• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.8
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• pp.654-659
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• 2008

This paper is to suggest a concept design of the permanent magnet type magnetic resonance imaging (MRI) device based on the parameter optimization method. Pulse currents in the gradient coils will introduce the effect of eddy currents in the ferromagnetic material, which will worsen the quality of imaging. In order to equalize the magnetic flux in the MRI device for good imaging, the eddy current effect in the ferromagnetic material must be taken into account. This study attempts to use the design of experiment (DOE) and the response surface method (RSM) for equalizing the magnetic flux of the permanent magnet type MRI device using that the magnetic flux can be calculated directly using a commercial finite element analysis package. As a result, optimal shapes of the pole and the yoke of the PM type MRI device can be obtained. The commercial package, ANSYS, is used for analyzing the magnetic field problem and obtaining the resultant magnetic flux.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.11 no.1
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• pp.11-16
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• 2005

Fruits are subjected to complex dynamic stresses in the transportation environment. During a long journey form the production area to markets, there is always some degree of vibration present. Vibration inputs are transmitted from the vehicle through the packaging to the fruit. Inside, these cause sustained bouncing of fruits against each other and container wall. These steady state vibration input may cause serious fruit injury, and this damage is particularly severe whenever the fruit inside the package is free to bounce, and is vibrated at its resonance frequency. The determination of the resonant frequencies of the fruit may help the packaging designer to determine the proper packaging system providing adequate protection for the fruit, and to understand the complex interaction between the components of fruit when they relate to expected transportation vibration inputs. The first frequency of the pear in packaged freight be stacked in resonance frequency band of the pear packaged freight was increased from the bottom to the top of the stack but the second frequency of that in resonance frequency band of the pear was decreased. This indicated that the high damage score of the pear in bottom tier in vibration test was due to higher acceleration level in resonance frequency band of the pear.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1366-1367
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• 2006

Embedded capacitor technology is one of the effective packaging technologies for further miniaturization and higher performance of electric package systems. So we used the 3D EM simulator for embedded capacitor design in 8-layed PCB(Printed Circuit Board). The designed capacitors value are 2 pF, 5pF, 10 pF, respectly. we investigated characteristics of capacitance - frequency and SRF(Self Resonance Frequency) as changing the rate of hight and width of upper pad of embedded capacitors.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.25 no.3
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• pp.125-130
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• 2019

Shock and vibration inputs are transmitted from the vehicle through the packaging to the fruit. Inside, these cause sustained bouncing of fruits against each other and container wall. These steady state vibration input may cause serous fruit injury, and this damage is particularly severe whenever the fruit inside the package is free to bounce, and is vibrated at its resonance frequency. The determination of the resonance frequencies of the fruit and vegetables may help the packaging designer to determine the proper packaging system providing adequate protection for the fruit, and to understand the complex interaction between the components of fruit when they relate to expected transportation vibration inputs. Instrumentation and technologies are described for determining the vibration response characteristics of the pears for exporting with frequency range from 10 to 200 Hz, sweep rate of 1 octave/min, sweep method of logarithmic up and down and acceleration levels of 0.2, 0.4, 0.6, 0.8 and 1.0 G considering the domestic transportation environment. The resonance frequency of the pears ranged from 49.04 to 87.16 Hz and the amplitude at resonance was between 0.96 and 4.02 G in test frequency band and acceleration level. The resonance frequency and amplitude at resonance frequency band of the pears decreased with the increase of the sample mass. The multiple nonlinear regression equations for predicting the resonance frequency of the pears were developed using the independent variables such as mass, input acceleration.

• The Journal of the Acoustical Society of Korea
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• v.38 no.2
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• pp.200-206
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• 2019

In this paper, the characteristics of receiving voltage sensitivity about acoustic package in towed array sonar is analyzed through the numerical simulation and design of experiments. Simulation results show that the variation of receiving voltage sensitivity is caused by the structural resonance mode shape on baseline acoustic package. The effect of design parameters of the acoustic package are analyzed through the design of experiments to reduce the deviation of receiving voltage sensitivity. A change of hydrophone shield can thickness (t) is the greatest effect on the deviation of receiving voltage sensitivity. As a result of water tank test, the acoustic package derived from the design of experiments has reduced deviation of receiving voltage sensitivity.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.21 no.3
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• pp.91-96
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• 2015

