Array Lens and Pinhole-based Multi-Confocal Robot Vision System : Micro Bump Inspections in Wafer Level Packaging

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배열 렌즈 및 핀홀 기반 다중 공초점 로봇 비젼 시스템 : 웨이퍼레벨 패키징의 마이크로 범프 검사응용

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Ishihara, M. and Sasaki, H., High-speed surface measurement using a nonscanning multiple-beam confocal microscope, Optical Engineering, 38-6 (1999), 1035-1040 https://doi.org/10.1117/1.602155
Toh, P. S., Confocal Imaging, U.S. Patent 6,838,650, Jan. 4, 2005
Zabolitzky, J., Device for Measuring in Three Dimensions A Topographical Shape of An Object, U.S. Patent 7,446,885, Nov. 4, 2008