• Title/Summary/Keyword: packaging system

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Perception and Utilization of Food Labels Depending on Educational Experience with the Food Labeling System in Middle School Students (식품표시 관련 교육경험에 따른 중학생들의 식품표시에 대한 인식과 활용실태)

  • Kim, Jung-Hyun
    • The Korean Journal of Community Living Science
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    • v.20 no.1
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    • pp.51-59
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    • 2009
  • This study was performed to investigate the effect of food and nutrition label education on the perception and utilization of nutrition labels on food packaging, and to suggest the importance and necessity of food and nutrition label education in the school curriculum. 811 junior-high school students participated in this study and completed self-administered questionnaires regarding general characteristics, and the perception and utilization of nutrition labels. Knowledge of nutrition labels was tested by 13 questions on the questionnaire. Data was analyzed (using SAS package program) based on the educational experience with nutrition labels. Significant differences in each variable were tested using the $X^2$-test and t-test. Students who had learned about the food and nutrition labeling system had more knowledge of nutrition labels and were more likely to check the nutrition label before purchasing food. In addition, students who had been educated about food and nutrition labels in the school curriculum had a significantly higher understanding and recognition of the nutrition label system. These results suggest that education concerning the food and nutrition label system increased the students' interest in nutrition labels and helped them choose healthy food. Therefore, it is necessary to include an education program about food and nutrition labels in the school curriculum to help students use label information and make healthy dietary choices.

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A High-Speed White-Light Scanning Interferometer for Bump Inspection of Semiconductor Manufacture (반도체 Bump 검사를 위한 백색광 주사 간섭계의 고속화)

  • Ko, Kuk Won;Sim, Jae Hwan;Kim, Min Young
    • Journal of the Korean Society for Precision Engineering
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    • v.30 no.7
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    • pp.702-708
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    • 2013
  • The white-light scanning interferometer (WSI) is an effective optical measurement system for high-precision industries (e.g., flat-panel display and electronics packaging manufacturers) and semiconductor manufacturing industries. Its major disadvantages include a slow image-capturing speed for interferogram acquisition and a high computational cost for peak-detection on the acquired interferogram. Here, a WSI system is proposed for the semiconductor inspection process. The new imaging acquisition technique uses an 'on-the-fly' imaging system. During the vertical scanning motion of the WSI, interference fringe images are sequentially acquired at a series of pre-defined lens positions, without conventional stepwise motions. To reduce the calculation time, a parallel computing method is used to link multiple personal computers (PCs). Experiments were performed to evaluate the proposed high-speed WSI system.

Development of Nipkow Disk for High-Speed Confocal Probe Using Micro-lens and Pinhole Disks (마이크로 렌즈 디스크와 핀홀 디스크를 이용한 고속 공초점용 닙코 디스크 개발)

  • Kim, Gee Hong;Lee, Hyung Seok;Kim, Chang Kyu;Lim, Hyung Jun;Lee, Jae Jong;Choi, Kee Bong
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.23 no.6
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    • pp.636-641
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    • 2014
  • This paper discusses the fabrication process for a Nipkow disk using micro-lens and pinhole disks. The confocal measuring system that uses the Nipkow disk has the advantage in measuring speed, because the Nipkow disk can simultaneously provide confocal images of all pixels in a CCD camera without requiring a lateral scanning unit. A micro-lens configuration, which focuses illumination on a pinhole, overcomes the low optical efficiency of the Nipkow disk system and allows its use in practical applications. This paper describes how to design the Nipkow disk in terms of numerical aperture, particularly for measuring the height of solder bumps in packaging application and for hybrid processes combining mechanical and semiconductor processes.

