• 한국진공학회지
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• 제13권3호
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• pp.120-126
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• 2004

트렌치 소자 제조시 게이트 산화막 성장과 내압 강하의 원인이 되는 식각손상 회복과 코너 영역의 구조를 개선하기 위해 수소 분위기 열처리를 하였다. 열처리시 수소 원자에 의한 환원 반응을 이용하여 표면 에너지가 높은 코너 영역에서는 원자들의 이동에 의한 결정면 재배열, 산화막 측벽에서의 실리콘 원자 적층, 표면 거칠기의 개선 효과 등을 전자현미경 관찰을 통해 확인하였다. 실리콘 원자의 이동을 방해하는 식각 후 잔류 산화막을 수소 가스의 환원성 분위기에서 열처리함으로써 표면 에너지를 낮추는 방향으로 원자의 이동이 일어나 concave 영역, 즉 트렌치 bottom corner에서는 (111), (311) 결정면 재분포 현상이 일어남을 확인할 수 있었다. 또한 convex comer에서의 원자 이동으로 인해 corner 영역에서는 (1111) 면의 step 들이 존재하게 되고 원자 이동에 의해 산화막 측벽에 이르러 이동된 원자의 적층이 일어나며, 이는 열처리시 표면 손상 회복이 원자이동에 의함을 나타낸다. 이러한 적층은 표면 상태가 깨끗할수록 정합성을 띄어 기판과 일치하는 에피 특성을 나타내고 열처리 온도가 높을수록 표면 세정 효과가 커져 식각손상 회복효과가 커지며, 이를 이용하여 이후의 산화막 성장시 균일한 두께를 코너영역에서 얻을 수 있었다

• 한국분말재료학회지
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• 제23권2호
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• pp.91-94
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• 2016

High-quality colloidal CdSe/ZnS (core/shell) is synthesized using a continuous microreactor. The particle size of the synthesized quantum dots (QDs) is a function of the precursor flow rate; as the precursor flow rate increases, the size of the QDs decreases and the band gap energy increases. The photoluminescence properties are found to depend strongly on the flow rate of the CdSe precursor owing to the change in the core size. In addition, a gradual shift in the maximum luminescent wave (${\lambda}_{max}$) to shorter wavelengths (blue shift) is found owing to the decrease in the QD size in accordance with the quantum confinement effect. The ZnS shell decreases the surface defect concentration of CdSe. It also lowers the thermal energy dissipation by increasing the concentration of recombination. Thus, a relatively high emission and quantum yield occur because of an increase in the optical energy emitted at equal concentration. In addition, the maximum quantum yield is derived for process conditions of 0.35 ml/min and is related to the optimum thickness of the shell material.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2018년도 춘계학술대회 논문집
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• pp.55-55
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• 2018

Recently, amorphous oxides such as InGaZnO (IGZO) and InZnO (IZO) as a channel layer of an oxide TFT have been attracted by advantages such as high mobility, good uniformity, and high transparency. In order to apply such an amorphous oxide TFTs to a display, the stability in various environments must be ensured. In the InGaZnO which has been studied in the past, Ga elements act as a suppressor of oxygen vacancy and result in a decreased mobility at the same time. Previous studies have been showed that the InZnO, which does not contain Ga, can achieve high mobility, but has relatively poor stability under various instability environments. In this study, the TFTs using $IZO/Al_2O_3$ double layer structure were studied. The introduction of an $Al_2O_3$ interlayer between source/drain and channel causes superior electrical characteristics and electrical stability as well as reduced contact resistance with optimally perfect ohmic contact. For the IZO and $Al_2O_3$ bilayer structures, the IZO 30nm IZO channels were prepared at $Ar:O_2=30:1$ by sputtering and the $Al_2O_3$ interlayer were depostied with various thickness by ALD at $150^{\circ}C$. The optimal sample exhibits considerably good TFT performance with $V_{th}$ of -3.3V and field effect mobility of $19.25cm^2/Vs$, and reduced $V_{th}$ shift under positive bias stress stability, compared to conventional IZO TFT. The enhanced TFT performances are closely related to the nice ohmic contact properties coming from the defect passivation of the IZO surface inducing charge traps, and we will provide the detail mechanism and model via electrical analysis and transmission line method.

