• Title/Summary/Keyword: passivation effect

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Effect of Hydrogen Dilution Ratio on The Si Hetero-junction Interface and Its Application to Solar Cells (수소 희석비에 따른 실리콘 이종접합 계면에 대한 분석 및 태양전지로의 응용)

  • Park, Jun-Hyoung;Myong, Seung-Yeop;Lee, Ga-Won
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.25 no.12
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    • pp.1009-1014
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    • 2012
  • Hydrogenated amorphous silicon (${\alpha}$-Si:H) layers deposited by plasma enhanced chemical vapor deposition (PECVD) are investigated for use in silicon hetero-junction solar cells employing n-type crystalline silicon (c-Si) substrates. The optical and structural properties of silicon hetero-junction devices have been characterized using spectroscopy ellipsometry and high resolution cross-sectional transmission electron micrograph (HRTEM). In addition, the effective carrier lifetime is measured by the quasi-steady-state photocoductance (QSSPC) method. We have studied on the correlation between the order of ${\alpha}$-Si:H and the passivation quality at the interface of ${\alpha}$-Si:H/c-Si. Base on the result, we have fabricated a silicon hetero-junction solar cell incorporating the ${\alpha}$-Si:H passivation layer with on open circuit voltage ($V_{oc}$) of 637 mV.

Local Back Contact Formed by Screen Printing and Atomic Layer Deposited Al2O3 for Silicon Solar Cell

  • Jo, Yeong-Jun;Jang, Hyo-Sik
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.687-687
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    • 2013
  • In rearpoint contact solar cell and the PERC (passivated emitter rear contact) type cell, surfaces were passivated by SiO2 or Al2O3 to increase solar cell efficiency. Therefore, we have investigated the effect of surface passivation for crystalline silicon solarcell using mass-production atomic layer deposited (ALD) Al2O3. The patttern which consists of cylinders with 100um diameter and 5um height was formed by PR patterning on Si (100) substrate and then Al2O3 of about 10nm and 20nm thickness was deposited by ALD. The pattern in 10 nm Al2O3 film was removed by dipping in aceton solution for about 10 min but the pattern in 20 nm Al2O3 film was not. The influences of process temperature and heat treatment were investigated using microwave photoconductance decay (PCD) and Quasi-Steady-State photoconductance (QSSPC). The solar cell process used in this work combines the advantage of using the applicability of a selective deposition associated with a ALD passivation and the use of low-cost screen print for the contacts formation.

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The Effect of SiON Film on the Blistering Phenomenon of Al2O3 Rear Passivation Layer in PERC Solar Cell

  • Jo, Guk-Hyeon;Jang, Hyo-Sik
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.364.1-364.1
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    • 2014
  • 고효율 태양전지로 가기 위해서는 태양전지의 후면 패시베이션은 중요한 역할을 한다. 후면 패시베이션 막으로 사용되는 $Al_2O_3$ 막은 $Al_2O_3/Si$ 계면에서 높은 화학적 패시베이션과 Negative Fixed Charge를 가지고 있어 적합한 Barrier막으로 여겨진다. 하지만 이후에 전면 Metal paste의 소성 공정에 의해 $800^{\circ}C$이상 온도를 올려주게 됨에 따라 $Al_2O_3$ 막 내부에 결합되어 있던 수소들이 방출되어 blister가 생성되고 막 질은 떨어지게 된다. 우리는 blister가 생성되는 것을 방지하기 위한 방법으로 PECVD 장비로 SiNx를 증착하는 공정 중에 $N_2O$ 가스를 첨가하여 SiON 막을 증착하였다. SiON막은 $N_2O$가스량을 조절하여 막의 특성을 변화시키고 변화에 따라 소성시 막에 미치는 영향에 대하여 조사하였다. 공정을 위해 $156{\times}156mm2$, $200{\mu}m$, $0.5-3.0{\Omega}{\cdot}cm$ and p-type 단결정 실리콘 웨이퍼를 사용하였고, $Al_2O_3$ 막을 올리기 전에 RCA Cleaning 실행하였다. ALD 장비를 통해 $Al_2O_3$ 막을 10nm 증착하였고 RF-PECVD 장비로 SiNx막과 SiON막을 80nm 증착하였다. 소성로에서 $850^{\circ}C$ ($680^{\circ}C$) 5초동안 소성하고 QSSPC를 통해 유효 반송자 수명을 알아보았다.

