• Proceedings of the International Microelectronics And Packaging Society Conference
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• 1999.12a
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• pp.9-43
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• 1999

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.10
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• pp.31-39
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• 2004

This paper illustrates the noise characteristics under chip's core operations according to types of packages and modules for DDR DRAM For analyzing this, the impedance profiles and power noises are analyzed with DRAM chips having commercial TSOP package and commercial FBGA package on TSOP-based DIMM and FBGA-based DIMH In controversy with common concepts, we find that the noise-isolation characteristics of FBGA package are more weak and sensitive on transferred noises than those of the TSOP package. In addition, the simulated results show that the decoupling capacitor locations of modules are more important to control the self and transfer noise characteristics than the lead inductance of the packages. Therefore, satisfying the target spec of the noise suppression and isolation can be achieved through the design of power distribution systems only with considering not only the package types but also the whole module system.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.67 no.2
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• pp.63-69
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• 2018

In this paper, the operation principle of a bi-directional switch type resonant AC link snubber circuit was described, together with the practical design procedure, which employs in the proposed power module bridge package type resonant AC link snubber. The novel prototype of power module bridge package type resonant AC link snubber-assisted voltage type sinewave soft switching PWM inverter using IGBT power module was demonstrated herein. It was verified that both the auxiliary power switches in this resonant AC link snubber circuit and the main power switches commutate under the condition of soft switching commutation principle. In addition, the power losses of the new soft switching inverter treated here were analyzed by implementing the experimental data of the IGBT and diode v-i characteristics in addition to switching power loss characteristics into our original computer simulation software developed by the authors. Then, the voltage type sinewave soft switching PWM inverter was high efficiency than that of hard switching PWM inverter, along with performance operation waveforms. In the future, the comparative feasibility study of power module bridge type resonant AC link snubber and its related soft switching inverter in addition to the other types resonant snubber assisted soft switching inverter should be done from a practical point of view.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.11 s.114
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• pp.1105-1111
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• 2006

In this paper, using low-temperature co-fired ceramic(LTCC) based system-in-package(SiP) technology, a very compact power amplifier LTCC module was designed, fabricated, and then characterized for 60 GHz wireless transmitter applications. In order to reduce the interconnection loss between a LTCC board and power amplifier monolithic microwave integrated circuits(MMIC), bond-wire transitions were optimized and high-isolated module structure was proposed to integrate the power amplifier MMIC into LTCC board. In the case of wire-bonding transition, a matching circuit was designed on the LTCC substrate and interconnection space between wires was optimized in terms of their angle. In addition, the wire-bonding structure of coplanar waveguide type was used to reduce radiation of EM-fields due to interconnection discontinuity. For high-isolated module structure, DC bias lines were fully embedded into the LTCC substrate and shielded with vias. Using 5-layer LTCC dielectrics, the power amplifier LTCC module was fabricated and its size is $4.6{\times}4.9{\times}0.5mm^3$. The fabricated module shows the gain of 10 dB and the output power of 11 dBm at P1dB compression point from 60 to 65 GHz.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.1
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• pp.107-112
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• 2009

This paper describes design and fabrication issues of the SiP(System in Package) one-chip for a portable digital broadcasting receiver. It includes RF tuner chip, demodulator chip and passive components for the receiver system. When we apply the SiP one-chip technology to the broadcasting receiver, the system board size can be reduced from $776mm^2$ to $144mm^2$. SiP one-chip has an advantage that the area reduces more 81% than separated chips. Also the sensitivity performance advances -1dBm about 36 channels in the RF weak electric field, the power consumption reduces about 2mW and the C/N keeps on the same level.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.491-492
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• 2008

According to high-speed large scale integration trend of Memory module product, many type of noises, such a reflection, cross-talk simultaneous switching noise, occur on the Package PCB and they make the deterioration of memory module's performance and reliability. As module products have more high efficiency, Hardware of test board and socket has to be considered In test of the high-speed Memory Module. we mainly focused on improvement of Signal integrity Using the High Frequency Test socket that we invented

• Journal of the Korea Society of Computer and Information
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• v.21 no.11
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• pp.59-64
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• 2016

In this paper, we design and implement an Application based on android platform, which can control arduino Prime Smart Car using Bluetooth communication. This Application consist of Bluetooth communication module, manual mode module, and line-tracer mode module. In the Bluetooth communication module, it checks the on/off status of Smartphone Bluetooth. If Bluetooth status is off, it activates Bluetooth, selects the corresponding device from Bluetooth device list, and connects with a pair. In order to reduce coding time, we implements Bluetooth communication using inherited class from android Bluetooth package. In the manual mode module, it implements six direction moving button and stop button, which can control arduino Prime Smart Car. In the line-tracer mode module, it implements Prime Smart Car with self-driving function using TCRT5000 sensor. And moving button and stop button is disabled.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2444-2448
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• 2007

The multi channel of DDI which is the core part of the LCD-TV has been propelled. When multi channel in DDI is introduced, it brings a thermal problem because of the increased power. To solve the thermal problem of the DDI it needs to be investigated each at the package level and module level. It is important to extract the junction temperature(Tj) of DDI clearly from the system level. The objective of this research is to construct a compact model. The compact model is to reduce LCD module including DDI. When the compact model is used, it will be able to easily handle the boundary condition and accurately predict the temperature. Consequently, the temperature of DDI can be calculated easily at the system level. Through this research,we also proposed the cooling plan of DDI for a protection of overheating. The cooling plan was utilized in DDI design.

• Proceedings of the Optical Society of Korea Conference
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• 2003.02a
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• pp.298-299
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• 2003

As the demand for high frequency(bandwidth) optical module of reduced cost is increased, there are considerable needs for low cost／ high reliable optical packaging method. In order to meet these requirements, the researches using silicon optical bench(SiOB) technology have been developed as one of the leading technology. In this paper, we discuss optical package using one aspherical lens mounted on SiOB by passive alignment, and present the reliability data for the optical module, which are temperature cycling between 40C and +85C, and high temperature storage 85C(unbiased), 2000hour.

• Journal of the Semiconductor & Display Technology
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• v.15 no.4
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• pp.1-9
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• 2016

The warpage on mobile phone camera packages occurs due to the CTE(Coefficient of Thermal Expansion) mismatch between a thin silicon die and a substrate. The warpage in the optical instruments such as camera module has an effect on the field curvature, which is one of the factors degrading the optical performance and the product yield. In this paper, we studied the effect of die bonding epoxy on the package and optical performance of mobile phone camera packages. We calculated the warpages of camera module packages by using a finite element analysis, and their shapes were in good agreement showing parabolic curvature. We also measured the warpages and through-focus MTF of camera module specimens with experiments. The warpage was improved on an epoxy with low elastic modulus at both finite element analysis and experiment results, and the MTF performance increased accordingly. The results show that die bonding epoxy affects the warpage generated on the image sensor during the packaging process, and this warpage eventually affects the optical performance associated with the field curvature.