• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.30 no.3
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• pp.30-38
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• 2016

In this research, a 6W white LED package with a Glass Remote Phosphor was developed to improve the life of an LED package. The Glass Remote Phosphor was fabricated by the Phosphor in Glass (PiG) method, wherein phosphor YAG:Ce was mixed with glass frit and then heat treated. A paste with 75wt.% of a phosphor substance and 25wt.% glass frit was coated on a glass substrate two times using the screen-printing technique and heat-treated at $800^{\circ}C$ ; this structure gave a luminous efficacy of 136.1lm/W, color rendering index of 74Ra, and color temperature of 5,342K, thus satisfying the requirements as a light source for lighting. Moreover, an IES LM-80 accelerated life test was conducted on the same LED package for 6,000h in order to estimate the L70 lifetime based on IES TM-21. The results showed guaranteed lifetimes of 213,000h at $55^{\circ}C$, 245,000h at $85^{\circ}C$, and 209,000h at $95^{\circ}C$.

• The KIPS Transactions:PartB
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• v.9B no.2
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• pp.245-254
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• 2002

IC package marking inspection system using machine vision locates and identifies the target elements from input image, and decides the quality of marking by comparing the extracted target elements with the standard patterns. This paper proposes an adaptive multi-level thresholding (AMLT) method which is suitable for a series of operations such as locating the target IC package, extracting the characters, and detecting the Pinl dimple. It also proposes a dynamic matching unit selection (DMUS) method which is robust to noises as well as effective to catch out the local marking errors. The main idea of the AMLT method is to restrict the inputs of Otsu's thresholding algorithm within a specified area and a partial range of gray values. Doing so, it can adapt to the specific domain. The DMUS method dynamically selects the matching unit according to the result of character extraction and layout analysis. Therefore, in spite of the various erroneous situation occurred in the process of character extraction and layout analysis, it can select minimal matching unit in any environment. In an experiment with 280 IC package images of eight types, the correct extracting rate of IC package and Pinl dimple was 100% and the correct decision rate of marking quality was 98.8%. This result shows that the proposed methods are effective to IC package marking inspection.

• The Journal of Industrial Distribution & Business
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• v.11 no.1
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• pp.29-38
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• 2020

Purpose: Understanding which product types of overseas travel (free independent travel vs. package travel) consumers will choose is one of the key issues of marketing and consumer behavior in travel agency management. Prior studies on overseas travel type preferences mainly focused on comparing regional differences (e.g., Asian vs. Westerner, or Korean vs. Australian, or Korean vs. Japanese, or American, French, Italian vs. Japanese) influencing the choice of overseas travel type. Another researchers focused on comparing cultural differences (e.g., individualism vs. collectivism, or individualistic culture vs. collectivistic culture), subcultural difference (e.g., acculturation; Koreans living in Republic of Korea vs. Koreans living in Australia), travel lifestyle, and socio-demographics (e.g., age, gender, income level, education level, marital status, occupation etc.). However, there are few studies that identify individual psychological differences (i.e., individual psychological differences within the same culture) influencing the choice of overseas travel type. Self-construal is a psychological factors that greatly influences choice behavior. The purpose of this study was to examine the role of self-construal as an antecedent variable influencing choice of overseas travel product type. Research design, data and methodology: To achieve the purpose of this study, the questionnaire survey method was used. Self-construal items composed of independent self-construal items and interdependent self-construal items. Product types of overseas travel were free independent travel (FIT) type versus package travel type. In this study, the correlation coefficient between independent self-construal and interdependent self-construal was nonsignificant. It meant that the relationship between independent self-construal and interdependent self-construal was orthogonal. Therefore it was analyzed that independent self-construal and interdependent self-construal separately. Reliability analysis, factor analysis, and logistic regression analysis (controlling gender and age) was used as the data analysis method. Results: According to the results of this study, the stronger independent self-construal, the more preference for the free independent travel type rather than package travel, and the stronger interdependent self-construal, the more preference for the package travel type rather than free independent travel. Conclusions: Self-construal is an antecedent variable influencing the choice of travel type. Travel agencies must consider the consumer's self-construal (independent self-construal vs. interdependent self-construal) before planning and designing overseas travel products.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.10
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• pp.889-895
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• 2002

Wafer level packaging is gain mote momentum as a low cost, high performance solution for RF-MEMS devices. In this work, the flip-chip method was used for the wafer level packaging of RF-MEMS devices on the quartz substrate with low losses. For analyzing the EM (electromagnetic) characteristic of proposed packaging structure, we got the 3D structure simulation using FEM (finite element method). The electric field distribution of CPW and hole feed-through at 3 GHz were concentrated on the hole and the CPW. The reflection loss of the package was totally below 23 dB and the insertion loss that presents the signal transmission characteristic is above 0.06 dB. The 4-inch Pyrex glass was used as a package substrate and it was punched with air-blast with 250${\mu}{\textrm}{m}$ diameter holes. We made the vortical feed-throughs to reduce the electric path length and parasitic parameters. The vias were filled with plating gold. The package substrate was bonded with the silicon substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within 0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.

