• Journal of the Microelectronics and Packaging Society
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• v.18 no.1
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• pp.41-47
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• 2011

Currently, there is widespread adoption of silicon-based technologies for the implementation of radio frequency (RF) integrated passive devices (IPDs) because of their low-cost, small footprint and high performance. Also, the need for high speed data transmission and reception coupled with the ever increasing demand for mobility in consumer devices has generated a great interest in low cost devices with smaller form-factors. The UWB BPF makes use of lumped IPD technology on a silicon substrate CSMP (Chip Scale Module Package). In this paper, this filter shows 2.0 dB insertion loss and 15 dB return loss from 7.0 GHz to 9.0 GHz. To the best of our knowledge, the UWB band-pass-filter developed in this paper has the smallest size ($1.4\;mm{\times}1.2\;mm{\times}0.40\;mm$) while achieving equivalent electrical performance.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.13 no.12
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• pp.2647-2654
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• 2009

In this paper, we propose H.264 Encoder integrating Intra Prediction, Deblocking Filter, Context-Based Adaptive Variable Length Coding, and Motion Estimation encoder module. This designed module can be operated in 440 cycle for one-macroblock. To verify the Encoder architecture, we developed the reference C from JM 9.4 and verified the our developed hardware using test vector generated by reference C. The designed circuit can be operated in 166MHz clock system, and has 1800K gate counts using Charterd 0.18 um process including SRAM memory. Manufactured chip has the size of $6{\times}6mm$ and 208 pins package.

• The Journal of the Convergence on Culture Technology
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• v.8 no.2
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• pp.355-360
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• 2022

In this paper, we present design and developing method for EMS(environment monitoring system) of micro data center. This developing EMS monitors operating environment of micro data center and analyze sensing data through IoT(Internet of things) sensors in real time. Firstly we present configuration method of IoT sensing package and design method EMS hardware platform. Secondly we design data collector software for data collection of IoT sensor with different protocol and develop monitoring software of EMS. The data collector software consists of sensor collector module and collector manager module. Also we design EMS software which has micro service architecture structural style and component based business logic.

• Proceedings of the KIPE Conference
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• 2002.07a
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• pp.158-162
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• 2002

This paper presents a novel 3-phase IGBT module called the SPM (Smart Power Module). This is a new design developed to provide a very compact, low cost, high performance and reliable motor drive system. Several distinct design concepts were used to achieve the highly integrated functionality in a new cost-effective small package. An overall description to the SPM is given and actual application issues such as electrical characteristics, circuit configurations, thermal performance and power ratings are discussed

• ETRI Journal
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• v.31 no.6
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• pp.749-754
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• 2009

The design and performance of an InGaAs/InP transimpedance amplifier and post amplifier for 40 Gb/s receiver applications are presented. We fabricated the 40 Gb/s transimpedance amplifier and post amplifier using InGaAs/InP heterojunction bipolar transistor (HBT) technology. The developed InGaAs/InP HBTs show a cut-off frequency ($f_T$) of 129 GHz and a maximum oscillation frequency ($f_{max}$) of 175 GHz. The developed transimpedance amplifier provides a bandwidth of 33.5 GHz and a gain of 40.1 $dB{\Omega}$. A 40 Gb/s data clean eye with 146 mV amplitude of the transimpedance amplifier module is achieved. The fabricated post amplifier demonstrates a very wide bandwidth of 36 GHz and a gain of 20.2 dB. The post-amplifier module was fabricated using a Teflon PCB substrate and shows a good eye opening and an output voltage swing above 520 mV.

• Journal of the Korean Home Economics Association
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• v.29 no.2
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• pp.77-86
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• 1991