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Effect of Arsenic, Antimony, Bismuth and Lead on Passivation Behavior of Copper Anode (As, Sb, Bi, Pb가 조동의 부동태에 미치는 영향)

  • Ahana, Sung-Chen;Lee, Sang-Mun;Kim, Yong-Hwan;Chung, Won-Sub;Chung, Uoo-Chang
    • Journal of the Korean institute of surface engineering
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    • v.39 no.5
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    • pp.215-222
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    • 2006
  • The passivity behavior of copper anode containing impurities in copper sulfate solution for electrorefining process was studied at several different levels of impurities such as As, Sb, Bi and Pb. The passivity behavior was investigated by electrochemical techniques (galvanostatic, potentiodynamic and cyclic voltammetry tests) and surface analysis (optical microscopy, electron probe microanalysis, scanning electron microscopy). The results were that arsenic, antimony inhibited passivation and bismuth accelerated it and lead containing anode showed different passivity behavior from above anodes. The improved passivity characteristics could be explained by decrease in oxygen content in passivity film which resulted from a reaction among the impurities, oxygen and copper in the anode. The SEM image revealed that arsenic or antimony containing anode exhibited a porous passivity film and bismuth containing anode showed the compact passivity film and lead containing anode had loose passivity film on anode.

Effective Oxygen-Defect Passivation in ZnO Thin Films Prepared by Atomic Layer Deposition Using Hydrogen Peroxide

  • Wang, Yue;Kang, Kyung-Mun;Kim, Minjae;Park, Hyung-Ho
    • Journal of the Korean Ceramic Society
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    • v.56 no.3
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    • pp.302-307
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    • 2019
  • The intrinsic oxygen-vacancy defects in ZnO have prevented the preparation of p-type ZnO with high carrier concentration. Therefore, in this work, the effect of the concentration of H2O2 (used as an oxygen source) on the oxygen-vacancy concentration in ZnO prepared by atomic layer deposition was investigated. The results indicated that the oxygen-vacancy concentration in the ZnO film decreased by the oxygen-rich growth conditions when using H2O2 as the oxygen precursor instead of a conventional oxygen source such as H2O. The suppression of oxygen vacancies decreased the carrier concentration and increased the resistivity. Moreover, the growth orientation changed to the (002) plane, from the combined (100) and (002) planes, with the increase in H2O2 concentration. The passivation of oxygen-vacancy defects in ZnO can contribute to the preparation of p-type ZnO.

Study on the Blocking Voltage and Leakage Current Characteristic Degradation of the Thyristor due to the Surface Charge in Passivation Material (표면 전하에 의한 Thyristor 소자의 차단전압 및 누설전류특성 연구)

  • Kim Hyoung-Woo;Seo Kil-Soo;Bahng Wook;Kim Ki-Hyun;Kim Nam-Kyun
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.55 no.1
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    • pp.34-39
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    • 2006
  • In high-voltage devices such as thyristor, beveling is mostly used junction termination method to reduce the surface electric field far below the bulk electric field and to expand the depletion region thus that breakdown occurs in the bulk of the device rather than at the surface. However, coating material used to protect the surface of the device contain so many charges which affect the electrical characteristics of the device. And device reliability is also affected by this charge. Therefore, it is needed to analyze the effect of surface charge on electrical characteristics of the device. In this paper, we analyzed the breakdown voltage and leakage current characteristics of the thyristor as a function of the amount of surface charge density. Two dimensional process simulator ATHENA and two-dimensional device simulator ATLAS is used to analyze the surface charge effects.

Investigation on the Effect of Corrosion Inhibitor on Removal Rate and Surface Characteristic of Cobalt Chemical Mechanical Polishing (부식 방지제에 따른 코발트의 화학 기계적 연마 특성 및 표면 분석)

  • Eun Su Jung;Sung Gyu Pyo
    • Journal of the Korean institute of surface engineering
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    • v.57 no.3
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    • pp.140-154
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    • 2024
  • As the trend towards miniaturization in semiconductor integration process, the limitations of interconnection metals such as copper, tungsten have become apparent, prompting research into the emergence of new materials like cobalt and emphasizing the importance of studying the corresponding process conditions. During the chemical mechanical polishing (CMP) process, corrosion inhibitors are added to the slurry, forming passivation layers on the cobalt surface, thereby playing a crucial role in controlling the dissolution rate of the metal surface, enhancing both removal rate and selectivity. This review investigates the understanding of the cobalt polishing process and examines the characteristics and behavior of corrosion inhibitors, a type of slurry additive, on the cobalt surface. Among the corrosion inhibitors examined, benzotriazole (BTA), 1,2,4-triazole (TAZ), and potassium oleate (PO) all improved surface characteristics through their interaction with cobalt. These findings provide important guidelines for selecting corrosion inhibitors to optimize CMP processes for cobalt-based semiconductor materials. Future research should explore combinations of various corrosion inhibitors and the development of new compounds to further enhance the efficiency of semiconductor processes.