• 한국세라믹학회지
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• 제40권1호
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• pp.77-80
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• 2003

수용액 내에서 질화물 박막의 산화저항성 흡착 피막의 형성을 확인하기 위하여 Si$_3$N$_4$분말 표면의 glycine 흡착 거동을 조사하였다. 염기성분위기에서 glycine은 Si$_3$N$_4$ 분말 표면에 포화 흡착되었으며 이러한 흡착거동은 Si$_3$N$_4$ 박막의 경우에도 동일하게 일어날 것으로 예상되었다. Glycine을 첨가한 CeO$_2$ 슬러리를 제조하고 PH에 따른 Si$_3$N$_4$와 SiO$_2$ 박막의 연마시험을 수행하여 연마율은 감소하고 선택비는 증가하는 것을 확인하였다. 실험에서 얻은 최대 선택비는 pH=12에서 35 이상이었다. 이는 염기성 분위기에서 glycine이 해리하여 막 표면에 화학흡착하고 산화와 용해를 억제함으로써 연마율을 낮추고 선택비 향상에 기여하였기 때문으로 판단된다. 아미노산 계열의 첨가제를 CeO$_2$계 CMP용 슬러리에 적용하는 경우 산화물/질화물 박막의 선택비를 향상시키는데 효과적임을 확인하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.472-472
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• 2011

The capacitive coupled plasma (CCP) has been extensively used in the semiconductor industry because it has not only good uniformity, but also low electron temperature. But CCP source has some problems, such as difficulty in varying the ion bombardment energy separately, low plasma density, and high processing pressure, etc. In this reason, dual frequency CCP has been investigated with a separate substrate biasing to control the plasma parameters and to obtain high etch rate with high etch selectivity. Especially, in this study, we studied on the etching of $SiO_2$ by using the pulse-time modulation in the dual-frequency CCP source composed of 60 MHz/ 2 MHz rf power. By using the combination of high /low rf powers, the differences in the gas dissociation, plasma density, and etch characteristics were investigated. Also, as the size of the semiconductor device is decreased to nano-scale, the etching of contact hole which has nano-scale higher aspect ratio is required. For the nano-scale contact hole etching by using continuous plasma, several etch problems such as bowing, sidewall taper, twist, mask faceting, erosion, distortions etc. occurs. To resolve these problems, etching in low process pressure, more sidewall passivation by using fluorocarbon-based plasma with high carbon ratio, low temperature processing, charge effect breaking, power modulation are needed. Therefore, in this study, to resolve these problems, we used the pulse-time modulated dual-frequency CCP system. Pulse plasma is generated by periodical turning the RF power On and Off state. We measured the etch rate, etch selectivity and etch profile by using a step profilometer and SEM. Also the X-ray photoelectron spectroscopic analysis on the surfaces etched by different duty ratio conditions correlate with the results above.

• Bulletin of the Korean Chemical Society
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• 제35권2호
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• pp.569-574
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• 2014

Inverted bulk hetero-junction polymer solar cells (iPSC) composed of P3HT/PC61BM blends on the ZnO modified with benzoic acid derivatives-based self-assembled monolayers (SAM) are fabricated. Compared with the device using the pristine ZnO, the devices with ZnO surface modified SAMs derived from benzoic acid such as 4-(diphenylamino)benzoic acid (DPA-BA) and 4-(9H-carbazol-9-yl)benzoic acid (Cz-BA) as an electron transporting layer show improved the performances. It is mainly attributed to the favorable interface dipole at the interface between ZnO and the active layer, the eective passivation of the ZnO surface traps, decrease of the work function and facilitating transport of electron from PCBM to ITO electrode. The power conversion eciency (PCE) of iPSCs based on DPA-BA and Cz-BA treated ZnO reaches 2.78 and 2.88%, respectively, while the PCE of the device based on untreated ZnO is 2.49%. The open circuit voltage values ($V_{oc}$) of the devices with bare ZnO and SAM treated ZnO are not much different. Whereas, higher the fill factor (FF) and lower the series resistance ($R_s$) are obtained in the devices with SAMs modification.

