circ}C$ to ${\sim}600^{\circ}C$ in a $97N_2-3H_2$ (vol %) atmosphere. Grain growth was also retarded during sintering at temperatures of 750 and $1000^{\circ}C$. When the sintering atmosphere was changed from wet $99.93N_2-0.07H_2$ to wet $99.98N_2-0.02H_2$, the average grain size decreased at the same sintering temperature. The conductivity of the passivated powder sample sintered at $1150^{\circ}C$ for 8 h in wet $99.93N_2-0.07H_2$ was measured to be $3.9{\times}10^4S/cm$, which is comparable with that, $4.6{\times}10^4S/cm$, of the Ni powder compact without passivation. These results demonstrate that passivation of Ni is a viable means of retarding sintering of a Ni electrode and hence improving its continuity in the fabrication of $BaTiO_3$-based multi-layer ceramic capacitors.