• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.45-48
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• 2006

Effectiveness and its possibility of ELA (Excimer Laser Annealing) for advanced Si TFT system on insulator are described. Currently, extensive study is carried out to realize an advanced SoG (System on Glass) based on LTPS (Low Temperature Poly-Si) technique. By reducing further the process temperature and by improving the fabrication process of LTPS, addressing TFT circuits for FPD (Flat Panel Display) can be mounted onto a flexible plastic as well as onto a glass substrate. Functional devices on the insulating panels are developed to be formed by using ELA. Although technical issues are remained for the fabrication process, Si transistors including 3D TFT structure formed by ELA is expected as a functional Si system on insulator in the ubiquitous IT era.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.391-394
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• 2003

It is inevitable that reconsideration of the use of lead oxides in the electronics industry be undertaken as long as detrimental effects to the environment remain. To solve this problem, many recent studies on Pb-free compositions for PDP (plasma display panel) dielectric layers and also sealing glass compositions have been made. The present study was conducted to investigate whether the alternative systems for leadfree low firing glasses, detailed below, are available for use in PDP materials. The results suggest that low-melting phosphate glasses would be suitable as an alternative material for the Pb-based dielectric layer, sealants and barrier ribs in PDP.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.1005-1008
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• 2003

We report a new FCOG (flip chip on glass) technique using solder bumps for display packaging applications. The In and Sn solder bumps of 40 ${\mu}m$ pitches were formed on Si and glass substrate. The In and Sn bumps were bonded at 125 at the pressure of 3 mN/bump. The metallurgical bonding was confirmed using cross-sectional SEM. The contact resistance of the solder joint was 65 $m{\Omega}$ which was much lower than that of the joint made using the conventional ACF bonding technique. We demonstrate that the new COG technique using solder bump to bump direct bonding can be applied to advanced LCDs that lead to require higher quality, better resolution, and lower power consumption.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.10
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• pp.99-108
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• 2007

As the structure of a mobile phone becomes thin to catch up with a slim product trend, the reliability of a LCD module is on the rise as a big issue for a product design. A drop test is the most basic and important verification method for a mechanical quality control but it requires much time and cost during a product development process. Thus many manufacturers have considered design guide lines using CAE and simulation for more effective usage of limited resources on the market. In this paper, the Maximum Principle Stress of a LCD glass panel is calculated on the basis of explicit FE Analyses method and input conditions are determined according to the general test standard. The design guideline for reliability improvements are suggested on the basis of the results of FE Analysis.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.214-214
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• 2000

This paper deals with the non contact optical sensor to measure the shape of transparent plates such as glass panel of LCD(Liquid Crystal Display). The conventional methods to obtain the shape or thickness of a transparent plates are contact type sensor such as LVOT(Linear Variable Differential Transformer). Due to the contact between the tip of the sensor and the surface of objects, the tip is abraded. In addition, the high temperature glass casting makes the size of sensor body changed. These reasons makes the sensor degraded. In this paper, to overcome these problem, we proposed a low cost noncontact optical sensor this is composed of the Hologram laser unit of a CD-Pickup and a plastic lens. To evaluate the performance of the proposed optical sensor, a series of experiments were performed for various measurement condition. Based upon observation of the experimental result, the developed sensor shows good result for measuring the shape of transparent plates.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.12
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• pp.1065-1069
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• 2002

The addressing time should be reduced by modifying cell structure and/or driving method in order to replace the dual scan system by single scan and increase the luminance in large ac plasma display panel(PDP). In this paper, the effects of the addressing time was decreased with decreasing thickness of dielectric layer on the front glass and thickness of white dielectric layer on the rear glass. the decreasing rate were 160ns/10$\mu\textrm{m}$ and 270ns/10$\mu\textrm{m}$, respectively Also in case of decreasing the height of barrier rib, addressing time was decreased at the rate of Sons/10$\mu\textrm{m}$.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2019.05a
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• pp.70-71
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• 2019

Glass fiber reinforced concrete (GFRC) is very suitable as a material for free-form concrete panels (FCPs) because of its lightweight, strong, moldable, durable and sustainable properties. GFRC is superior in construction and maintenance compared with materials such as steel, aluminium, titanium, glass and plastic, and is advantageous in cost. However, GFRC is being produced by skilled craftsmen, and still lacks the technology to economically produce high quality FCPs. Currently, there is a technology to automatically and accurately produce FCPs. However, the developed technology can not be applied to the field with simple production technology without production line for mass production. To solve this problem, the purpose of this study is a basic study of production system development of free-form concrete panels. This study introduces the developed FCPs production technology and builds FCP production system for mass production. The results of this study will be used as basic data for the commercial production of FCPs in the future.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.295-298
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• 2003

The principal problems in development of dielectric paste materials for PDP(plasma display panel)are PbO free paste and low melting temperature. We prepared PbO free paste from glasses in the system BaO-ZnO-$B_2O_3-V_2O_5$. DTA, XRD and SEM were used to study and characterize BaO-ZnO-$B_2O_3-V_2O_5$ glasses. PbO free paste developed at this paper has thermal expansion of $74{\times}10^{-7}/^{\circ}C$, DTA transformation point of $460^{\circ}C$, and firing condition of $560^{\circ}C$, 10min.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.64 no.11
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• pp.1587-1591
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• 2015

For a higher definition discharge cell, the method of high speed addressing is necessary. In order to modify the surface charges, the liquefied $TiO_2$ or MgO powder is added on MgO layer in front glass and on the phosphor in rear glass in micro barrier discharge. Both the electro-optical properties and the discharge time lag characteristics are measured from 4 inch. test panel, such as the discharge voltage, current, luminance, luminous efficacy and discharge time lag. As the results, the statistic time lag is improved by about 40 %.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.1
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• pp.179-184
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• 2014

The discharge characteristics of an open dielectric structure were investigated, especially such as a firing voltage and related wall voltage, compared with conventional panel structure based on the Vt close curve measurement in AC plasma display panel. While the front panel of the conventional structure in AC plasma display panel was composed of the glass, electrodes, and dielectric, the open dielectric structure could easily produce the discharge between the scan and the sustain electrodes by erasing the dielectric layer between two electrodes. As the open dielectric structure differ from the conventional structure, various problems were produced when driving with the conventional driving waveform. Especially, due to the changes in the discharge firing characteristics of the open dielectric structure between the scan and the sustain electrodes on the front panel, the conventional reset waveform including the address waveform needed to be modified. In this study, the Vt close curves were measured to compare the discharge firing voltages on three electrodes in the conventional and open dielectric structure and based on the Vt close curve analysis, the modified driving waveform suitable for the open dielectric structure was proposed.