• Title/Summary/Keyword: packaging automation

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A Study on the Improvement Case of Cosmetic Packaging Process Using ARENA Simulation (아레나 시뮬레이션을 활용한 화장품 포장공정의 개선사례 연구)

  • Lee, Nam-Su;Lee, Jae-Yong;Jo, Eun-Hyeon;Lee, Dong-Hyung
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.43 no.2
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    • pp.72-78
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    • 2020
  • Demand for cosmetics with functionality and eco-friendliness has increased dramatically due to recent aging, well-being trends, and increased interest in beauty. Cosmetics production in 2014 was 8,970.4 billion won, an increase of about 50% compared to 6,014.6 billion won in 2010. In the midst of this, similar companies in intense competition are pursuing differentiated strategies and innovation activities to solve quality, price and delivery problems. In particular, cosmetics packaging work is getting more difficult due to the increasing bill of materials (BOM) and difficult assembly methods. Therefore, in this study, the following problems were identified and suggestions for the improvement of the packaging Many research laboratories such as biotechnology, chemistry, and pharmaceuticals, which are undergoing various studies, are equipped with ready-made laboratory safety equipments such as bio-safety workbenches, aseptic bases, and exhaust workbenches. However, most researchers are disadvantaged in using existing safety equipment. This is because existing safety equipment can not take into account all of the unique characteristics of the research. For this reason, researchers are demanding the development of customized safety equipment that is well suited to their research needs. process of Company C, which is facing difficult situation to respond to the customer 's delivery due to the 52 - hour work week. First, we used the stopwatch to find the difficulty process in the packaging process and show ways to improve it. Second, to improve the efficiency of line balancing in the packaging process, we integrate processes, improve work methods, and perform simple automation. As a result, the prepare loss for replacement was reduced by 1 minute from 5 minutes, resulting in a 23% increase in productivity from 112 ea./hour to 137ea./ hour per person. At this time, the LOB of the packaging process was improved from 70% to 82% by operating one more production line through one person per line, total 9 people saving.

Control of Active Suspension System by Using H$\infty$ Theory

  • Nguyen, Tan-Tien;Nguyen, Van-Giap;Kim, Sang-Bong
    • Transactions on Control, Automation and Systems Engineering
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    • v.2 no.1
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    • pp.1-6
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    • 2000
  • This paper presents a control of active suspension for quarter car model with two degree of freedom by using H$\infty$ method. Absolute velocity of car body is measured for feedback. The system parameter variations are treated with multiplicative uncertainty model. Simulation results show that the H$\infty$ control provides good trade-off between ride quality, suspension packaging and road holding constraints. The experiment with a front wheel suspension system was done to verify the simulation results.

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Wet Etching Characteristics of Cu Surface for Cu-Cu Pattern Direct Bonds (Cu-Cu 패턴 직접접합을 위한 습식 용액에 따른 Cu 표면 식각 특성 평가)

  • Park, Jong-Myeong;Kim, Yeong-Rae;Kim, Sung-Dong;Kim, Jae-Won;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.1
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    • pp.39-45
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    • 2012
  • Three-dimensional integrated circuit(3D IC) technology has become increasingly important due to the demand for high system performance and functionality. In this work, BOE and HF wet etching of Cu line surfaces after CMP were conducted for Cu-Cu pattern direct bonding. Step height of Cu and $SiO_2$ as well as Cu dishing after Cu CMP were analyzed by the 3D-Profiler. Step height increased and Cu dishing decreased with increasing BOE and HF wet etching times. XPS analysis of Cu surface revealed that Cu surface oxide layer was partially removed by BOE and HF wet etching treatment. BOE treatment showed not only the effective $SiO_2$ etching but also reduced dishing and Cu surface oxide rather than HF treatment, which can be used as an meaningful process data for reliable Cu-Cu pattern bonding characteristics.