• Journal of the Korea Society of Computer and Information
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• v.13 no.7
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• pp.199-205
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• 2008

The centralized conference model has advantage of conference management and control. however it's scalability has been limited as performance degrades largely with increasing number of conference users. So new distributed conference models which improve scalability of centralized conference model have been suggested recently. In the distributed conference model. as conference users exceed a predefined maximum number, a new conference server is added to the conference dynamically. In this paper, We have proposed a new method which increases efficiency of conference event package processing that primary conference server should charge in the distributed conference environment. The primary conference server exchanges informations with each secondary conference servers and conference users by using conference event package. And from the conference information database it selects SIP(Session Initiation Protocol) UA(User Agent) which will share notification to the conference users, and transfers lists to each conference servers. The conference servers make the selected UAs share processing of conference event package, so loads of SIP signal processing decrease, and improve scalability of distributed conference model. The performance of our proposed model is evaluated by experiments.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.59-66
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• 2018

In this paper, we analyzed the usefulness of single-structured printed circuit board (PCB) modeling by using numerical analysis to model the PCB structure applied to a package for semiconductor purposes and applying modeling assuming a single structure. PCBs with circuit layer of 3rd and 4th were used for analysis. In addition, measurements were made on actual products to obtain material characteristics of a single structure PCB. The analysis results showed that if the PCB was modeled in a single structure compared to a multi-layered structure, the warpage analysis results resulting from modeling the PCB structure would increase and there would be a significant difference. In addition, as the circuit layer of the PCB increased, the mechanical properties of the PCB, the elastic coefficient and inertia moment of the PCB increased, decreasing the package's warpage.

• The Sea:JOURNAL OF THE KOREAN SOCIETY OF OCEANOGRAPHY
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• v.5 no.3
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• pp.177-185
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• 2000

The adjoint method is a method of data assimilation to improve the model results by seeking for model parameters that minimize the cost function and satisfy the governing equations of a model simultaneously. An adjoint package was set up for the two-dimensional linear tidal model and was applied to an idealized domain for an optimal estimation of the open boundary conditions. The assimilating data were selected from the results of forward modeling. Attention is paid on the response of the adjoint package to weighting parameters, the importance of initial estimates of model parameters and the applicability of the adjoint package to the case with varying depth. A procedure to determine optimal weight is presented based on the relationships between weights and other factors.

• Journal of Power System Engineering
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• v.18 no.1
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• pp.32-37
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• 2014

In this study, the optimum design process of an indoor package air-conditioner (PAC) was implemented by Taguchi method. The goal of this study is to obtain the best set condition of each control factor composing of an indoor PAC. The number of revolution of a double inlet sirocco fan installed in an indoor PAC was measured by the orthogonal array of $L_{18}(2^3{\times}3^4)$ and analysed by using the-smaller- the-better characteristic among the static characteristic analyses. As a result, the optimum condition of an indoor PAC was found as a set of when the cost of production, assembling and working conditions were considered. Moreover, the number of revolution of a double-inlet sirocco fan used for an optimum condition was reduced about 8.5% more than that of a standard condition for the target flowrate of $18.5m^3/min$.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.21 no.10
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• pp.883-889
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• 2011

The brand sound of vehicle diesel engine is recently one of the important advantage strategies in the automotive company. Because various noise components masked under high frequency level can be audible in quieter driving situation. Many researches have been carried out for subjective and objective assessments on vehicle sounds and noises. In particular, the interior sound quality has been one of research fields that can give high quality feature to vehicle products. Vehicle interior noise above 500 Hz is usually controlled by sound package parts. The materials and geometries of sound package parts directly affect on this high frequency noise. This paper describes the sound quality evaluation method for the vehicle diesel engine noise to establish objective criteria for sound quality assessment. Considering the sensitivity of human hearing to impulsive sounds such as diesel noise, the human auditory mechanism was simulated by introducing temporal masking in the time domain. Furthermore, each of the human auditory organs was simulated by computer codes, providing reasonable analytical explanations of typical human hearing responses to diesel noise. This method finally provides the sound quality index of vehicle diesel engine noise that includes high frequency intermittent offensive sounds caused by impacting excitations of combustion and piston slap.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.9 s.240
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• pp.1209-1216
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• 2005

Three methods for design sensitivity such as numerical differentiation, analytical method and semi-analytical method have been developed for the last three decades. Although analytical design sensitivity analysis is exact, it is hard to implement for practical design problems. Therefore, numerical method such as finite difference method is widely used to simply obtain the design sensitivity in most cases. The numerical differentiation is sufficiently accurate and reliable for most linear problems. However, it turns out that the numerical differentiation is inefficient and inaccurate because its computational cost depends on the number of design variables and large numerical errors can be included especially in nonlinear design sensitivity analysis. Thus semi-analytical method is more suitable for complicated design problems. Moreover semi-analytical method is easy to be performed in design procedure, which can be coupled with an analysis solver such as commercial finite element package. In this paper, implementation procedure for the semi-analytical design sensitivity analysis outside of the commercial finite element package is studied and computational technique is proposed, which evaluates the pseudo-load for design sensitivity analysis easily by using the design variation of corresponding internal nodal forces. Errors in semi-analytical design sensitivity analysis are examined and numerical examples are illustrated to confirm the reduction of numerical error considerably.