• Journal of Korean Society of Rural Planning
• /
• v.20 no.3
• /
• pp.191-199
• /
• 2014

The current rural conditions are undergoing the change from the past production-intensive structure to an integral and complex one of producing, processing, selling, touring and lodging owing to the changes of life-style, consumption trend and social environments. The rural area is developing into a community of rural tourism villages to grow into one management system along with the assistance of the government's various supporting projects. Through this, the rural designing has got to play a significant role as one of the factors of the enhancement of competitiveness and the increase of income. Therefore, those previous studies on the variety and possibility of rural development are being employed for the researches which are to develop techniques of branding, marketing and packaging. In particular, the researches for VI (Village Identity), BI (Brand Identity) and designs of landscaping, packaging of agricultural specialties and display stores, which definitely shows that the importance of rural designing, is being paid a lot more attention to. Thus, this study has verified the site commercialization and its effect by developing some practical designing with the focus of package design at rural tourism villages. The Okgye Village in Yoncheon was selected for study subject based on the result of status investigation. This study has analyzed such problems as lack of village identity, non-description of items and their indispensible marks which were seen their designs of village and packaging. The colors of major items and the village image being substituted into the image scale of IRI color were estimated so that the appropriate colors might be selected, along with which the shapes of major items were decided to be motif for the village symbol and design to be created. The designs of such major items as grains, greens and sauces were created with the consideration of the easiness of loading, the continuity of using and the aesthetics. For grains, those outer boxes which are possible for set-packaging and small-sized packaging have been developed. For greens were developed the boxes with the structure of the permeability for the persisten't quality as well as the possibility for packaging small amount. In case of sauces, those outer-boxes equipped with fixing tray were made with the transport-convenience taken into consideration. The sticker-label designs for all those three were also developed which stand for the village identity and are conveniently used in each farm family. When this development was applied at the sites, it was found that the satisfaction and reliability of consumers as well as the satisfaction of farmers were raised along with the increase by more than 30% after the improvement.

• Food Science and Preservation
• /
• v.19 no.1
• /
• pp.67-73
• /
• 2012

This study was carried out to investigate the packaging status of the $Agaricus$ $bisporus$ mushrooms and the benefits of storing them after precooling to improve their distribution system using small packages. The packaging status of the $Agaricus$ $bisporus$ mushrooms was surveyed at a farm, a department store, a wholesale market, and a supermarket from May to September 2011. The packaging materials that were used were PS, carton, PP, LDPE, PLA, and PVC. The harvested $Agaricus$ $bisporus$ mushrooms were precooled at $4^{\circ}C$ for three hours and were then stored at $20^{\circ}C$ for three days. The weight loss rate of the precooled sample was slightly lower than that of the unprecooled sample; conversely, the L value of the precooled sample was higher than that of the unprecooled sample. The ${\Delta}E$ value was lowest in the precooled sample after packaging. The precooling process effectively prolonged the shelf life and enhanced the quality of the$Agaricus$ $bisporus$ mushrooms.

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
• /
• 2002.11a
• /
• pp.181-186
• /
• 2002

• Journal of Welding and Joining
• /
• v.29 no.1
• /
• pp.29-32
• /
• 2011

• Journal of the Microelectronics and Packaging Society
• /
• v.13 no.1 s.38
• /
• pp.57-61
• /
• 2006

Fuel cells are direct current (DC) power generators. They generate electricity through an electrochemical process that converts the energy stored in a fuel directly into electricity. Fuel cells have many benefits, which produce no particulate matter, nitrogen or sulfur oxides. And they have few moving parts and produce little or no noise. When fueled by hydrogen, they yield only heat and water as byproducts. Their wide application can reduce our dependence on fossil fuels and foreign sources of petroleum. This paper is studied on a high efficiency power conditioning system (PCS) applied to the proton exchange membrane fuel cell (PEMFC) generation system. This paper is designed to a novel PCS circuit topology of high efficiency. Some experimental results of the proposed PCS is confirmed to the validity of the analytical results.