Characterization and Fabrication of Tin Oxide Thin Film by RF Reactive Sputtering (RF Reactive Sputtering법에 의한 산화주석 박막의 제조 및 특성)

  • Kim, Young-Rae;Kim, Sun-Phil;Kim, Sung-Dong;Kim, Sarah Eun-Kyung
    • Korean Journal of Materials Research
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    • v.20 no.9
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    • pp.494-499
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    • 2010
  • Tin oxide thin films were prepared on borosilicate glass by rf reactive sputtering at different deposition powers, process pressures and substrate temperatures. The ratio of oxygen/argon gas flow was fixed as 10 sccm / 60 sccm in this study. The structural, electrical and optical properties were examined by the design of experiment to evaluate the optimized processing conditions. The Taguchi method was used in this study. The films were characterized by X-ray diffraction, UV-Vis spectrometer, Hall effect measurements and atomic force microscope. Tin oxide thin films exhibited three types of crystal structures, namely, amorphous, SnO and $SnO_2$. In the case of amorphous thin films the optical band gap was widely spread from 2.30 to 3.36 eV and showed n-type conductivity. While the SnO thin films had an optical band gap of 2.24-2.49 eV and revealed p-type conductivity, the $SnO_2$ thin films showed an optical band gap of 3.33-3.63 eV and n-type conductivity. Among the three process parameters, the plasma power had the most impact on changing the structural, electrical and optical properties of the tin oxide thin films. It was also found that the grain size of the tin oxide thin films was dependent on the substrate temperature. However, the substrate temperature has very little effect on electrical and optical properties.

Shape Error and Its Compensation in the Fabrication of Microlens Array Using Photoresist Thermal Reflow Method (Photoresist thermal reflow 방법을 이용하여 제작한 마이크로렌즈 어레이의 형상 관련 오차 및 이에 대한 보정)

  • Kim, Sin Hyeong;Hong, Seok Kwan;Lee, Kang Hee;Cho, Young Hak
    • Journal of the Microelectronics and Packaging Society
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    • v.20 no.2
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    • pp.23-28
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    • 2013
  • Microlens array as basic element of the optical system have been fabricated with various focal length (mainly with long focal length) depending on the purpose of application. In this paper, the microlens arrays were fabricated for observing fluorescent images within sol-gel. Though the fluorescent signal is very low, the microlens array can help obtaining clear images through extracting the fluorescent light from sol-gel. We fabricated microlens arrays with short focal length, which can extract the light using photoresist thermal reflow method. In the experiment, the diameter of microlens decreased after thermal reflow because the solvent within the photoresist was vaporized. Therefore, to compensate the shape error by this reduction, microlens diameter in photomask was altered and spin-coat recipe of photoresist were modified.

Dual-arm Robot for Cell Production of Cellular Phone (휴대폰 셀 생산 공정 적용을 위한 양팔 로봇 개발)

  • Do, Hyun Min;Choi, Taeyong;Park, Chanhun;Park, Dong Il;Kyung, Jin Ho;Kim, Kye Kyung;Kang, Sang Seung;Kim, Joong Bae;Lee, Jae Yeon
    • Journal of the Korean Society for Precision Engineering
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    • v.30 no.9
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    • pp.893-899
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    • 2013
  • Recently, the requirement of automation in the cell production system is increasing due to a decrease of skilled workers who are the key point of a cell production system. This paper proposes a dual-arm robot designed and implemented with consideration of being applied to a cell production line of cellular phone. A specification was derived from the analysis of production process and the consideration of configuration for human-robot cooperation. Design and implementation results of the proposed dual-arm robot were suggested and the feasibility was verified through the demonstration of the proposed robot in some of packaging job of cellular phone.

