• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.08a
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• pp.12-14
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• 2003

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP). process was required for the global planarization of inter-metal dielectric (IMD) layer with free-defect. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Micro-scratches are generated by agglomerated slurry, solidified and attached slurry in pipe line of slurry supply system. It is well known that the presence of hard and larger size particles in the CMP slurries increases the defect density and surface roughness of the polished wafers. In this paper, we have studied. aging effect the of CMP slurry as a function of particle size. We prepared and compared the self-developed silica slurry by adding of abrasives before and after annealing. As our preliminary experiment results, we could be obtained the relatively stable slurry characteristics comparable to original silica slurry in the slurry aging effect.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.9
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• pp.759-764
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• 2003

Recently, CMP (chemical mechanical polishing) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, COO (cost of ownership) and COC (cost of consumables) were relatively increased because of expensive slurry. In this paper, we have studied the possibility of recycle of roused silica slurry in order to reduce the costs of CMP slurry. The post-CMP thickness and within-wafer non-uniformity (WIWNU) wore measured as a function of different slurry composition. As an experimental result, the performance of reused slurry with annealed silica abrasive of 2 wt％ contents was showed high removal rate and low non-uniformity. Therefore, we propose two-step CMP process as follows , In tile first-step CMP, we can polish the thick and rough film surface using remaked slurry, and then, in the second-step CMP, we can polish the thin film and fine pattern using original slurry. In summary, we can expect the saying of high costs of slurry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.37-40
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• 2003

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric (IMD) layer with free-defect. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Micro-scratches are generated by agglomerated slurry, solidified and attached slurry in pipe line of slurry supply system. It is well known that the presence of hard and larger size particles in the CMP slurries increases the defect density and surface roughness of the polished wafers. In this paper, we have studied aging effect the of CMP slurry as a function of particle size. We prepared and compared the self-developed silica slurry by adding of abrasives before and after annealing. As our preliminary experiment results, we could be obtained the relatively stable slurry characteristics comparable to original silica slurry in the slurry aging effect.

• Journal of Advanced Marine Engineering and Technology
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• v.29 no.7
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• pp.779-784
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• 2005

This paper presents the theory of similarity transformations applied to the momentum and energy equations for laminar, forced, external boundary layer flow over a horizontal flat plate which leads to a set of non-linear, ordinary differential equations of phase change material slurry(PCM Slurry). The momentum and energy equation set numerically to obtain the non-dimensional velocity and temperature profiles in a laminar boundary layer are solved. The heat transfer characteristics of PCM slurry was numerically investigated with similar method. It is clarified that the similar solution method of Newtonian fluid can be used reasonably this type of PCM slurry which has low concentration. The data of local wall heat flux and convective heat transfer coefficient of PCM slurry are higher than those of water more than 150$\~$200$\%$, approximately.

• Journal of Advanced Marine Engineering and Technology
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• v.28 no.6
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• pp.962-971
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• 2004

This paper has dealt with thermo-physical properties of microencapsulated phase change material slurry as a latent heat storage material having a low melting point. The measured results of the thermo-physical properties of the test microencapsulated phase change material slurry, those are, density, specific heat, thermal conductivity and viscosity, were discussed for the temperature region of solid and liquid phases of the dispersion material (paraffin). The measurements of these properties of microencapsulated phase change material slurry have been carried out by using a specific-gravity meter, a water calorimeter, a differential scanning calorimeter(DSC), a transient hot wire method and rotating type viscometer, respectively. It was clarified that the additional properties law could be applied to the estimation of the density and specific heat of microencapsulated phase change material slurry and also the Euckens equation could be applied to the estimation of the thermal conductivity of this slurry.

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.85-86
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• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables arc relatively high because of expensive slurry. In this paper, in order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then, $ZrO_2$, abrasives were added in the diluted silica slurry (DSS) in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry (MAS) for the oxide CMP application.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.41-44
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• 2003

As the device feature size is reduced to the deep sub-micron regime, the chemical mechanical polishing (CMP) technology is widely recognized as the most promising method to achieve the global planarization of the multilevel interconnection for ULSI applications. However, cost of ownership (COO) and cost of consumables (COC) were relatively increased because of expensive slurry. In this paper, the effects of different slurry composition on the oxide CMP characteristics were investigated to obtain the higher removal rate and lower non-uniformity. We prepared the various kinds of slurry. In order to save the costs of slurry, the original slurry was diluted by de-ionized water (DIW). And then, alunima abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry.

• Journal of Korean Tunnelling and Underground Space Association
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• v.14 no.3
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• pp.261-275
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• 2012

This paper presents numerical analysis of the mud cake infiltration behaviour which is influenced tunnel face stability during excavation by slurry shield TBM. This analysis method can make useful data to select proper shield TBM type and to set up the construction plan. But effective analysis did not proposed until now. In this paper, we carried out numerical analysis using by $PFC^{2D}$ fluid coupling simulation which is suitable for sandy soil modelling. As a analysis result, we checked that the slurry infiltration behaviour varied with soil permeability and slurry characteristic(specific weight, viscosity etc). This analysis method is helpful safety excavation through anticipating the proper slurry viscosity at the design stage and verifying the slurry quality at initial excavation stage.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05d
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• pp.105-108
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• 2003

CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40 %. So, we focused how to reduce the consumption of raw slurry. In this paper, We have studied the CMP (chemical mechanical polishing) characteristics of slurry by adding of raw alumina abrasive and annealed alumina abrasive. As a experimental results, we obtained the comparable slurry characteristics compared with original silica slurry in the view point of high removal rate and low non-uniformity. Therefore, we can reduce the cost of consumables(COC) of CMP process for ULSI applications.

• Journal of the korean society of oceanography
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• v.37 no.2
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• pp.76-81
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• 2002

I investigated whether US naval pulp wastes (pulverized paper products), which is planned to be dumped into offshore waters, may affect the ecology of major components of marine zooplankton. The presence of slurry (0.6% concentration - wet weight ; wet weight) did not significantly affect the population growth rates of the heterotrophic dinoflagellate Polykrikos kofoidii fed on Lingulodinium polyedrum, but significantly reduced the ingestion rates of the calanoid copepods Acartia spp. on L. polyedrum and those of the copepod Calanus pacificus on Akashiwo sanguinea (previously Gymnodinium sanguineum). However, C. pacificus, originally exposed to 0.6% slurry for 24 hour, can recover its feeding rates when slurry disappears. Therefore, if slurry is diluted quickly due to trubulence after being dumped at 0.6% concentration, its presence may not affect Calanus. Chemicals leached from slurry did not affect the feeding rate of Calanus. Therefore, mechanical interference by slurry on the feeding and/or swimming of copepods may be mainly responsible for the reduction of the ingestion rates.