• Journal of the Microelectronics and Packaging Society
• /
• v.23 no.2
• /
• pp.29-35
• /
• 2016

With the pace of rapid innovation in technology of IoT (Internet of Things) and smart devices, biometric technology becomes one of the most progressive industries. Recent trends in biometrics show most are focused on embedding biometric sensors in mobile devices for user authentication. Multifactor biometrics such as fingerprint, retina, voice, etc. are considering as identification system to provide users with services more secured and convenient. Here we, therefore, demonstrate some major technologies and market trends of mobile biometric technology with its concerns and issues.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2001.11a
• /
• pp.226-229
• /
• 2001

현재 초소형 정밀기계(MEMS;Microelectromechanical System) 소자의 가장 큰 문제점으로 대두되고 있는 점착현상을 방지하기 위하여 불화유기박막을 증착하였다. Octafluorocyclobutane(C$_4$F$_{8}$)을 소스가스를 PECVD (Plasma Enhanced CVD)와 ICP (Inductively Coupled Plasma)를 이용하여 증착하였다. 여기에 Ar을 첨가하여 플라즈마의 반응성을 높여주었다. 형성된 불화유기박막의 나노트라이볼러지 특성을 살펴보기 위하여 AFM을 통하여 증착시킨 시편의 topography를 살펴보았다. 그리고 박막의 antiadhesion의 정도를 살펴보기 위하여 cantilever와 박막의 표면 사이에 존재하는 interaction force를 측정 하였고 AFM의 force curve mode를 이용하였다 PECVB를 이용하여 증착된 박막은 ICP를 이용한 박막보다 균일하지 못한 박막을 보였으며 attractive force가 강한 것으로 사료된다.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2001.11a
• /
• pp.134-137
• /
• 2001

The cure kinetics of a cycloalipatic epoxy / anhydride / Co(II) system for a no-flow underfill encapsulant, has been studied by using a differential scanning calorimetry(DSC) under isothermal and dynamic conditions over the temperature range of $160^{\circ}C ~220^{\circ}C$. The kinetic analysis was carried out by fitting dynamic/isothermal heating experimental data to the kinetic expressions to determine the reaction parameters, such as order of reaction and reaction constants. Diffusion-controlled reaction has been observed as the cure conversion increases and successfully analyzed by incorporating the diffusion control term into the rate equation. The prediction of reaction rates by the model equation corresponded well to experimental data at all temperature.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2001.11a
• /
• pp.158-160
• /
• 2001

본 연구는 레이저 처리기술에 의한 Li$_2$O-A1$_2$O$_3$-SiO$_2$계 유리의 미세가공과 레이저에 의한 유리의 광활성반응에 관한 것으로서, 1064nm와 355nm의 파장을 갖는 Nd:YAG laser를 유리에 조사하여 유리의 파괴특성 및 광학적변화를 관찰하였다. 1064nm 레이저에 의한 유리의 파괴 부분은 광학현미경과 주사전자현미경(SEM)으로서 파괴특성을 평가하였으며, 355nm 레이저에 의한 유리의 변화는 흡수대역을 측정함으로 그 광학적 특성을 나타내었다. 이와 같은 레이저에 의한 가공은 유리내부의 3차원적인 미세구조물 형성이나, internal waveguide, 또는 광 흡수대역의 변화에 따른 광기록방법으로 응용될 것으로 예상된다.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2001.07a
• /
• pp.95-99
• /
• 2001

Cu is considered as a promising alternative interconnection material to Al-based interconnection materials in Si-based integrated circuits due to its low resistivity and superior resistance to the electromigration. New humping and UBM material systems for solder flip chip interconnection of Cu pads were investigated using electroless-plated copper (E-Cu) and electroless-plated nickel (E-Ni) plating methods as low cost alternatives. Optimally designed E-Ni/E-Cu UBM bilayer material system can be used not only as UBMs for solder bumps but also as bump itself. Electroless-plated E-Ni/E-Cu bumps assembled using anisotropic conductive adhesives on an organic substrate is successfully demonstrated and characterized in this study