Development of a Compressor Design System Using Configuration Design Method (편집설계 기법을 이용한 압축기 설계 시스템 개발)

  • Lee, Kang-Soo
    • Korean Journal of Computational Design and Engineering
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    • v.16 no.1
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    • pp.52-60
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    • 2011
  • In this research, we developed a design system for a compressor of an air conditioner using solid CAD system. The developed design system has some characteristics. First, the design system used a configuration design method, so a designer can design a compressor very quickly by using the constructed master libraries. Next, the system was developed to be used not only by engineers but also by salesmen. It is very easy for a user to use it, so a salesman can get a result very easily with the design system. And it has some design modules which give a considerable convenience to designers. Actually, designers are accustomed to the module based design. Then, it has calculation and analysis functions. Volume and mass of a part, and interference between parts are calculated by using the geometric calculation function of a solid CAD system. Also a packaging calculation was implemented to get the smallest space to package compressors for transportation and storing. An interface with a program to analyze the vibration of a compressor was developed in this design system. The design system is similar to CBD (Case-Based Design) system in the view of the whole design process.

Comparison of Distribution Competitiveness of the Mackerel Industry between Korea and Norway (우리나라-노르웨이 고등어산업의 유통 경쟁력 비교 연구)

  • KIM, Dae-Young;KANG, Jong-Ho
    • Journal of Fisheries and Marine Sciences Education
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    • v.27 no.6
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    • pp.1685-1692
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    • 2015
  • This study examines the mackerel distribution systems in Norway which has a leading mackerel industry, and has the purpose of analyzing the effects of structural improvements for the development of Korea's mackerel industry. The landing and distribution status of Korea and Norway's mackerel industry was compared, and the effects of structural improvements was analyzed under the assumption that a number of factors would be improved after an analysis of competitiveness. Special features of the landing and distribution systems of mackerel in Norway are Reduction of transportation costs and transportation time through E-auctions, fish Pumps, freshness management using state-of-the-art equipment and technology such as sea water cooling systems, direct landing at processing factories and Automation through fully automated sorting & packaging systems. The distribution competitiveness of Korea and Norway's mackerel industry was compared through the qualitative review of landing time and the length of distribution channel, distribution costs due to differences in trading method, quality and hygiene management and merchandising. For Korea's mackerel industry to have international competitiveness, they must have efficiency throughout the phases of landing, processing and distribution systems as observed in case of Norway.

MAGFET Hybrid IC with Frequency Output (주파수 출력을 갖는 MAGFET Hybrid IC)

  • Kim, Si-Hon;Lee, Cheol-Woo;Nam, Tae-Chul
    • Journal of Sensor Science and Technology
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    • v.6 no.3
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    • pp.194-199
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    • 1997
  • When voltage or current gets out of the magnetic sensor as it is, we have often faced the problems such as introduction of noise and loss of voltage. In order to reduce these problems, a 2 drain MAGFET operating in the saturation region and fabricated by CMOS process, the system of I/V converter, VCO with operational amplifier, and V/F conversion circuits with Schmitt Trigger are designed and fabricated in one package. The absolute sensitivity of magnetic sensor shows 1.9 V/T and the product sensitivity is $3.2{\times}10^{4}\;V/A{\cdot}T$. The characteristic of V/F conversion is very stabilized and has the value of 190 kHz/T.

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Solder Bump Deposition Using a Laser Beam (레이저빔을 이용한 솔더범프 적층 공정)

  • Choi, Won-Suk;Kim, Jea-Woon;Kim, Jong-Hyeong;Kim, Joo-Han
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.36 no.1
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    • pp.37-42
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    • 2012
  • LIFT (laser-induced forward transfer) is an advanced laser processing method used for selectively transferring micron-sized objects. In our study, this process was applied in order to deposit solder balls in microsystem packaging processes for electronics. Locally melted solder paste could be transferred to a rigid substrate using laser pulses. A thin glass plate with a solder cream layer was used as a donor film, and an IR laser pulse (wavelength = 1070 nm) was used to transfer a micron-sized solder ball to the receptor. Mass balance and energy balance were applied to analyze the shape and temperature profiles of the solder paste drops. The transferred solder bumps had measured diameters of 30-40 ${\mu}m$ and thicknesses of 50 ${\mu}m$ in our experiment. The limits and applications of this method are also presented.