Fruit and vegetables are subjected to complex dynamic stresses in the transportation environment. During a long journey from the production area to customers using parcel delivery service, there is always some degree of vibration present. Vibration inputs are transmitted from the vehicle through the packaging to the fruit. Inside, these cause sustained bouncing of fruits against each other and container wall. These steady state vibration input may cause serous fruit injury, and this damage is particularly severe whenever the fruit inside the package is free to bounce, and is vibrated at its resonance frequency. The determination of the resonance frequencies of the fruit and vegetables may help the packaging designer to determine the proper packaging system providing adequate protection for the fruit, and to understand the complex interaction between the components of fruit when they relate to expected transportation vibration inputs. Instrumentation and technologies are described for determining the vibration response characteristics of the fruits with frequency range 3 to 150 Hz. The resonance frequency of the pear ranged from 53 to 102 Hz and the amplitude at resonance was between 1.08 and 2.48 G. The resonance frequency and amplitude at resonance decreased with the increase of the sample mass, and they were slightly affected by mechanical properties such as bioyield deformation and rupture deformation. Regression analysis was performed among the relatively high correlated parameters from the results of correlation coefficient analysis.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.17 no.4
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• pp.8-12
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• 2003

Characteristics of optical transceiver module in radio frequency(RF) band were investigated with TO-can packaged Fabry-Perot laser diode(FP-LD). R-L-C parameters for equivalent circuit model of the LD were extracted with an impedance analyzer. With this model, impedance matching to the packaged LD could be performed by eliminating inductive components of the leads in the package by using lumped chip capacitors that have opposite reactance, while it shows resonance dip in low frequency band. The resonance dip could be removed using lumped elements for impedance matching by shifting the resonance frequency to the region out of interest.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.15 no.3
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• pp.271-277
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• 2004

A Si(Silicon) MEMS(Micro Electro Mechanical System) package using a doped lossy Si carrier for CPW(Coplanar Waveguide) MMICs(Microwave and Millimeter-wave Integrated Circuits) is proposed in order to reduce parasitic problems of leakage, coupling and resonance. The proposed chip-carrier scheme is verified by fabricating and measuring a GaAs CPW on the two types of carriers(conductor-back metal, doped lossy Si) in the frequency from 0.5 to 40 ㎓. The proposed MEMS package using the lightly doped lossy(15 Ω$.$cm) Si chip-carrier and the HRS(High Resistivity Silicon, 15 ㏀$.$cm) shows the optimized loss and parasitic problems-free since the doped lossy Si-carrier effectively absorbs and suppresses the resonant leakage. The Si MEMS package for CPW MMICs has an insertion loss of only - 2.0 ㏈ and a power loss of - 7.5 ㏈ at 40 ㎓.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.5 s.120
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• pp.563-568
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• 2007

In this paper, the proposed package antenna, which is meander line structure with short pin, is miniaturized to realize RF-SoP at 900 MHz RFID band. The RFID BGA(Ball Grid Array) chip is put in a cavity of LTCC Layers. The coupling and cross talk, which are happen between BGA chip and proposed package antenna, are reduced by faraday cage, which consists of ground and via fences, is realized to enhance the isolation between BGA chip and antenna. The proposed antenna structure is focused on the package level antenna realization at low frequency band. The novel proposed package antenna size is $13mm{\times}9mm{\times}3.51mm$. The measured resonance frequency is 0.893 GHz. The impedance bandwidth is 9 MHz. The maximum gain of radiation pattern is -2.36 dBi.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.96-99
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• 2000

We presents a BGA(Ball Grid Array) package for RF circuit modules and extracted its electrical parameters. We constructed a BGA package of ITS(Intelligent Transportation System) RF module and examined electrical parameters with a HP5475A TDR(Time Domain Reflectometry) equipment and compared its electrical parasitic parameters with PCB RF circuits. With a BGA substrate of 3 $\times$ 3 input and output terminals, we have found that self capacitance of BGA solder ball is 68.6fF, self inductance 146pH, mutual capacitance 10.9fF and mutual inductance 16.9pH. S parameter measurement with a HP4396B Network Analyzer showed the resonance frequency of 1.55㎓ and the loss of 0.26dB. Thus, we may improve electrical performance when we use BGA package structures in the design of RF circuit modules.