본 연구의 목적은 1) 집단 급식소의 재고 관리 시스템에 관한 자기학습식 Module (Self-instructional Module)을 개발하고, 2) 비동등 통계 실험연구 디자인 (Nonequivalent Control group research design)을 사용하요 자기학습식 재고 관리 시스템 Module의 교육적 효과를 평가하여, 3) 교육기관 및 집단 급식소에서의 교육용 교재로서의 타당성 여부를 검증하고자 함이다. 집단급식소의 재고 관리 시스템에 관한 자기학습식 Module을 개발하기 위해서 현재 미국 전역의 가정대학 내의 식품영양 및 급식경양학과에서 재고 관리에 관련된 교과목을 위하여 채택되어 사용되어지고 있는 주요 교과서들의 내용 분석과 급식경영학 전공 교수 3인의 판단에 기초를 두어 재고관리에 포함되어야 할 내용이 분석되었다. 포함되어져 있는 내용의 목차는 반입(receiving), 저장(storing), 출고(issuing), 재고통제(inventory control), 재고의 자산적 가치(inventory valuation) 및 재고관리 시스템의 자동화(inventory control computer system)등이다. 실험 대상은 Iowa 주립대학에서 급식정보관리 (Foodservice Management Information System) 과목을 수강하였던 88명의 학생이며, 강의를 통해 수업을 받은 통제집단 46명과, 자기 학습식 Module을 사용했던 실험집단 42명으로 구성되었다. 모든 실험 대상에게는 사전검사(Pretest)와 사후검사(posttest)를 실시하였으며 자료의 처리는 SPSS PC Package를 통계법으로 분석하였다. 연구결과는 강의 중심의 통제집단과 자기학습식 Module을 사용했던 실험집단 간의 통제 후 평균 값(posttest adjusted mean score)사이에는 유의적인 차이를 보였으며 (p<0.05), 자기 학습식 Module 그룹에 속해 있던 학생들이 더 높은 통제 후 평균값(adjusted mean score)을 보여 주었다. 그러므로, 이 실험을 통하여, 개발된 집단 급식소 재고관리 시스템에 대한 자기학습식 Module은 학생들에게 재고관리 시스템에 관한 개념과 내용의 습득력을 향상시키는데 있어서 적어도 강의식 교수법과 동일하거나 더나은 교육적 효과를 가져왔다고 판단되었다.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.35-41
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• 2016

Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.

• Journal of Korean Institute of Architectural Sustainable Environment and Building Systems
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• v.12 no.6
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• pp.543-556
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• 2018

Zero energy building was attended for energy consumption minimization by the energy saving technology about building heating and cooling energy consumption and the renewable energy production facility. So the government has supported the zero energy building supply for decreasing green gas emissions. The study about inventory of zero energy building has many proceeding. That inventory need the information of material and equipment. So information of material and equipment about zero energy building must be included for the zero energy building realization. Actually the database of zero energy building inventory construction through the inventory established studies has difficult because the database need many information. In this study, author proposed the test methods and performance reference for upload at inventory. It was constructed to material - module - package. Also the author analyzed the construction of the technical package for zero energy building. The author separated performance category to the energy performance for energy analysis and other performance for confirmed the durability, stability and etc. This performance category proposed the table. The test methods of material and equipment in the passive package and active package proposed to the international standard and korea standard basically korea standard. Also the performance reference was proposed to korea legal standard and various standard by this study results. And the authors proposed the table of performance value, test methods, performance reference. By result of this study, the test methods and performance reference will be used the basic data for inventory of zero energy building.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.11
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• pp.7-13
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• 2002

BSCT 320${\times}$240 IRFPA detector module is implemented, which is a key component in uncooled thermal imaging systems. The detector module consists of two parts, infrared sensitive pixel array and read-out integrated circuit(ROIC). The BSCT 320${\times}$240 pixels are made by laser scribe process and 10-${\mu}m$ micro-bump to satisfy 50-${\mu}m$ pitch and 95-% fill-factor. The ROIC has been designed to electrically address the pixels sequentailly and to improve signal-to-noise ratio with single transistor amplifier, HPF, tunable LPF and clamp circuit. The fabricated hybrid chip of detector and ROIC has been mounted on the TEC built-in ceramic package for more stable operation and tested for lots of electrical and optical properties. The IRFA sample has shown successful properties and met with good results of fill-factor, detectivity and responsivity.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.23-33
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• 1999

A finite element method was employed fort thermal and stress analyses of an IGBT module of 3-phase full bridge. The effect of material parameters such as substrate material, substrate area, solder thickness on the temperature and stress distributions of the module packages has been investigated. Thermal analysis results have also been compared by setting of boundary conditions such as equivalent heat transfer coefficient or constant temperature at a base metal surface of the package. The increase of ceramic substrate area up to 3 times does little contribution to the reduction(8.9%) of thermal resistance, while contributed a lot to the reduction(60%) of thermal stress. Thicker solder resulted in higher thermal resistance but did slightly reduced thermal stresses. It is revealed by the stress analysis that maximum stress was induced at the region of copper pads which are bonded with ceramic substrate.