• Journal of Aerospace System Engineering
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• v.5 no.1
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• pp.36-40
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• 2011

In this report US and Korea civil and military simulator certification system is researched, and a plan for improvement is proposed. Korean simulator certification system should adopt FAA's system and improve upon it. Certification criteria should have a basis on FAA certification criteria and add military operation characteristics selectively. Flight test data, used as comparison criteria in certification, should be acquired in package during aircraft development or overseas acquisition. The establishment of certification system is expected to improve external credibility and improve competitiveness in overseas market.

• Journal of the Korea Institute of Military Science and Technology
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• v.14 no.2
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• pp.213-221
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• 2011

Avionics system tends to be designed to have the integrated architecture, and it is getting difficult and complex to verify the flight-critical function because of sophisticated structure. In Korean Utility Helicopter, mission computer acts as the MUX Bus Controller to handle the data from both communication, identification, mission/display and survivability equipment inside Mission Equipment Package and aircraft subsystems such as fuel system and electrical system while it is interfacing with Automatic Flight Control System and Full-Authority Digital Engine Control via ARINC-429 bus. The Flight Displays which is classified as flight-critical function in aircraft is implemented on Primary Flight Display after mission computer processes data from AFCS in order to generate graphics. This paper defines the flight-critical function implemented in mission computer for KUH, and presents the static and dynamic test procedures which is performed on System Integration Laboratory along with Playback Recorder prior to flight test.

• Journal of IKEEE
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• v.18 no.2
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• pp.185-191
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• 2014

In this paper, we have implemented the low temperature fluidity test system with the composited package fuel heater, which has tested the low temperature fluidity and start time to evaluate the performance. Then we have compared the separation and the unified fuel heater type at $+20{\sim}-30^{\circ}C$. Also, we have tested the flowing pressure and start time, power consumption of heater. By comparing the performance with several condition, the experimental results obtain an improved start time of 23% and low temperature fluidity of 19%.

• Journal of Biomedical Engineering Research
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• v.20 no.1
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• pp.21-27
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• 1999

In order to increase our understanding of the injury mechanism in the child occupant, three year old child model was developed using commercial dynamic package DADS. Total 14 segments and 12 joints were used to compose a model in three points belted condition with booster seat. HYGE sled test case was simulated to validate the developed model. Based on the comparison of the model and published test results, the developed model appears to be a resonable representation of the three year old dummy.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.13 no.12
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• pp.2647-2654
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• 2009

In this paper, we propose H.264 Encoder integrating Intra Prediction, Deblocking Filter, Context-Based Adaptive Variable Length Coding, and Motion Estimation encoder module. This designed module can be operated in 440 cycle for one-macroblock. To verify the Encoder architecture, we developed the reference C from JM 9.4 and verified the our developed hardware using test vector generated by reference C. The designed circuit can be operated in 166MHz clock system, and has 1800K gate counts using Charterd 0.18 um process including SRAM memory. Manufactured chip has the size of $6{\times}6mm$ and 208 pins package.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.6
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• pp.575-579
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• 2004

Package reliability test was conducted to investigate the effect of solder paste composition at BGA Package. It was found that the shape and size of the phase form are affected by the processing parameters. The material have used to fill in the via was Sn/36Pb/2Ag and Sn/0.75Cu type solder paste. Sn/36Pb/2Ag and Sn/0.75Cu paste were fabricated on Tape-BGA substrates by screen printing process, and via ball mount data were characterized with variations of dwell time of 85 seconds at reflow peak temperature at 22$0^{\circ}C$ or 24$0^{\circ}C$. The test condition was MRT 30 $^{\circ}C$/60 %RH/96 HR. Failures formed of a ball-off in solder paste process were observed by using a Optical Microscope and SEM(Scanning Electron Microscope). It was concluded that intermetallic layer growth played important roles in increasing solder fatigue strength for addition of Ag composition. The degradation of shear strength of solder composition is discussed.

