• Journal of the Microelectronics and Packaging Society
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• v.4 no.2
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• pp.1-16
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• 1997

Modern electronic components require its sophistication to meet the stringent requirements which are demanded for high tech industry. In an attempt to meet to such demand miniaturization of the components has been considrably progressed to increase its circuit density. High density of the components can be achieved by an innovative technology of design and manufacturing with functionally improved or new materials such as small bulk devices thick films and thin films circuits (2D). Recently many efforts have been extensively made in the community of the Hybrid Microelectronics through out world. In this paper an approach is introduced in realizing a sophisticated passive circuit for the microelectronics applications by use of hybrid thick/thin films technology. The merit of this technology is discussed and the future trend is speculated.

• Journal of the Korea Convergence Society
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• v.9 no.4
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• pp.15-22
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• 2018

The purpose of this study is to investigate the consumer perception of packaging using big data analysis. This study use text mining to extract meaningful words from text and semantic network analysis to analyze connectivity and propagation trends. Data were collected by dividing the 'packaging(Korean)' and 'packaging(English)'. This study visualized the word network structure of the two key words and classified them into four groups with similar meaning through CONCOR analysis. The group name was specified based on the words constituting the classified group. These groups are a major category of consumers' perception of packaging. Especially cosmetics and design have high frequency of words and high centrality. Therefore it can be expected that the packaging design is perceived as important in the cosmetics industry. This study predicts consumers' perception of packaging so it can be a basis for future research and industry development.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.27 no.1
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• pp.1-8
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• 2021

This study is for the application of functional antibacterial packaging to fresh food. Zeolite/Zinc-polypeptide was coated on PP film at concentrations of 5%, 10%, and 15%, degree of dispersion was verified through FESEM and FT-IR analysis. In addition, the antibacterial and antifungal properties of the films were analyzed according to the control group and the concentration of coating materials. As a result, the degree of dispersion of coating material was irregular but wide, depending on the concentration of Zeolite/Zinc-polypeptide on the surface of PP film. The antibacterial effect against E. coli was over 99.9%, and the growth of R. oryzae was inhibited about 70%. Therefore, it was confirmed that Zeolite/Zinc-polypeptide had antibacterial and antifungal properties against E. coli and R. oryzae even after coated on PP film. In conclusion, Zeolite/Zinc-polypeptide coating film is expected to be effective in preventing corruption and improving the shelf life of fresh food as a functional packaging material. In order to be applied to various fresh foods in the future, storage experiments are additionally required with temperature and humidity conditions according to fresh foods.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.83-88
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• 2003

The optoelectronic characteristics of semiconducto-atomic superlattice as a function of deposition temperature and annealing conditions have been studied. The nanocrystalline silicon/adsorbed oxygen superlattice formed by molecular beam epitaxy(MBE) system. As an experimental result, the superlattice with multilayer Si-O structure showed a stable photoluminescence(PL) and good insulating behavior with high breakdown voltage. This is very useful promise for Si-based optoelectronics and quantum devices as well as for the replacement of silicon-on-insulator (SOI) in ultra-high speed and lower power CMOS devices in the future, and it can be directly integrated with silicon ULSI processing.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.26 no.3
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• pp.165-171
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• 2020

Maintaining steady and low temperature during distribution process is a key technique to inhibit microbial growth, one of the most important factors in determining the shelf life. It is possible to provide high-quality fresh products to consumers only when precise and adequate temperature control is guaranteed throughout the entire distribution process for fresh seafood. This study investigated the shelf-life of packaged fresh flounder (Paralichthys Olivaceus) in order to learn the feasibility of super-chilled distribution of fresh seafood. To estimate the shelf life, weight, number of bacteria such as E. coli, pH, sensory test and volatile basic nitrogen were investigated. As a result of the study, the difference in shelf life of 6 days at the super-chilling temperature (0±1℃) and 1 day at the general refrigeration temperature (8±2℃) (based on volatile base nitrogen) showed the market possibility of super-chilling distribution. Through additional empirical studies such as packaging methods and economic feasibility, it is expected to promote commercialization of super-chilling containers and packaging system developed in the future and secure customer reliability.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.99-105
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• 2022

