• Title/Summary/Keyword: packaging system

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A Case-based Decision Support Model for The Semiconductor Packaging Tasks

  • Shin, Kyung-shik;Yang, Yoon-ok;Kang, Hyeon-seok
    • Proceedings of the Korea Inteligent Information System Society Conference
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    • 2001.01a
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    • pp.224-229
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    • 2001

  • When a semiconductor package is assembled, various materials such as die attach adhesive, lead frame, EMC (Epoxy Molding Compound), and gold wire are used. For better preconditioning performance, the combination between the packaging materials by studying the compatibility of their properties as well as superior packaging material selection is important. But it is not an easy task to find proper packaging material sets, since a variety of factors like package design, substrate design, substrate size, substrate treatment, die size, die thickness, die passivation, and customer requirements should be considered. This research applies case-based reasoning(CBR) technique to solve this problem, utilizing prior cases that have been experienced. Our particular interests lie in building decision support model to aid the selection of proper die attach adhesive. The preliminary results show that this approach is promising.

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Development of Missing Item Detection and Management System under Cell Type Packaging Processes (Cell 방식 포장공정에서의 Missing Item 검사 및 관리 시스템 개발)

  • Kim, Hyeon-Woo;Choi, Hyun-Eui;An, Ho-Gyun;Yoon, Tae-Sung
    • Proceedings of the IEEK Conference
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    • 2009.05a
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    • pp.344-346
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    • 2009

  • Cell type packaging line is more suitable for the products with various models and small quantities like mobile phone or mp3 player than conveyor type packaging line. Cell type packaging line is applicable to package various product models, but it can cause wrong product compositions and missing of items. So, automatic missing item detection system is needed. We designed an missing item detection system with a bar code reader, infrared sensors, and s digital camera. and also developed the programs for sensor data acquisition, image data processing, GUI, and data management.

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evaluation of PBAs packaging density in an ATM switching system (ATM 교환시스템의 PBA 실장밀도 평가와 예측)

  • 이명호;전용일;전병윤;박권철
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.33A no.3
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    • pp.55-64
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    • 1996

  • In this paper, we analyze packaging data of th eprinted board assemblies (PBAs) of an ATM switching system (the first network test bed) by statistical methods and discuss the relation between devices packaging area of a PBA and power consumption by a regression nalysis method. As a result, we evaluate the maximum power consumption of the PBA. And, this paper presents a forecasting mehtod of the packagable maximum power consumption per a PBA when TTL devices are replaced by ASIC or FPGA ones in a PBA. And, we forecast the possibility of packaging ATM switch circuit packs in the near future form a statistical viewpoint. These evaluation and forecasting results can reduce much development cost and time because trial nd error will not be made using these useful data when phase II ATM switching system will be realized in the near future.

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Comparison of Environmental Evaluation for Paper and Plastic Based Mask Packaging (종이 기반과 플라스틱 기반 보건마스크 패키징의 환경영향 비교)

  • Dongho Kang;Youjin Go;Sanghoon Oh;Gohyun Choo;Jisoo Jang;Junhyuk Lee;Jinkie Shim
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.30 no.1
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    • pp.73-83
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    • 2024

  • In this study, environmental evaluation of high barrier coated paper (coating layer/paper) packaging is conducted in comparison with conventional aluminum laminated (PET/VMPET/LLDPE) plastic packaging. The target product for this packaging is a KF94 mask, which requires a high barrier of water and oxygen to maintain the filtration ability of the mask filter. The functional unit of this study is 10,000 mask packaging materials based on a material capable of blocking oxygen (<1 g/m2day) and moisture (<3 g/m2day) for the preservation of KF94 masks. In order to understand the results easily, paper-based mask packaging system divided into 6 stages (pulp, pulping & paper making, calendaring & coating, printing, packing and waste management), while plastic-based mask packaging consists of 5 stages (material production, processing, printing, packing, waste management) In case of paper-based mask packaging, most contributing stage is calendaring & coating, resulting from heat and electricity production. On the other hand, plastic-based mask packaging is contributed more than 30% by material production, specifically due to linear low density polyethylene and purified terephthalic acid production. The comparison results show that global warming potential of paper-based mask packaging has 32% lower than that of plastic-based mask packaging. Most of other impact indicators revealed in similar trend.

  • https://doi.org/10.20909/kopast.2024.30.1.73 인용 PDF