• Journal of the Korean Institute of Intelligent Systems
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• v.22 no.6
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• pp.694-699
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• 2012

In this paper, semiconductor package inspection results using white light interferometer with large F.O.V., in order to apply semiconductor product inspection process, are shown. Experimental 3D data repeatability test results for the same special bumps of each substrate are shown. Experimental 3D data repeatability test results for all the bumps in each substrate are also shown. Semiconductor package inspection using white light interferometer with large F.O.V. is very important for the fast 3D data inspection in semiconductor product inspection process. This paper is surely helpful for the development of in-line type fast 3D data inspection machine.

• Journal of Applied Reliability
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• v.13 no.3
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• pp.207-216
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• 2013

This paper, we classified LED failure mechanisms that occur due to the delamination and analyzed each of the mechanism that gives the LED PKGs the effect. Usually, the LED is composed of several materials which are LED chips, gold wire, phosphor, epoxy resin, adhesive, reflector and lead frame. These different materials are usually delaminated in trouble conditions which are huge temperature difference, hot and humid or mechanical shocked. When the components are delaminated, a luminance will be lost and moisture be absorbed easily, a thermal resistance be increased attendantly. In this paper, we experimented to investigate failure mechanism of the thermal resistance and failure mechanism of the decrease of luminance that occur due to the delamination. A thermal shock test was performed to reproduce this phenomena by subjecting samples to a cold-hot cyclling process between $-30^{\circ}C$(15min) and $110^{\circ}C$(15min). The samples were inspected at 200, 600 and 1,000 cycles. We measured feature of LED using the spatial analyzer, optical microscope, thermal resistance, photometer, scanning electron microscope (SEM). As a result, the progression of the crack and the thermal resistance and decrease in luminance are proportional to number of thermal shock.

• Nuclear Engineering and Technology
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• v.51 no.4
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• pp.968-976
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• 2019

This paper presents a number of verification case studies for a recently developed sensitivity/uncertainty code package. The code package, ROMUSE (Reduced Order Modeling based Uncertainty/Sensitivity Estimator) is an effort to provide an analysis tool to be used in conjunction with reactor core simulators, in particular the Virtual Environment for Reactor Applications (VERA) core simulator. ROMUSE has been written in C++ and is currently capable of performing various types of parameter perturbations and associated sensitivity analysis, uncertainty quantification, surrogate model construction and subspace analysis. The current version 2.0 has the capability to interface with the Design Analysis Kit for Optimization and Terascale Applications (DAKOTA) code, which gives ROMUSE access to the various algorithms implemented within DAKOTA, most importantly model calibration. The verification study is performed via two basic problems and two reactor physics models. The first problem is used to verify the ROMUSE single physics gradient-based range finding algorithm capability using an abstract quadratic model. The second problem is the Brusselator problem, which is a coupled problem representative of multi-physics problems. This problem is used to test the capability of constructing surrogates via ROMUSE-DAKOTA. Finally, light water reactor pin cell and sodium-cooled fast reactor fuel assembly problems are simulated via SCALE 6.1 to test ROMUSE capability for uncertainty quantification and sensitivity analysis purposes.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.25.1-25.1
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• 2011

Over the past few decades, metallic nanoparticles (NPs) have been of great interest due to their unique mesoscopic properties which distinguish them from those of bulk metals; such as lowered melting points, greater versatility that allows for more ease of processability, and tunable optical and mechanical properties. Due to these unique properties, potential opportunities are seen for applications that incorporate nanomaterials into optical and electronic devices. Specifically, the development of metallic NPs has gained significant interest within the electronics field and technological community as a whole. In this study, gold (Au) pads for surface finish in electronic package were developed by inkjet printing of Au NPs. The microstructures of inkjet-printed Au film were investigated by various thermal treatment conditions. The film showed the grain growth as well as bonding between NPs. The film became denser with pore elimination when NPs were sintered under gas flows of $N_2$-bubbled through formic acid ($FA/N_2$) and $N_2$, which resulted in improvement of electrical conductance. The resistivity of film was 4.79 ${\mu}{\Omega}$-cm, about twice of bulk value. From organic anlayses of FTIR, Raman spectroscopy, and TGA, the amount of organic residue in the film was 0.43% which meant considerable removal of the solvent or organic capping molecules. The solder ball shear test was adopted for solderability and shear strength value was 820 gf (1 gf=9.81 mN) on average. This shear strength is good enough to substitute the inkjet-printed Au nanoparticulate film for electroplating in electronic package.