As the chip size gets smaller, the width of the electrode line is also fine, and the density of interconnections is increasing. As a result, RC delay is becoming a problem due to the difference in resistance between the capacitor layer and the electrical conductivity layer. To solve this problem, the development of electrodes with high electrical conductivity and dielectric materials with low dielectric constant is required. In this study, we developed low dielectric ink by mixing commercial PSR which protect PCB's circuits from external factors and PI with excellent thermal property and low-k characteristics. As a result, the ink mixture of PSR and PI 10:3 showed the best results, with a dielectric constant of about 2.6 and 2.37 at 20 GHz and 28 GHz, respectively, and dielectric dissipation was measured at about 0.022 and 0.016. In order to verify the applicability of future applications, various line-width transmission lines produced on Teflon were evaluated, and as a result, the loss of transmission lines using low dielectric ink mixed with PI was 0.12 dB less on average in S21 than when only PSR was used.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.43 no.1
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• pp.26-33
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• 2020

The plastic waste problem is deepening all over the world. Plastic wastes have serious impacts on our lives as well as environ- mental pollution. The production and use of plastics increases every year, but once they are produced, they usually roam the earth for hundreds or thousands of years to pollute the environment. Although there is growing interest in plastic issues around the world and environmental regulations are being tightened, but no clear solution has yet been found. This study suggests Environmental degradation index (EDI). EDI can help raise consumers' attention to plastic wastes. In addition, EDI will contribute to reduce them in the future. As far as we know, this is the first study. We developed EDI for the confectionery packaging. This study defines four factors that may affect the environment of confectionery packaging: greenhouse gas emissions, energy consumption, methane emissions, and packaging space ratio. Then we quantify the value of each element and compute EDI as the sum of the four component values. In order to evaluate the feasibility of EDI proposed in this study, confectionery-packaging materials distributed in Korea were collected and analyzed. First, the types of confectionery are classified into pies, biscuits, and snacks and basic data was collected. Then the values of the four components were calculated using existing research data on the environment. We can use the proposed EDI to determine how much a product packing affects the environment.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.1-13
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• 2014

The paper gives an overview of the concepts, basic requirements, and trends regarding packaging technologies of power modules in hybrid (HEV) and electric vehicles (EV). Power electronics is gaining more and more importance in the automotive sector due to the slow but steady progress of introducing partially or even fully electric powered vehicles. The demands for power electronic devices and systems are manifold, and concerns besides aspects such as energy efficiency, cooling and costs especially robustness and lifetime issues. Higher operation temperatures and the current density increase of new IGBT (Insulated Gate Bipolar Transistor) generations make it more and more complicated to meet the quality requirements for power electronic modules. Especially the increasing heat dissipation inside the silicon (Si) leads to maximum operation temperatures of nearly $200^{\circ}C$. As a result new packaging technologies are needed to face the demands of power modules in the future. Wide-band gap (WBG) semiconductors such as silicon carbide (SiC) or gallium nitride (GaN) have the potential to considerably enhance the energy efficiency and to reduce the weight of power electronic systems in EVs due to their improved electrical and thermal properties in comparison to Si based solutions. In this paper, we will introduce various package materials, advanced packaging technologies, heat dissipation and thermal management of advanced power modules with extended reliability for EV applications. In addition, SiC and GaN based WBG power modules will be introduced.

• Korea-Australia Rheology Journal
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• v.19 no.3
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• pp.125-131
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• 2007

Biodegradable polymeric blends are expected to be widely used by industry due to their environmental friendliness and comparable mechanical and thermal properties. Poly (lactic acid) (PLA) and poly (butylene succinate) (PBS) are such biodegradable polymers which aim to replace commodity polymers in future applications. Since cost and brittleness of PLA is quite high, it is not economically feasible to use it alone for day to day use as a packaging material without blending. In this study, blends of PLA and PBS with various compositions were prepared by using a laboratory-scale twin-screw extruder at $180^{\circ}C$. Morphological, thermal, rheological and mechanical properties were investigated on the samples obtained by compression molding to explore suitability of these compositions for packaging applications. Morphology of the blends was investigated by scanning electron microscopy (SEM). Morphology showed a clear phase difference trend depending on blend composition. Modulated differential scanning calorimetry (MDSC) thermograms of the blends indicated that the glass transition temperature ($T_g$) of PLA did not change much with the addition of PBS, but analysis showed that for PLA/PBS blend of up to 80/20 composition there is partial miscibility between the two polymers. The tensile strength and modulus were measured by the Instron Universal Testing Machine. Tensile strength, modulus and percentage (%) elongation at break of the blends decreased with PBS content. However, tensile strength and modulus values of PLA/PBS blend for up to 80/20 composition nearly follow the mixing rule. Rheological results also show miscibility between the two polymers for PBS composition less than 20% by weight. PBS reduced the brittleness of PLA, thus making it a contender to replace plastics for packaging applications. This work found a partial miscibility between PBS and PLA by investigating thermal, mechanical and morphological properties.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.21-30
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• 2002

According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.