• Journal of Electrochemical Science and Technology
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• 제8권1호
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• pp.15-24
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• 2017

A comparative study was performed on the passivating abilities of surface films generated on lithium titanate (LTO; $Li_4Ti_5O_{12}$) electrodes during pre-cycling at two different rates. The surface film deposited at a faster pre-cycling rate (i.e., 0.5 C) is irregularly shaped and unevenly covers the LTO electrode. Owing to the incomplete coverage of the protective film, this LTO electrode exhibits poor passivating ability. Additional electrolyte decomposition and concomitant film deposition occur during subsequent charge/discharge cycles. As a result of the thick surface film, severe cell polarization occurs and eventually causes cell failure. However, pre-cycling the Li/LTO cell at a slower rate (0.1 C) improves cell polarization and capacity retention; this occurs because the surface film uniformly covers the LTO electrode and provides strong passivation. Accordingly, there is no significant film deposition during subsequent charge/discharge cycling. Additionally, self-discharge is reduced during high-temperature storage.

• Corrosion Science and Technology
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• 제15권6호
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• pp.281-289
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• 2016

The effect of nitrogen on the electrochemical corrosion and nanomechanical behaviors of martensitic stainless steel was examined using potentiodynamic polarization and nanoindentation test methods. The results indicate that partial replacement of carbon with nitrogen effectively improved the passivation and pitting corrosion resistance of conventional high-carbon and high- chromium martensitic steels. Post-test observation of the samples after a potentiodynamic test revealed a severe pitting attacks in conventional martensitic steel compared with nitrogen- containing martensitic stainless steel. This was shown to be due to (i) microstructural refinement results in retaining a high-chromium content in the matrix, and (ii) the presence of reversed austenite formed during the tempering process. Since nitrogen addition also resulted in the formation of a $Cr_2N$ phase as a process of secondary hardening, the hardness of the nitrogen- containing steel is slightly higher than the conventional martensitic stainless steel under tempered conditions, even though the carbon content is lowered. The added nitrogen also improved the wear resistance of the steel as the critical load (Lc2) is less, along with a lower scratch friction coefficient (SFC) when compared to conventional martensitic stainless steel such as AISI 440C.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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• pp.33-36
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• 2003

Tungsten is widely used as a plug for the multi-level interconnection structures. However, due to the poor adhesive properties of tungsten (W) on $SiO_2$ layer, the Ti/TiN barrier layer is usually deposited onto $SiO_2$ for increasing adhesion ability with W film. Generally, for the W-CMP (chemical mechanical polishing) process, the passivation layer on the tungsten surface during CMP plays an important role. In this paper, the effect of oxidants controlling the polishing selectivity of W/Ti/TiN layer were investigated. The alumina $(Al_2O_3)$ abrasive containing slurry with 5 % $H_2O_2$ as the oxidizer, was studied. As our preliminary experimental results, very low removal rates were observed for the case of no-oxidant slurry. This low removal rate is only due to the mechanical abrasive force. However, for Ti and TiN with 5 % $H_2O_2$ oxidizer, different removal rate was observed. The removal mechanism of Ti during CMP is mainly due to mechanical abrasive, whereas for TiN, it is due to the formation of metastable soluble peroxide complex.

• 한국전기전자재료학회논문지
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• 제28권10호
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• pp.665-669
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• 2015

We investigated and compared two methods of in-situ oxidation and chemical etching treatment (CET) to remove the boron rich layer (BRL). The BRL is generally formed during boron doping process. It has to be controlled in order not to degrade carrier lifetime and reduce electrical properties. A boron emitter is formed using $BBr_3$ liquid source at $930^{\circ}C$. After that, in-situ oxidation was followed by injecting oxygen of 1,000 sccm into the furnace during ramp down step and compared with CET using a mixture of acid solution for a short time. Then, we analyzed passivation effect by depositing $Al_2O_3$. The results gave a carrier lifetime of $110.9{\mu}s$, an open-circuit voltage ($V_{oc}$) of 635 mV at in-situ oxidation and a carrier lifetime of $188.5{\mu}s$, an $V_{oc}$ of 650 mV at CET. As a result, CET shows better properties than in-situ oxidation because of removing BRL uniformly.