The package loading equipment development cutting both ends in the process of packaging lumber for improving the working environments (노동강도 제거 및 양끝정렬 균일화를 위한 양끝절단포장적재시스템 개발)

  • Kang, Ji-Ho
    • Proceedings of the Safety Management and Science Conference
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    • 2008.04a
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    • pp.135-147
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    • 2008
  • The package loading process of the lumbering industry is an operation that after a pair of workers bind three or six lumbers into one unit and cut both ends of the lumbers, transports the weight cargo of 30-50kg by one meter, pack and load at a height of 1.2 meters. This package loading process causes lots of noise and wood dust when workers carry out the heavy work as the above. Therefore we developed the monolithic both ends cutting package loading equipment in order to prevent from getting musculoskeletal disease. An loading bar working system of this equipment is improved from pneumatic pressure system to oil pressure system, furnished the newly designed flow dividers, and developed the new system that a both end array is loaded identically. Also we developed the safety equipment of loading bar in order to prevent workers mistake and overload from malfunction during the package loading process. The main cause of job evasion on working place could be solved by preventing the musculoskeletal disease and improving the working environments.

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A Study on Requirements and Application of Quality Process Audit and the Effect of Establishing the Defense Quality Management System (품질공정심사의 요구사항과 적용사례 및 국방품질경영시스템 구축 효과에 대한 연구)

  • Yoon, Cheol Geun;Park, Jong Hun;Lee, Sang Cheon
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.45 no.2
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    • pp.1-11
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    • 2022
  • In this paper, we investigate the requirements of QPA(Quality Process Audit), which is a process quality audit system for secondary defense contractors, compared with those of DQMS(Defense Quality Management System). And evaluate whether the deployment of QPA meets the DQMS certification requirements through the case example of Company H. The evaluation items of QPA are composed of five categories such as Material Management, Incoming Inspection, Manufacturing Process, Product Evaluation, and Packaging Management. The QPA requirements are mainly related to the chapter 7(support) and chapter 8(operation) of DQMS standards. In this view point, QPA can be expected as an effective audit for suppliers preparing for DQMS certification. In the case example, we evaluate the results and effects of improvement due to QPA and compare it with the case of DQMS. QPA can be used as appropriate quality management standards of secondary and tertiary defense contractors and can provide the basis guidelines for the preparation of implementation steps in DQMS certification.

Drug distribution management system based on IoT

  • Liu, Zeliang;Zhang, Chunmei;Peng, Hui;Xu, Qin;Gao, Yubao
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • v.16 no.2
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    • pp.424-444
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    • 2022
  • In hospitals and pharmacies, the distribution of medicines is an important part. Any mistakes, misses, fake medicines and expired medicines can cause medical accidents. With the widespread application of the Internet of Things technology (IoT), traditional drug distribution methods need to be upgraded. This article proposes a drug distribution management scheme based on the Internet of Things technology. In the production of drugs, a flexible RFID tag was printed on the packaging box, which stored a series of information such as drug name, dosage, raw materials, efficacy, production date, expiration date, and manufacturer. The use of a drug distribution management system combined with RFID readers can identify drug information and effectively prevent the occurrence of erroneous, missed, counterfeit, and expired drugs. It can also improve management efficiency, reduce management costs, and control management risks. Through the circuit design and software system development, the test results show that this solution is effective and feasible, the proposed method can achieve the expected results.

Fabrication and Aging effect of Micro OADM using Automatic Alignment System (자동 광축 정렬시스템을 이용한 초소형 광통신용 마이크로 OADM 제작 및 Aging effect)

  • S. K., Kim;Y. H., Seo;D. S., Choi;T. J., Jae;K. H., Whang
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.10a
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    • pp.644-647
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    • 2004
  • Optical add/drop multiplexers (OADMs), one of the new network elements, will play a key role enabling greater connectivity and flexibility in the dense wavelength-division multiplexing (DWDM) networks. The importance of OADMs is that they allow the optical network to be local transmitting/extraction on a wavelength-by-wavelength basis to optimize traffic, efficient network utilization, network growth, and to enhance network flexibility. Also, the automatic assembly system of micro optical filters and fibers is a key technology in the development of optical modules with high functionality. Recently, one of remarkable tends in the development of optical communication industry is the miniaturization and integration of products. In this research, we have developed a system capable of automatic alignment of a film filter and a lensed fiber in order to improve the speed and losses in the optical fiber to filter alignment of optical modules. Using the developed automatic alignment system and silicon optical benches, we have fabricated the micro OADM and measured the insertion loss and aging effect.