Temperature Measurement of Flip Chip Joints with Peripheral Array of Solder Bumps (페리퍼럴어레이 플립칩의 온도 분포 특성)

  • Cho Bon-Goo;Lee Taek-Yeong;Lee Jongwon;Kim Jun-Ki;Kim Gangbeom
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.3 s.36
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    • pp.243-251
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    • 2005
  • The distribution of temperature of flip chipped device with peripheral solder bump array was measured with variables, such as the locations and geometries of heater, the size of device, the size of passivation opening. The highest temperature was measured with the larger device, $3.0(mm)\times3.0(mm)$, which has the smallest heater at the center of device and the circular passivation opening. For 2 (watts) power input, the device shows the highest temperature of about $110(^{\circ}C)$. In contrast, the smaller device, $1.5(mm)\times1.8(mm)$, shows that of $90(^{\circ}C)$. In addition to the size effect, the increase of passivation opening size decreased the maximum temperature by about $10(^{\circ}C)$. From the measurement, the temperature of device could be controlled with the size and geometry of heater, the size of device and the size and geometry of passivation opening.

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The protection effects from water vapor permeation of inorganic films prepared by electron-beam evaporation technique (전자-선 증착 기술에 의해 성막된 다양한 무기 박막들의 투습 방지 특성)

  • Ryu, Sung-Won;Rhee, Byung-Roh;Kim, Hwa-Min
    • Journal of the Korean Vacuum Society
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    • v.17 no.1
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    • pp.9-15
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    • 2008
  • Various diatomic inorganic films and their composite films are packed as passivation films covering Ca cells on glass substrates by using an electron-beam evaporation technique. When these Ca cells are exposed to an ambient atmosphere, the water vapor penetrating through the passivation layers is absorbed in the Ca cells, resulting in a gradual progress of transparency in the Ca cells, which can be represented by changes of the optical transmittance in the visible range. Compared with the saturation times for the Ca cells to become completely transparent in the atmosphere, the protection effects of water vapor are estimated for various passivation films. The composite films consisting silicon oxide($SiO_2$) and tin oxide($SnO_2$) or zinc oxide(ZnO) are found to show a superior protection effect of water vapor as compared with diatomic inorganic films. Also, the main factors affecting the permeation of water vapor through the oxide films are found to be the polarizability and the packing density.

Effect of Oxide Film Formation on the Fatigue Behavior of Aluminum Alloy (알루미늄합금 재료의 산화막 형성이 피로거동에 미치는 영향)

  • Kim, Jong-Cheon;Cheong, Seong-Kyun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.36 no.4
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    • pp.421-428
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    • 2012
  • In this study, the effects of surface oxide film formation on the fatigue behavior of 7075-T6 aluminum alloy were analyzed in terms of the corrosion time of the alloy. The aluminum material used is known to have high corrosion resistance due to the passivation phenomenon that prevents corrosion. Aluminum alloys have been widely used in various industrial applications such as aircraft component manufacturing because of their lighter weight and higher strength than other materials. Therefore, studies on the fatigue behavior of materials and passivation properties that prevent corrosion are required. The fatigue behavior in terms of the corrosion time was analyzed by using a four-pointing bending machine, and the surface corrosion level of the aluminum material in terms of the corrosion time was estimated by measuring the surface roughness. In addition, fractographic analysis was performed and the oxide films formed on the material surface were studied by scanning electron microscopy (SEM). The results indicated that corrosion actively progressed for four weeks during the initial corrosion phase, the fatigue life significantly decreased, and the surface roughness increased. However, after four weeks, the corrosion reaction tended to slow down due to the passivation phenomenon of the material. Therefore, on the basis of SEM analysis results, it was concluded that the growth of the surface oxide film was reduced after four weeks and then the oxide film on the material surface served as a protection layer and prevented further corrosion.