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Enhancement of Compatibility and Toughening of Commingled Packaging Film Wastes (혼합 폐포장 필름의 상용성 증진과 강인화)

  • Jeon Byeong-Hwan;Yoon Hogyu;Hwang Seung-Sang;Kim Jungahn;Hong Soon-Man
    • Polymer(Korea)
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    • v.29 no.2
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    • pp.127-134
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    • 2005
  • The relationships among mechanical properties, rheological properties, and morphology by reactive extrusion based on commingled pckaging film wastes contains polypropylene (PP) pckaging film system [PP/polyethylene (PE)/aluminum (Al)/poly(ethylene terephthalate) (PET)] and Nylon packaging film system[Nylon/PE/linear-low density polyethylene (LLDPE)] were investigated to improve the compatibility and toughness of these wastes using various compatibilizers such as ethylene vinylacetate (EVA), styrene-ethylene/butylene-styrene triblock copolymer (SEBS), styrene-ethylene/butylene-styrene-graft-maleic anhydride copolymer (SEBS-g-MA), polyethylene-graft-maleic anhydride (PE-g-MA), polypropylene-graft-maleic anhydride (PP-g-MA) , polyethylene-graft-acrylic acid (PE-g-AA) and polypropylene-graft-acrylic acid (PP-g-AA). Compared with simple melt blend system, the blends showed improvement of about $50\%$ increase in physical properties when SEBS and EVA were added. However, SEBS-g-MA thermoplastic elastomer which is highly reactive with amine terminal group of nylon, resulted in about $200\%$ increase in impact strength. This compatibilization effect resulted from the increase of interfacial adhesion and the reduction of domain size of dispersed phase in PP/Nylon blend system.

Inspection System using CIELAB Color Space for the PCB Ball Pad with OSP Surface Finish (OSP 표면처리된 PCB 볼 패드용 CIELAB 색좌표 기반 검사 시스템)

  • Lee, Han-Ju;Kim, Chang-Seok
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.1
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    • pp.15-19
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    • 2015
  • We demonstrated an inspection system for detecting discoloration of PCB Cu ball pad with an OSP surface finish. Though the OSP surface finish has many advantages such as eco-friendly and low cost, however, it often shows a discoloration phenomenon due to a heating process. In this study, the discoloration was analyzed with device-independent CIELAB color space. First of all, the PCB samples were inspected with standard lamps and CCD camera. The measured data was processed with Labview program for detecting discoloration of Cu ball pad. From the original PCB sample image, the localized Cu ball pad image was selected to reduce the image size by the binarization and edge detection processes and it was also converted to device-independent CIELAB color space using $3{\times}3$ conversion matrix. Both acquisition time and false acceptance rate were significantly reduced with this proposed inspection system. In addition, $L^*$ and $b^*$ values of CIELAB color space were suitable for inspection of discoloration of Cu ball pad.

Effect of Coolants and Metal Bumps on the heat Removal of Liquid Cooled Microchannel System (액랭식 마이크로채널 시스템 내 냉매와 범프의 열 제거 효과에 대한 연구)

  • Won, Yonghyun;Kim, Sungdong;Kim, Sarah Eunkyung
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.2
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    • pp.61-67
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    • 2017
  • As transistor density increases rapidly, a heat flux from IC device rises at fast rate. Thermal issues raised by high heat flux cause IC's performance and reliability problems. To solve these thermal management problems, the conventional cooling methods of IC devices were reached their thermal limit. As a result, alternative cooling methods such as liquid heat pipe, thermoelectric cooler, thermal Si via and etc. are currently emerging. In this paper microchannel liquid cooling system with TSV was investigated. The effects of 2 coolants (DI water and ethylene glycol 70 wt%) and 3 metal bumps (Ag, Cu, Cr/Au/Cu) on cooling performance were studied, and the total heat flux of various coolant and bump cases were compared. Surface temperature of liquid cooling system was measured by infrared microscopy, and liquid flowing through microchannel was observed by fluorescence microscope. In the case of ethylene glycol 70 wt% at $200^{\circ}C$ heating temperature, the total heat flux was $2.42W/cm^2$ and most of total heat flux was from liquid cooling effect.